RF-Star RF-83SH User manual

RF-83SH SX1276 868 MHz & 915 MHz LoRa
Module
Version 1.3
Shenzhen RF-star Technology Co., Ltd.
Jan. 19th, 2020

RF-83SH
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RF-star LoRa Module List
Chipset
Model
Antenna
Dimension
(mm)
Package
Frequency
(MHz)
TX Power
(dBm)
Range
(Km)
Photo
ASR6501
RF-
AL42UH
Half-hole
13.9  13.9
Half-hole
433
22
3
ASR6505
RF-
AL42UHB2
Half-hole
18.3  18.3
Half-hole
433
22
3
SX1278
RF-42UH
Half-hole /
IPEX
16  26
Half-hole
433
18
3/4.5
RF-42UP
SMA
21.1  36
DIP
433
18
3
RF-42SH
Half-hole
16  16
Half-hole
433
18
3
RF-43UH
Half-hole /
IPEX
25  40.3
Half-hole
433
27
10
Contact Me
RF-43UP
SMA
24  43
Half-hole
433
27
10
RF-43SH
Half-hole
25  40
DIP
433
27
10
Contact Me
SX1276
RF-82UH
Half-hole /
IPEX
16  26
Half-hole
868
915
18
3/4.5
RF-82UP
SMA
21.1  36
DIP
868
18
3
RF-82SH
Half-hole
16  16
Half-hole
915
18
3
RF-83UH
Half-hole /
IPEX
25  40.3
Half-hole
868
27
10
Contact Me
RF-83UP
SMA
24  43
DIP
915
27
10
Contact Me
RF-83SH
Half-hole
25  40
Half-hole
868
27
10
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to jump to buy modules.

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1 Device Overview
1.1 Description
RF-83SH module is a LoRa spread spectrum module, with operating frequency of 868 MHz ~ 893 MHz & 900 MHz ~
931 MHz, based on the Semtech SX1276. It is a wireless SPI transceiver module with 3.3 V TTL level output. RF-star
LoRa module features with ultra-long range spread spectrum communication, concentrated power density, high
interference immunity ability, confidentiality, and significantly lower current consumption. The communication interface
of RF-83SH is SPI, therefore, the MCU driver or a dedicated SPI debug tool is recommended to use.
1.2 Key Features
•LoRaTM Modem
•168 dB maximum link budget
•RF output power: +30 dBm
•+14 dBm high efficiency PA and an integrated PA
•Programmable bit rate up to 300 kbps
•High sensitivity: down to -149 dBm
•Bullet-proof front end: IIP3 = -11 dBm
•Excellent blocking immunity
•Low RX current of 9.9 mA, 200 nA register retention
•Fully integrated synthesizer with a resolution of 61 Hz
•(G)FSK, (G)MSK, LoRaTM and OOK modulation
•Built-in bit synchronizer of clock recovery
•Preamble detection
•127 dB Dynamic Range RSSI
•Automatic RF Sense and CAD with ultra-fast AFC
•Packet engine up to 256 bytes with CRC
•Built-in temperature sensor and low battery indicator
•Power supply: 3.3 V ~ 5.2 V
•Recommended voltage: 5.0 V
•Transmission distance: up to 10000 m
•Compact size: 40.0 mm x 25.0 mm
1.3 Applications
•Automated meter reading
•Home and building automation
•Wireless alarm and security systems
•Industrial monitoring and control
•Long range irrigation system

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-83SH
1.5 Part Number Conventions
The part numbers are of the form of RF-83SH where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-83SH
RF
8
Company Name
RF-STAR
-
3
Communication Interface Mode
SPI
TX Power
30 dBm
S
Frequency Range
862 MHz ~ 893 MHz & 900 MHz ~ 931 MHz
H
Package Mode
Half-hole Mode
32.0 MHz
SX1276
Matching
Matching
Half-hole
Interface
PA DCDC
SX1276 LDO
TCXO
LDO
LNA LDO
LNA
PA
Switching
Low-pass
Filter
Power
Interfac
e
Others

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Table of Contents
RF-star LoRa Module List ............................................................................................................................................... 1
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
Table of Figures................................................................................................................................................................... 5
Table of Tables..................................................................................................................................................................... 5
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings................................................................................................................................................ 9
3.3 Current Consumption ....................................................................................................................................... 9
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
4.4 Reference Design of the Connection between MCU and Module................................................13
4.5 Basic Operation................................................................................................................................................13
4.5.1 Hardware Design ................................................................................................................................13
4.5.2 Software Written..................................................................................................................................14
4.6 Trouble Shooting..............................................................................................................................................14
4.6.1 Unsatisfactory Transmission Distance........................................................................................14
4.6.2 Vulnerable Module..............................................................................................................................15
4.6.3 High Bit Error Rate .............................................................................................................................15

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4.7 Electrostatics Discharge Warnings ...........................................................................................................15
4.8 Soldering and Reflow Condition.................................................................................................................16
4.9 Optional Packaging.........................................................................................................................................17
5 Revision History ............................................................................................................................................................18
6 Contact Us.......................................................................................................................................................................19
Table of Figures
Figure 1. Functional Block Diagram of RF-83SH.......................................................................................... 3
Figure 2. Part Number Conventions of RF-83SH ......................................................................................... 3
Figure 3. Pin Diagram of RF-83SH .................................................................................................................... 7
Figure 4. Photos of RF-83SH .............................................................................................................................11
Figure 5. Recommended PCB Footprint of RF-83SH (mm)...................................................................11
Figure 6. Schematic Diagram of RF-83SH....................................................................................................12
Figure 7. Reference Design of the Connection between MCU and Module ....................................13
Figure 8. Recommended Reflow for Lead Free Solder............................................................................16
Figure 9. Optional Packaging Mode.................................................................................................................17
Table of Tables
Table 1. Parameters of RF-83SH........................................................................................................................ 6
Table 2. Pin Functions of RF-83SH.................................................................................................................... 7
Table 3. Recommended Operating Conditions of RF-83SH..................................................................... 9
Table 4. Handling Ratings of RF-83SH............................................................................................................. 9
Table 5. Current Consumption of RF-83SH .................................................................................................... 9
Table 6. Temperature Table of Soldering and Reflow................................................................................16

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-83SH
Chipset
Semtech SX1276
Supply Power Voltage
3.3 V ~ 5.2 V, recommended to 5.0 V
Frequency
862 MHz ~ 893 MHz, typical: 868 MHz
900 MHz ~ 931 MHz, typical: 915 MHz
Transmit Power
+10.0 dBm ~ +30.0 dBm
Receiving Sensitivity
-149 dBm
Communication Interface
SPI
SPI Communication Level
3.3 V
Crystal
32 MHz
Package
SMT Packaging
Dimension
40.0 mm x 25.0 mm x (2.3 ± 0.1) mm
Module Package Mode
Half-hole interface
Operating Humidity
10% RH ~ 90% RH (no condensation)
Storage Humidity
10% RH ~ 90% RH (no condensation)
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-45 ℃ ～ +90 ℃
Transmission Distance
10000 m (Test conditions: sunny weather, empty, +30 dBm, antenna gain
of 5 dBi, height of above 2.5 m, air speed of 2.4 kbps)
Air Rate
@ LoRa
0.018 kbps ~ 37.5 kbps
@ (G)FSK
1.2 kbps ~ 300 kbps
Operating
Current @ 5 V,
868 MHz
Tx Current
526 mA @ 30 dBm
Rx Current
15.0 mA
Sleep Current
4.2 μA
Operating
Current @ 5 V,
915 MHz
Tx Current
387 mA @ 30 dBm
Rx Current
15.0 mA
Sleep Current
4.5 μA

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-83SH
2.3 Pin Functions
Table 2. Pin Functions of RF-83SH
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
-
Ground
2
DIO5
DIO5
I/O
Digital I/O, software configured
3
DIO4
DIO4
I/O
Digital I/O, software configured
4
DIO3
DIO3
I/O
Digital I/O, software configured
5
DIO2
DIO2
I/O
Digital I/O, software configured

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6
DIO1
DIO1
I/O
Digital I/O, software configured
7
DIO0
DIO0
I/O
Digital I/O, software configured
8
RES
NRESET
I/O
Reset trigger input
9
GND
GND
-
Ground
10
GND
GND
-
Ground
11
VCC
VCC
P
Power supply: 3.3 V to 5.2 V, recommended to 5.0 V
12
SCK
SCK
I
SPI clock input
13
MISO
MISO
O
SPI data output
14
MOSI
MOSI
I
SPI data input
15
NSS
NSS
I
Module chip select pin for starting SPI communication
16
TXEN
TXEN
I
RF switch pin control, high in RX, low in TX.
17
RXEN
RXEN
I
RF switch pin control, high in TX, low in RX.
18
GND
GND
-
Ground
19
RF
RF
O
Antenna port
20
GND
GND
-
Ground
21
GND
GND
-
Ground
22
GND
GND
-
Ground

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-83SH
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
3.3
5.0
5.2
V
Operating Temperature
/
-40
+25
+85
℃
3.2 Handling Ratings
Table 4. Handling Ratings of RF-83SH
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-45
+25
+90
℃
Human Body Model
HBM, class2
2000
4000
V
Moisture Sensitivity Level
2
Charged Device Model
Class 3
500
1000
V
3.3 Current Consumption
The current consumption characteristics of this module are categorized into different running modes. The overall product
level current consumption is averaged over time on different power modes the device runs on. The peripheral circuitry’s
current consumption also adds in.
Table 5. Current Consumption of RF-83SH
Symbol
Description
Conditions
Min.
Typ.
Max.
Unit
IDDSL
Supply current in Sleep mode
0.2
1
A
IDDIDLE
Supply current in Idle mode
RC oscillator enabled
1.5
A
IDDST
Supply current in Standby mode
Crystal oscillator enabled
1.6
1.8
mA
IDDFS
Supply current in Synthesizer mode
FSRx
5.8
mA
IDDR
Supply current in Receive mode
LnaBoost Off, band 1
10.8
mA
LnaBoost On, band 1
11.5
mA
Bands 2 & 3
12.0
mA

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IDDT
Supply current in Transmit mode with
impedance matching
RFOP = +20 dBm, on
PA_BOOST
120
mA
RFOP = +17 dBm, on
PA_BOOST
87
mA
RFOP = +13 dBm, on
RFO_LF/HF pin
29
mA
RFOP = +7 dBm, on
RFO_LF/HF pin
20
mA

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-83SH
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-83SH (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-83SH

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4.4 Reference Design of the Connection between MCU and Module
Figure 7. Reference Design of the Connection between MCU and Module
4.5 Basic Operation
4.5.1 Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer

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or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 433 MHz physical layer, for
example: USB 3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
4.5.2 Software Written
1. The driving mode of this module is completely the same as SX1278 / SX1276, and users can fully operate according
to the SX1278 / SX1276 user manual.
2. DIO0, DIO1, DIO2, DIO3, DIO4, and DIO5 are configurable I/O ports for various functions. For details, see the
SX1278 user manual. Those ports can be left unused if not used.
3. RST, TXEN, and RXEN pins must be connected. RST controls the reset of the chipset, and TXEN and RXEN pins
control the RF switch.
4. Pay attention to good grounding with a large area of ground and small power supply ripple. It is recommended to
add filter capacitors as close as possible to the VCC and GND pins of the module.
5. The SPI communication rate should not be set too high, and 1 Mbps is recommended.
6. When transmitting, set TXEN pin to high level and RXEN pin to low level. While receiving, set RXEN pin to high level
and TXEN pin to low level. Before turning off, set TXEN and RXEN pins to low level.
7. The register configuration can be re-initialized when the chipset is idle to obtain higher stability.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The

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performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell.
4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The clock waveform on SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line
should not be too long.
3. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
4. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.

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4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 8. Recommended Reflow for Lead Free Solder

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4.9 Optional Packaging
Figure 9. Optional Packaging Mode
Note: Default tray packaging.

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5 Revision History
Date
Version No.
Description
Author
2018.12.28
V0.9
The initial version is released.
Aroo Wang
2019.01.27
V1.0
Update module picture.
Aroo Wang
2019.03.06
V1.1
Add part number conventions.
Aroo Wang
2019.06.05
V1.2
Add the Chapter of Application, Implementation, and
Layout
Aroo Wang
2019.06.19
V1.3
Update the description.
Aroo Wang
2020.01.19
V1.3
Add LoRa module list.
Sunny Li
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.szrfstar.com.

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6 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: Room 601, Block C, Skyworth Building, High-tech Park, Nanshan District, Shenzhen, Guangdong, China
Tel.: [phone]
Chengdu Branch:
Add.: No. B3-03, Building No.1, Incubation Park, High-Tech District, Chengdu, Sichuan, China, 610000
Tel.: [phone]
Email: [e-mail], [e-mail]
Web.: www.szrfstar.com