RF-Star RSBRS02ABR(I) User manual

RSBRS02ABR(I)
Bluetooth 5.0 Low Energy Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
May 26th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RSBRS02ABR(I) is a compact size, cost-effective Bluetooth low energy module based on RF-star 256 KB flash SoC
RS02A1-B chip with super low power consumption, good noise reduction, better sensitivity, robust transmission distance,
and high reliability. The module integrates a 16 MHz crystal, an RF matching filter, a power filter, and a meander line
inverted-F PCB antenna (RSBRS02ABR) or an IPEX connector (RSBRS02ABRI). It supports BLE stack v5.0 and is
preprogrammed with an easy-to-integrate serial interface communication protocol.
1.2 Key Features
•RF Features
- Bluetooth 5.0 low energy, support 2 Mbps data
rate and extended ADV payload
•Frequency: 2402 MHz ~ 2480.0 MHz
•TX power: -20.0 dBm ~ +5.0 dBm
•Receiving Sensitivity: -94 dBm @ 1 Mbps
•CPU
- 32-bit ARM Cortex-M0+ @ 48 MHz
- Single-cycle multiplier
- 65 μA/MHz running from SRAM
- Serial wire debug
•Memory
- ROM 80 KB
- SRAM 36 KB, 4 KB Cache
- Flash 256 KB
- 32B eFuse
•Wide Operation Range
- Power supply range: 2.3 V ~ 3.6 V
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Rich Peripherals
- 11 general purpose I/Os. Function IO any-route
support
- 2 x UART with CTS/RTS
- SPI with master/slave configurable
- I2C with master/slave configurable
- 7816 T-0 master interface
- 4-channel 9-bit general purpose ADC
- 2-channel DMA
- Infra-red generator
- 4 x PWM
- Quadrature decoder (QDEX) interface
- 12 MHz clock output
- 2-channel DMA
- 5 x 16-bit timer
- Real timer clock (RTC)
- Watchdog
•Transmission range:
- RSBRS02ABR: 130 m
- RSBRS02ABRI: 190 m (@external PCB antenna)
•Dimension:
- RSBRS02ABR: 15.2 mm x 11.2 mm x 1.5 mm
- RSBRS02ABRI: 15.2 mm x 11.2 mm x 1.7 mm
•RSBRS02ABR Certificates:
- FCC
- SRRC
- RoHS
- Reach
•RSBRS02ABRI Certificates:
- RoHS

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1.3 Applications
•Smart toys
•Gaming controller
•E-lock
•Smart lighting
•Electronic shelf label
•Location-based service
•Medical devices
•Fitness equipment
•Environmental sensor nodes
•Passive keyless entry (PKE)
•Phone accessories
•Health-care equipment
•Energy harvesting
•Thermometer
•Human input devices
•Wearable
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RSBRS02ABR(I)
1.5 Part Number Conventions
The part numbers are of the form of RSBRS02ABR(I) where the fields are defined as follows:
Figure 2. Part Number Conventions of RSBRS02ABR(I)
RS02A1-B
GPIOs
SWC
SWD
16.0 MHz
PCB Antenna /
IPEX Conenctor
Low Pass
Filter & ANT
Matching
Power EMI Filter
Reset
Power Supply
2.3 V ~ 3.6 V
RS
B
RS02AB
R(I)
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
RF-star RS02A1-B
Version Number
R: The R Version
RI: The IPEX Version

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 2
1.5 Part Number Conventions.............................................................................................................................. 2
Table of Contents................................................................................................................................................................ 3
2 Module Configuration and Functions ...................................................................................................................... 5
2.1 Module Parameter............................................................................................................................................. 5
2.2 Module Pin Diagram ......................................................................................................................................... 6
2.3 Pin Functions....................................................................................................................................................... 6
3 Specifications ................................................................................................................................................................... 8
3.1 Absolute Maximum Ratings ........................................................................................................................... 8
3.2 Handling Ratings................................................................................................................................................ 8
3.3 RF Characteristics............................................................................................................................................. 8
4 Application, Implementation, and Layout............................................................................................................... 9
4.1 Module Photos.................................................................................................................................................... 9
4.2 Recommended PCB Footprint...................................................................................................................... 9
4.3 Schematic Diagram.........................................................................................................................................10
4.4 Reference Design............................................................................................................................................11
4.5 Antenna................................................................................................................................................................11
4.5.1 Antenna Design Recommendation ..............................................................................................11
4.5.2 IPEX Connector Specification........................................................................................................12
4.6 Basic Operation of Hardware Design ......................................................................................................13
4.7 Trouble Shooting..............................................................................................................................................14
4.7.1 Unsatisfactory Transmission Distance........................................................................................14
4.7.2 Vulnerable Module..............................................................................................................................14
4.7.3 High Bit Error Rate .............................................................................................................................14
4.8 Electrostatics Discharge Warnings ...........................................................................................................15
4.9 Soldering and Reflow Condition.................................................................................................................15
5 Optional Package Specification ..............................................................................................................................17

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6 Certification .....................................................................................................................................................................19
6.1 RoHS ....................................................................................................................................................................19
6.2 FCC.......................................................................................................................................................................20
6.3 SRRC ...................................................................................................................................................................20
6.4 REACH ................................................................................................................................................................21
7 Revision History ............................................................................................................................................................22
7 Contact Us.......................................................................................................................................................................23

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2 Module Configuration and Functions
2.1 Module Parameter
Table 1. Parameters of RSBRS02ABR(I)
Chipset
RS02A1-B
Supply Power Voltage
2.3 V ~ 3.6 V, recommended to 3.3 V
Modulation
GFSK
Frequency
2402 MHz ~ 2480.0 MHz
Transmit Power
-20.0 dBm ~ +5.0 dBm (typical: 0 dBm)
Receiving Sensitivity
-94 dBm @ 1 Mbps PHY
GPIO
11
Crystal
16 MHz
ROM
80 KB
SRAM
36 KB, 4 KB Cache
Flash
256 KB
Package
SMT Packaging (1.27-mm half-hole pitch stamp stick)
Frequency Error
±24 kHz
Dimension
RSBRS02ABR: 15.2 mm x 11.2 mm x 1.5 mm
RSBRS02ABRI: 15.2 mm x 11.2 mm x 1.7 mm
Type of Antenna
RSBRS02ABR: PCB antenna
RSBRS02ABRI: IPEX connector
Transmission Range in Open Air
RSBRS02AA: 130 m (@ PCB antenna)
RSBRS02AI: 190 m (@ external PCB antenna)
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
RSBRS02ABR RSBRS02ABRI
Figure 3. Pin Diagram of RSBRS02ABR(I)
2.3 Pin Functions
Table 2. Pin Functions of RSBRS02ABR(I)
Pin
Name
Chip Pin
Pin Type
Remarks
1
GND
GND
Ground
Ground
2
VCC
VCC
VCC
Power supply: 2.3 V ~ 3.6 V, Recommended to 3.3 V
3
P02
P02
I/O
4
P03
P03
I/O
5
RST
RST
RESET
Reset, active low
6
P04
P04
I/O
7
SWC
SWC
SWCLK
Connect J-Link SWCLK
8
SWD
SWD
SWDIO
Connect J-Link SWDIO
9
NC
NC
NC
10
P05
P05
I/O
11
P08
P08
I/O
12
P10
P10
I/O

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13
NC
NC
NC
14
P21
P21
I/O
15
P22
P22
I/O
16
P24
P24
I/O
17
P23
P23
I/O
18
P11
P11
I/O

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3 Specifications
3.1 Absolute Maximum Ratings
Table 3. Absolute Maximum Ratings
Identification
Condition
Min.
Typ.
Max.
Unit
Source & IO
Battery mode
2.3
3.3
3.6
V
Operating Temperature
/
-40
25
+85
℃
Environmental Hot Pendulum
/
-20
20
℃ / Min
3.2 Handling Ratings
Table 4. Handling Ratings of RSBRS02ABR(I)
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
3
Charged Device Model
±250
V
3.3 RF Characteristics
When measured on the RSBRS02ABR(I) with T A = 25 ℃, V BAT = 3.3 V with DC/DC, the channel of 39th (2442 MHz)
enabled unless otherwise noted.
Table 5. Table of RF Test
Test Item
Parameter
Test Value
Unit
Transmitter
Power
0.42
dBm
Frequency Deviation
2.168
kHz
Receiver
Sensitivity (8% PER)
-93.5
dBm

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4 Application, Implementation, and Layout
4.1 Module Photos
RSBRS02ABR RSBRS02ABRI
Figure 4. Photos of RSBRS02ABR(I)
4.2 Recommended PCB Footprint
RSBRS02ABR

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RSBRS02ABRI
Figure 5. Recommended PCB Footprint of RSBRS02ABR(I) (mm)
4.3 Schematic Diagram
Figure 6. Schematic Diagram of RSBRS02ABR(I)

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4.4 Reference Design
Figure 7. Reference Design of RSBRS02ABR(I)
4.5 Antenna
4.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.

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Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5.2 IPEX Connector Specification
RSBRS02ABRI module is integrated the IPEX version 1 antenna seat, the specification of the antenna seat is as follows:
Figure 9. Specification of Antenna Seat

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The specification of the IPEX wire end is as follows:
Figure 10. Specification of IPEX Wire
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if
the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close to
the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,

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high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended to
stay away from the module according to the strength of the interference. If circumstances permit, appropriate isolation
and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for example,
USB 3.0.
4.7 Trouble Shooting
4.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performances of ground absorption and reflection of radio waves will be poor when the module is tested close
to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
4.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged if
the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.

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4.8 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 6. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 11. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.
Figure 12. Default Package by Tray

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Figure 13. Package by Tape & Reel

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6 Certification
6.1 RoHS
RoHS Report No.: U05102200529615E
Figure 14. RoHS certificate of RSBRS02ABR
Certificate number: DTI20200627C
Figure 15. RoHS of RSBRS02ABRI