RF-Star SimpleLink RF-BM-2652P3 User manual

RF-BM-2652P3
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RF-BM-2652P3 CC2652P SimpleLink™ Multiprotocol
2.4 GHz Wireless Module with Integrated Power
Amplifier and Flash
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Feb. 02nd, 2021
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

RF-BM-2652P3
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1 Device Overview
1.1 Description
RF-BM-2652P3 is an RF module based on TI lower-power CC2652P SoC, which is a multiprotocol 2.4 GHz wireless
module supporting Thread, Zigbee®, Matter, Bluetooth®5.3 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects
(6LoWPAN), proprietary systems, including the TI 15.4-Stack (2.4 GHz), and concurrent multiprotocol through a
Dynamic Multiprotocol Manager (DMM) driver. It integrates a 48 MHz crystal and a 32.768 kHz crystal, 352 KB of
in-system Programmable Flash and an external flash of 1 MB, 256 KB ROM, 8 KB of Cache SRAM, 80 KB of ultra-low
leakage SRAM. Its ARM®Cortex®-M4F core application processor can operate at an extremely low current at flexible
power modes. And the module enables long-range and low-power applications using integrated +20 dBm high-power
amplifier with best-in-class transmit current consumption at 85 mA. It features small size, robust connection distance,
and rigid reliability.
1.2 Key Features
•RF Section
- Bluetooth 5.3 Low Energy
- ZigBee, Thread, Matter
- IEEE 802.15.4
- IPv6-nabld smart objects (6LoWPAN)
- Proprietary systems
- SimpleLinkTM TI 15.4-Stack (2.4 GHz)
- Dynamic Multiprotocol Manager (DDM) driver
•TX power: up to +20 dBm with temperature
compensation
•Excellent receiver sensitivity
- -105 dBm for Bluetooth 125 kbps (LE coded PHY)
- -100 dBm for 802.15.4 (2.4 GHz)
•Wide Operation Range
- 1.8 V to 3.8 V single power supply
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Microcontroller
- Powerful 48 MHz ARM®Cortex®-M4F processor
- EEBMC CoreMark®score: 148
- 2-pin cJTAG and JTAG debugging
- Support OTA upgrade
•Memory
- 352 KB of in-system programmable flash +
external 1 MB flash
- 256 KB of ROM for protocols and library
functions
- 8 KB of cache SRAM (Alternatively available as
general-purpose RAM)
- 80 KB of ultra-low leakage SRAM. The SRAM is
protected by parity to ensure high reliability of
operation.
•Ultra-low power sensor controller with 4 KB of
SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
•Rich Peripherals
- 23 GPIOs, digital peripheral pins can be routed
to any GPIOs
- 4 × 32-bit or 8 × 16-bit general-purpose timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2 × comparators with internal reference DAC (1
× continuous time, 1 × ultra-low power)
- Programmable current source
- 2 × UART
- 2 × SSI (SPI, Microwave, TI)
- I2C

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- I2S
- Real-time clock (RTC)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
•Security Enablers
- AES 128-bit and 256-bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
•External system
- On-chip buck DC/DC converter
•Dimension: 24.0 mm × 16.0 mm × 2.1 mm
•Certificates:
- FCC
- CE
- RoHS
1.3 Applications
•2400 to 2480 MH ISM and SRD systems with
down to 4 kHz of receive bandwidth
•Home and building automation
•Building security system
•HVAC system
•Gateway
•IP network camera
•Fire safety system
•Smart grid
•Automatic meter reading
•Industrial transport
•Wireless sensor networks
•Factory automation and control
•Wireless healthcare applications
•Energy harvesting applications
•Asset tracking and management
•Electronic Shelf Label (ESL)
•Wired networking
•Small business router
•Portable electronics
•Set-top box
•Connected peripherals
•Keyboard and keypads
•Home theater & entertainment
•Electronic and robotic toys
•Wearables

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-2652P3
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-2652P3 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-2652P3
CC2652P
GPIOs
Jtag
48.0 MHz
32.768 kHz
Reset
Balun Filter
Balun Filter
Power Supply
1.8 V ~ 3.8 V
Antenna
Matching
Switch
PCB
Antenna
8 Mb
Flash
LPF
RF
BM
2652
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
TI CC2652P
-
-
P3
Module Version
The Third PA Version

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Table of Contents
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 3
1.4 Functional Block Diagram .............................................................................................................................. 4
1.5 Part Number Conventions.............................................................................................................................. 4
Table of Contents................................................................................................................................................................ 5
2 Module Configuration and Functions ...................................................................................................................... 7
2.1 Module Parameters........................................................................................................................................... 7
2.2 Module Pin Diagram ......................................................................................................................................... 8
2.3 Pin Functions....................................................................................................................................................... 8
3 Specifications .................................................................................................................................................................10
3.1 Recommended Operating Conditions .....................................................................................................10
3.2 Handling Ratings..............................................................................................................................................10
3.3 PA Output Control............................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
4.4 Antenna................................................................................................................................................................12
4.4.1 Antenna Design Recommendation ..............................................................................................12
4.5 Basic Operation of Hardware Design ......................................................................................................13
4.6 Trouble Shooting..............................................................................................................................................14
4.6.1 Unsatisfactory Transmission Distance........................................................................................14
4.6.2 Vulnerable Module..............................................................................................................................14
4.6.3 High Bit Error Rate .............................................................................................................................14
4.7 Electrostatics Discharge Warnings ...........................................................................................................15
4.8 Soldering and Reflow Condition.................................................................................................................15
5 Optional Package Specification ..............................................................................................................................17
6 Certification .....................................................................................................................................................................19
6.1 FCC.......................................................................................................................................................................19

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6.2 CE..........................................................................................................................................................................19
6.3 RoHS ....................................................................................................................................................................20
7 Revision History ............................................................................................................................................................21
8 Contact Us.......................................................................................................................................................................22

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-2652P3
Chipset
CC2652P
Supply Power Voltage
1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency
2402 MHz ～2480 MHz
Maximum Transmit Power
+20.0 dBm
Receiving Sensitivity
-100 dBm @ 802.15.4 (2.4 GHz)
-105 dBm @ Bluetooth 125 kbps (LE Coded PHY)
GPIO
11
Flash
352 KB + 1 MB
ROM
256 KB
SRAM
88 KB
Power Consumption
RX current: 6.9 mA
TX current: 7.3 mA @ 0 dBm
9.6 mA @ 5 dBm
22 mA @ 10 dBm
85 mA @ 20 dBm
MCU 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)
Sensor Controller: 30.1 μA @ Low Power-Mode, 2 MHz, running infinite loop
808 μA @ Active-Mode, 24 MHz, running infinite loop
Standby: 0.94 µA
Shutdown: 150 nA
Support Protocol
Thread, ZigBee, Matter, BLE5.3, IEEE 802.15.4, 6LoWPAN, proprietary
systems, SimpleLink™ TI 15.4 stack (2.4 GHz)
Flash
1 MB + 352 kB
Crystal
48 MHz, 32.768 kHz
Package
SMT packaging (1.27-mm half-hole pitch stamp stick)
Dimension
24.0 mm × 16.0 mm × 2.2 mm
Type of Antenna
PCB antenna
Operating Temperature
-40 ℃～+85 ℃
Storage Temperature
-40 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-2652P3
2.3 Pin Functions
Table 2. Pin Diagram of RF-BM-2652P3
Pin
Name
Chip Pin
Function
Description
1
RESET
RESET_N
Reset, active low. Internal pullup.
2
DIO16
DIO_16
Digital
GPIO, JTAG_TDO, high-drive capability
3
DIO17
DIO_17
Digital
GPIO, JTAG_TDI, high-drive capability
4
DIO24
DIO_24
Digital or Analog
GPIO, analog capability
5
DIO25
DIO_25
Digital or Analog
GPIO, analog capability
6
DIO26
DIO_26
Digital or Analog
GPIO, analog capability
7
DIO27
DIO_27
Digital or Analog
GPIO, analog capability
8
3V3
3V3
-
Power supply: 1.8 V ~ 3.8 V, recommended to 3.3 V

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9
GND
GND
GND
Ground
10
DIO7
DIO_7
Digital
GPIO, high-drive capability
11
JTAG_TMSC
JTAG_TMSC
Digital
JTAG TMSC, high-drive capability
12
JTAG_TCKC
JTAG_TCKC
Digital
JTAG TCKC
13
DIO21
DIO_21
Digital
GPIO
14
DIO20
DIO_20
Digital
GPIO
15
DIO5
DIO_5
Digital
GPIO, high-drive capability
16
DIO6
DIO_6
Digital
GPIO, high-drive capability

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-2652P3
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
/
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-2652P3
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
2
Charged Device Model
±500
V
3.3 PA Output Control
The PA of the CC2652P switches the RF switch by controlling the output of DIO28 and DIO29, and then switches the PA
and non-PA RF output to realize the control of the transmission power range.
Table 3. RF Control Truth Table
Power
DIO28 (Output)
DIO29 (Output)
+5 dBm ~ + 20 dBm (PA)
0
1
< 5 dBm
1
0

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 3. Photos of RF-BM-2652P3
4.2 Recommended PCB Footprint
Figure 4. Recommended PCB Footprint of RF-BM-2652P3

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4.3 Schematic Diagram
Figure 5. Schematic Diagram of RF-BM-2652P3
4.4 Antenna
4.4.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure that
the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a
high-quality antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:

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（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 4. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module.
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
margin, which is beneficial to the long-term stable operation of the whole machine. The module should be far away
from the power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic
interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is
soldered to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and
be close to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to some degree.
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly
affect the module performance. It is recommended to stay away from the module according to the strength of the

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interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performances of ground absorption and reflection of radio waves will be poor when the module is tested close
to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.

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2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3
precautions below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃~ 235 ℃
230 ℃~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 5. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in
advance.
Figure 6. Default Package by Tray

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Figure 7. Package by Tape & Reel

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6 Certification
6.1 FCC
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
FCC Identifier: 2ABN2-2652P3
Figure 8. FCC Certificate
6.2 CE
Figure 9. CE Certificate

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6.3 RoHS
RoHS Report No.:C210630006001-1
Figure 10. RoHS Certificate