RF-Star RSBRS02ABR User manual

RSBRS02ABR
Bluetooth 4.2 Low Energy Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Jan. 10th, 2020

RSBRS02ABR
www.szrfstar.comV1.0 - Jan., 2020
RF-star BLE Module List
Chipset Core Flash
(Byte)
RAM
(KB)
TX
Power
(dBm)
Model Antenna D
imension
(mm)
Range
(M) Photo
RS02A1-B M0+ 256 8 5
RSBRS02AB PCB 11.2×15.2 150
RSBRS02ABR PCB 11.2×15.2 150
RSBRS02ABRI IPEX 11.2×15.2 250
RS02A1-A M0+ 256 8 7
RSBRS02AA PCB 11.2×15.2 180
RSBRS02AI IPEX 11.2×15.2 300
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.
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1 Device Overview
1.1 Description
RSBRS02ABRis a compact size, cost effective single-mode Bluetooth low energy module based onRF-star256 KB
flash SoC RS02A1-B chip with super low power consumption (BLE TX: 13.0 mA @ 0 dBm, BLE RX: 12.0 mA), good
noise reduction, better sensitivity, robust transmission distance, and high reliability. The module integrates a 16 MHz
crystal, an RF matching filter, apower filter, and a meander line inverted-F PCB antenna.It supports BLE stack v5.0 and
is preprogrammed with an easy-to-integrate serial interface communication protocol.
1.2 Key Features
•Frequency: 2402 MHz ~ 2480.0 MHz
•BLE
- Compiles with Bluetooth v5.0 (1/2 Mbps,
extended ADV payload)
- TX: Up to +5 dBm transceiver output power
- RX: -94 dBm sensitivity @ 1 Mbps
- Single-pin antenna interface
- Link layer and AES/CCM integrated
•CPU
- 32-bit ARM Cortex-M0+ @ 48 MHz
- Single cycle multiplier
- 65 μA/MHz running from SRAM
- Serial wire debug
•Memory
- ROM 80 KB
- SRAM 36 KB, 4 KB Cache
- Flash 256 KB
- 32B eFuse
•Power
- Supply voltage: 2.3 V ~ 3.6 V
- Hibernation mode (GPIO retention): 2μA @ 3 V,
wakeup by GPIO or RTC
- Sleep mode (BLE linked, 40 KB SRAM data
retention): 5μA, wakeup by GPIO, RTC or BLE
- BLE TX: 13.0 mA @ 0 dBm
- BLE RX: 12.0 mA
•Clock and Timer
- 16 MHz crystal and RC oscillator
- 5 x 16 bit timer
- Real timer clock (RTC)
- Watchdog
•Peripherals
- 11 general purpose I/Os. Function IO any-route
support
- 2 x UARTs with CTS/RTS
- SPI with master/slave configurable
- I2C with master/slave configurable
- 7816 T-0 master interface
- Keyboard interface
- 4-channel 9-bit general purpose ADC
- Infra-red generator
- 4 x PWM
- Quadrature decoder (QDEX) interface
- 12 MHz clock output
- RSSI (1 dB resolution)
•DMA
- 2-channel
1.3 Applications
•Smart toys •Gaming controller
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•E-lock
•Smart lighting
•Electronic shelf label
•Location based service
•Medical devices
•Fitness equipment
•Environmental sensor nodes
•Passive key-less entry (PKE)
•Phone accessories
•Health-care equipment
•Energy harvesting
•Thermometer
•Human input devices
•Wearable
1.4 Functional Block Diagram
confidentiality
Figure 1. Functional Block Diagram of RSBRS02ABR
1.5 Part Number Conventions
The part numbers are of the form of RSBRS02ABR where the fields are defined as follows:
Figure 2. Part Number Conventions of RSBRS02ABR
FCC Statement
FCC Statement
FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247
Integral antenna with antenna gain 0dBi
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
RS BRS02AB R
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
RF-star RS02A1-B
Version Number
Version Number
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harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
We will retain control over the final installation of the modular such that compliance of the end product is
assured. In such cases, an operating condition on the limit modular approval for the module must be only
approved for use when installed in devices produced by a specific manufacturer. If any hardware modify or
RF control software modify will be made by host manufacturer,C2PC or new certificate should be apply to
get approval,if those change and modification made by host manufacturer not expressly approved by the
party responsible for compliance ,then it is illegal.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
If the FCC identification number is not visible when the module is installed inside another device, then the
outside of the device into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID:
2ABN2-RSBRS02ABR Or Contains FCC ID: 2ABN2-RSBRS02ABR”
When the module is installed inside another device, the user manual of the host must contain below warning
statements;
1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
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interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
2. Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
The devices must be installed and used in strict accordance with the manufacturer's instructions as described
in the user documentation that comes with the product.
Any company of the host device which install this modular with limit modular approval should perform the
test of radiated & conducted emission and spurious emission, etc. according to FCC part 15C : 15.247 and
15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and
15.209 & 15.207 ,15B Class B requirement，then the host can be sold legally.
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Table of Contents
RF-star BLE Module List........................................................................................................................... 1
1 Device Overview..................................................................................................................................... 2
1.1 Description....................................................................................................................................2
1.2 Key Features................................................................................................................................ 2
1.3 Applications..................................................................................................................................2
1.4 Functional Block Diagram...........................................................................................................3
1.5 Part Number Conventions .......................................................................................................... 3
Table of Contents....................................................................................................................................... 6
Table of Figures .........................................................................................................................................7
Table of Tables........................................................................................................................................... 8
2 Module Configuration and Functions.................................................................................................... 9
2.1 Module Parameter....................................................................................................................... 9
2.2 Module Pin Diagram.................................................................................................................. 10
2.3 Pin Functions ............................................................................................................................. 10
3 Specifications........................................................................................................................................ 12
3.1 Absolute Maximum Ratings...................................................................................................... 12
3.2 Handling Ratings....................................................................................................................... 12
3.3 RF Characteristics..................................................................................................................... 12
3.3.1 Receiver RF Specifications............................................................................................ 12
3.3.2 Transceiver RF Specifications....................................................................................... 13
3.3.3 RF Test............................................................................................................................. 14
3.4 Power Consumption Summary................................................................................................. 14
4 Application, Implementation, and Layout ........................................................................................... 15
4.1 Module Photos........................................................................................................................... 15
4.2 Recommended PCB Footprint................................................................................................. 15
4.3 Schematic Diagram................................................................................................................... 16
4.4 Basic Operation of Hardware Design...................................................................................... 16
4.5 Trouble Shooting........................................................................................................................ 17
4.5.1 Unsatisfactory Transmission Distance.......................................................................... 17
4.5.2 Vulnerable Module.......................................................................................................... 18
4.5.3 High Bit Error Rate.......................................................................................................... 18
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4.6 Electrostatics Discharge Warnings.......................................................................................... 18
4.7 Soldering and Reflow Condition............................................................................................... 18
4.8 Optional Packaging................................................................................................................... 19
5 Revision History.................................................................................................................................... 19
6 Contact Us............................................................................................................................................. 20
Table of Figures
Figure 1. Functional Block Diagram of RSBRS02ABR .................................................................. 3
Figure 2. Part Number Conventions of RSBRS02ABR.................................................................. 3
Figure 3. Pin Diagram of RSBRS02ABR....................................................................................... 10
Figure 4. Photos of RSBRS02ABR................................................................................................ 15
Figure 5. Recommended PCB Footprint of RSBRS02ABR (mm)............................................... 15
Figure 6. Schematic Diagram of RSBRS02ABR........................................................................... 16
Figure 7. Recommendation of Antenna Layout............................................................................. 17
Figure 8. Recommended Reflow for Lead Free Solder................................................................ 19
Figure 9. Optional Packaging Mode............................................................................................... 19
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Table of Tables
Table 1. Parameters of RSBRS02ABR............................................................................................ 9
Table 2. Pin Functions of RSBRS02ABR....................................................................................... 10
Table 3. Absolute Maximum Ratings.............................................................................................. 12
Table 4. Handling Ratings of RSBRS02ABR................................................................................. 12
Table 5. Receiver RF Specifications .............................................................................................. 12
Table 6. Transceiver RF Specifications.......................................................................................... 13
Table 7. Table of RF Test................................................................................................................. 14
Table 8. DC Characteristics Table .................................................................................................. 14
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2 Module Configuration and Functions
2.1 Module Parameter
Table 1. Parameters of RSBRS02ABR
Chipset
RS02A1-B
Supply Power Voltage 2.3 V ~ 3.6 V, recommended to 3.3 V
Modulation
GFSK
Frequency
2402 MHz ~ 2480.0 MHz
Chanel Number 40 (channel spacing of 2 MHz)
Transmit Power
-20.0 dBm ~ +5.0 dBm
Receiving Sensitivity
-94 dBm
GPIO 11
Crystal
16 MHz
ROM 80 KB
SRAM 36 KB, 4 KB Cache
Flash
256 KB
Package
SMT Packaging
Frequency Error
±20 kHz
Dimension
15.1 mm x 11.2 mm x (1.5 ± 0.1) mm
Type of Antenna
PCB Antenna
Operating Temperature -40 ℃～ +85℃
Storage Temperature
-40
℃～
+125
℃
Hibernation Current 5 µA (Test software RS02A1-B-test.hex)
Current of Broadcast Event 90 µA (Broadcast interval: 200 ms @ 0 dBm)
Current of Connection Event
0.35 mA (Connection interval: 20 ms @ 0 dBm)
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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RSBRS02ABR
2.3 Pin Functions
Table 2. Pin Functions of RSBRS02ABR
Pin Name Chip Pin Pin Type Remarks
1 GND GND Ground Ground
2 VCC VCC VCC Power supply: 2.3 V ~ 3.6 V, Recommended to 3.3 V
3 P02 P02 I/O
4 P03 P03 I/O
5 RESET RESET RESET Active low
6 P04 P04 I/O
7 SWC SWC SWCLK Connect J-Link simulator SWCLK
8 SWD SWD SWDIO Connect J-Link simulator SWDIO
9 NC NC NC
10 P05 P05 I/O
11 P08 P08 I/O
12 P10 P10 I/O
13 NC NC NC
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14 P21 P21 I/O
15 P22 P22 I/O
16 P24 P24 I/O
17 P23 P23 I/O
18 P11 P11 I/O
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3 Specifications
3.1 Absolute Maximum Ratings
Table 3. Absolute Maximum Ratings
Identification Condition Min. Typ. Max. Unit
Source & IO Battery mode 2.3 3.3 3.6 V
Operating Temperature / -40 25 +85 ℃
Environmental Hot Pendulum / -20 20 ℃/ Min
Notes: To ensure the RF performance, the ripple wave on the source must be less than ±300 mV.
3.2 Handling Ratings
Table 4. Handling Ratings of RSBRS02ABR
Items Condition Min. Typ. Max. Unit
Storage Temperature Tstg -40 +25 +125 ℃
Human Body Model HBM ±2000 V
Moisture Sensitivity Level 2
Charged Device Model ±250 V
3.3 RF Characteristics
3.3.1 Receiver RF Specifications
Table 5. Receiver RF Specifications
Parameters Symbol Min. Typ. Max. Unit
Sensitivity Pmin -94 dBm
Sensitivity (dirty on) Pmin -93 dBm
Maximum Input Power Pmax 0 dBm
In-band Blocking
Co-channel interference CI0 7 dB
Interferer at foffs = +1 MHz CI1 -1 dB
Interferer at foffs = -1 MHz CI1 -6 dB
Interferer at foffs = +2 MHz CI2 -38 dB
Interferer at foffs = -2 MHz CI2 -35 dB
Interferer at foffs = +3 MHz CI3 -42 dB
Interferer at foffs = -3 MHz CI3 -33 dB
Interferer at image channel (Fimage) CI4 -29 dB
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Interferer at image channel (Fimage + 1
MHz) CI5 -32 dB
Interferer at image channel (Fimage - 1 MHz) CI5 -32 dB
Out-of-band
Blocking
f= 30 MHz ~ 2000 MHz >-25 dB
f= 2000 MHz ~ 2399 MHz >-30 dB
f= 2484 MHz ~ 3000 MHz >-30 dB
f= 3000 MHz ~ 12750 MHz >-25 dB
Intermodulation Performance for Wanted Signal at -64 dBm and 1
Mbps BLE, 3rd, 4th and 5thOffset Channel
>-35 dBm
Upper Limit of Monotonous Range Pissi(max) -20 dBm
3.3.2 Transceiver RF Specifications
Table 6. Transceiver RF Specifications
Parameters Symbol Min. Typ. Max. Unit
Output Power Ptx -20 +5 dBm
TX RF Output Steps 3 dB
Average Frequency deviation for 10101010 patterns ∆F2AVG 238 kHz
Average Frequency deviation for 11110000 patterns ∆F1AVG 260 kHz
Eye opening = ∆F2AVG/∆F1AVG EO 0.88 0.91 0.94
Frequency Accuracy -10 10 kHz
Maximum Frequency Drift -6 5 kHz
Initial Frequency Drift -5 5 kHz
Drift Rate FDR -5.5 14.5 kHz/50μs
Spurious
Emissions
F < 1 GHz -68 dBm
F > 1 GHz including harmonics -48 dBm
In-band
Emissions
< f ± 2 MHz (f = 2400 MHz ~ 2483.5 MHz, Ptx = 0 dBm) -45 dBm
> f ± 3MHz (f = 2400 MHz ~ 2483.5 MHz, Ptx = 0 dBm) -49 dBm
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3.3.3RF Test
When measured on the RSBRS02ABR reference design with TA= 25 ℃, V BAT = 3.3 V with DC/DC, channel of 39th
(2442 MHz) enabled unless otherwise noted.
Table 7. Table of RF Test
Test Item Parameter Test Value Unit
Transmitter Power <5 dBm
Frequency Deviation 2.168 kHz
Receiver Sensitivity (8% PER) -93.5 dBm
3.4 Power Consumption Summary
Table 8. DC Characteristics Table
Ta=25℃, VIN=3.0V, unless otherwise specified.
Parameter Ratings Unit
Min. Typ. Max.
VIH (Logic-1 input voltage)
VDDR = 3.3 V 2.0 V
VDDR = 2.5 V 1.7 V
VDDR = 1.8 V 1.2 V
IIH (Logic-1 input current) +10 µA
VIL (Logic-0 input voltage)
VDDR = 3.3 V 0.8 V
VDDR = 2.5 V 0.7 V
VDDR = 1.8 V 0.6 V
IIL (Logic-0 input current) -10 µA
VOH (Logic-1 output voltage, IOL = -20/-15/-10/-5 mA) VDDR -0.4 V
VOL (Logic-0 output voltage, IOH = -20/-15/-10/-5 mA) 0.4 V
Rx Mode, 1 Mbps mode 12 mA
TX mode, 0 dBm output power 13 mA
CPU active (running from flash) 65 µA/MHz
Hibernation mode (SRAM no retention, IO retention and IO
wakeup or RTC wakeup) 2 µA
Sleep mode (SRAM 32kB retention, BLE linked, flash sleep
included) 5 µA
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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RSBRS02ABR
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RSBRS02ABR (mm)
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4.3 Schematic Diagram
confidentiality
Figure 6. Schematic Diagram of RSBRS02ABR
4.4 Basic Operation of Hardware Design
1. It is recommended to offerthe module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the
margin, which is beneficial to the long-term stable operation of the whole machine.The module should be far away
from the power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic
interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power
routing.If it has toroute the wire on the bottom of module, for example, it is assumed that the module is soldered to
the Top Layer,the copper must be spread on the connection part of the top layer and the module, and be close to
the digital part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom
Layer or other layers, which will affect the spurs and receiving sensitivity of the module to somedegrees;
6. Assuming that there are devices with large electromagnetic interference around the module,which will greatly affect
themodule performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same2.4 GHzphysical layer, for
example: USB3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of
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antenna is a key factor to increase the data rate and transmission range.
Therefore,the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge(corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module is
minimally affected.
Figure 7. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5 Trouble Shooting
4.5.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly
weakened.Temperature, humidity, and co-channel interference will lead to an increase in communication packet
loss rate.The performances of ground absorption andreflectionof radio waves will be poor, when the module is
tested close to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or themodule is placed inside of the
metal shell.
4. The incorrect power register set or the high data ratein an open air may shorten the communication distance.The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
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4.5.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supplyand no frequently
fluctuatedvoltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and
application.If there is no special demand, it is not recommended to use at too high or too low temperature.
4.5.3 High Bit Error Rate
1. There areco-channel signal interferences nearby.It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.6Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3
precautions below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.7 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or
equivalent methods.
3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
5. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
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6. Peak temperature: 245 ℃.
Figure 8. Recommended Reflow for Lead Free Solder
4.8 Optional Packaging
Figure 9. Optional Packaging Mode
Note: Default tray packaging.
5 Revision History
Date Version No. Description Author
2020.01.03 V1.0 The initial version is released. Aroo Wang
2020.01.10 V1.0 Add RF-star BLE module list. Sunny Li
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