RF-Star RF-BM-ND07 User manual

RF-BM-ND07 nRF52833
Multi-Protocols Module
Supporting BLE, ZigBee, Thread
Version 1.1
Shenzhen RF-star Technology Co., Ltd.
May 25th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-BM-ND07 is an RF module based on Nordic SoC nRF52833 with ARM® Cortex®-M4 32-bit processor. It integrates
a 32 MHz crystal, a matching and antenna options of a chip antenna, an IPEX connector and pad antenna interface. It
features low power consumption, small size, robust connection distance, and rigid reliability. It supports Bluetooth® 5.2
Low Energy, Bluetooth mesh, Thread and Zigbee. It includes a range of analog and digital interfaces such as NFC-A,
ADC, full-speed 12 Mbps USB 2.0, High-speed 32 MHz SPI, SPI, UART, PWM, I2C, I2S and PDM, which make this
module an ideal device for a wide range of commercial and industrial applications, including professional lighting, asset
tracking, advanced wearables or smart home applications where robust coverage is important.
1.2 Key Features
•RF Features
- Bluetooth® 5.2 low energy
- Bluetooth mesh
- Thread
- ZigBee
•Angle-of arrival (AoA) and angle-of-departure (AoD)
direction finding
•ARM® Cortex®-M4 32-bit processor with FPU, 64
MHz
•Memory
- 512 kB flash
- 128 kB RAM
•Interfaces
- ADC
- Full speed 12 Mbps USB 2.0
- High-speed 32 MHz SPI
- NFC-A
- PPI
- 42 GPIOs
- PWM
- I2S
- SPI master/slave
- I2C
- UART (CTS/RTS)
- Quadrature decoder (QDEC)
- 3 x real-time counter (RTC)
•Transmission Distance: up to 300 m
•Dimension: 12.2 mm x 17.0 mm x 2.2 mm
•Tx power: -20 dBm ~ +8 dBm
1.3 Applications
•Internet of Things (IoT)
•Smart home sensors and controllers
•Industrial IoT sensors and controllers
•Mouse
•Keyboard
•Home Automation
•Beacons
•Health and medical
•Wearables
•Gaming controllers
•Wireless payment-enabled devices

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND07
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND07 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND07
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
07
Module Version
nRF52833 Version
nRF52833
GPIO
Debug
Reset
Power Supply
1.7 V ~ 5.5 V
Matching
32.0 MHz
Chip
Antenna
IPEX
Connector
Antenna
Switch
Pad antenna interface

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 1
1.4 Functional Block Diagram .............................................................................................................................. 2
1.5 Part Number Conventions.............................................................................................................................. 2
Table of Contents................................................................................................................................................................ 3
2 Module Configuration and Functions ...................................................................................................................... 4
2.1 Module Parameters........................................................................................................................................... 4
2.2 Module Pin Diagram ......................................................................................................................................... 5
2.3 Pin Functions....................................................................................................................................................... 5
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings................................................................................................................................................ 9
4 Application, Implementation, and Layout.............................................................................................................10
4.1 Module Photos..................................................................................................................................................10
4.2 Recommended PCB Footprint....................................................................................................................10
4.3 Schematic Diagram.........................................................................................................................................11
4.4 Antenna................................................................................................................................................................11
4.4.1 Antenna Design Recommendation ..............................................................................................11
4.5 Basic Operation of Hardware Design ......................................................................................................12
4.6 Trouble Shooting..............................................................................................................................................13
4.6.1 Unsatisfactory Transmission Distance........................................................................................13
4.6.2 Vulnerable Module..............................................................................................................................13
4.6.3 High Bit Error Rate .............................................................................................................................13
4.7 Electrostatics Discharge Warnings ...........................................................................................................13
4.8 Soldering and Reflow Condition.................................................................................................................14
5 Optional Package Specification ..............................................................................................................................16
6 Revision History ............................................................................................................................................................18
7 Contact Us.......................................................................................................................................................................19

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND07
Chipset
nRF52833
Support Protocol
Bluetooth® 5.2, Bluetooth mesh, Thread and ZigBee, AoA/AoD
Supply Power Voltage
1.7 V ~ 5.5 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +8.0 dBm (Typical: 0 dBm)
Receiving Sensitivity
-103 dBm @ 125 kbps BLE
-96 dBm @ 1 Mbps BLE
Data Rate
Bluetooth® 5.1: 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
IEEE 802.15.4-2006: 250 kbps
Propriety 2.4 GHz: 2 Mbps, 1 Mbps
Power Consumption
4.9 mA peak current in TX (@ 0 dBm)
4.6 mA peak current in RX
Interface
NFC-A, ADC, full-speed 12 Mbps USB 2.0, High-speed 32 MHz SPI,
UART/SPI/TWI, PWM, I2C, I2S and PDM
GPIO
42
Crystal
32 MHz
RAM
128 KB
Flash
512 KB
Package
LGA packaging (0.8-mm pad)
Frequency Error
±20 kHz
Dimension
12.2 mm x 17.0 mm x 2.2 mm
Type of Antenna
Chip antenna, IPEX connector and Pad antenna interface
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-ND07
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND07
Pin
Name
Chip Pin
Pin Type
Description
1
P0.25
P0.25
Digital I/O
General purpose I/O
2
P0.23
P0.23
Digital I/O
General purpose I/O
3
P1.05
P1.05
Digital I/O
General purpose I/O
4
P1.03
P1.03
Digital I/O
General purpose I/O
5
P0.19
P0.19
Digital I/O
General purpose I/O
6
P0.03
P0.03
Digital I/O
General purpose I/O
AIN1
AIN1
Analog input
Analog input
7
P0.02
P0.02
Digital I/O
General purpose I/O
AIN0
AIN0
Analog input
Analog input
8
P0.28
P0.28
Digital I/O
General purpose I/O
AIN4
AIN4
Analog input
Analog input
9
P0.29
P0.29
Digital I/O
General purpose I/O

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AIN5
AIN5
Analog input
Analog input
10
NC
11
P0.30
P0.30
Digital I/O
General purpose I/O
AIN6
AIN6
Analog input
Analog input
12
P0.31
P0.31
Digital I/O
General purpose I/O
AIN7
AIN7
Analog input
Analog input
13
VCC
VCC
14
VCC
VCC
15
GND
GND
16
P0.00
P0.00
Digital I/O
General purpose I/O
XL1
XL1
Analog input
Connection for 32.768 kHz crystal
17
P0.01
P0.01
Digital I/O
General purpose I/O
XL2
XL2
Analog input
Connection for 32.768 kHz crystal
18
P0.26
P0.26
Digital I/O
General purpose I/O
19
P0.27
P0.27
Digital I/O
General purpose I/O
20
P0.04
P0.04
Digital I/O
General purpose I/O
AIN2
AIN2
Analog input
Analog input
21
P0.05
P0.05
Digital I/O
General purpose I/O
AIN3
AIN3
Analog input
Analog input
22
P0.06
P0.06
Digital I/O
General purpose I/O
23
P0.07
P0.07
Digital I/O
General purpose I/O
TRACECLK
TRACECLK
Trace clock
Trace buffer clock
24
P0.08
P0.08
Digital I/O
General purpose I/O
25
P1.08
P1.08
Digital I/O
General purpose I/O
26
P1.09
P1.09
Digital I/O
General purpose I/O
TRACEDATA3
TRACEDATA3
Trace data
Trace buffer TRACEDATA[3]
27
P0.11
P0.11
Digital I/O
General purpose I/O
TRACEDATA2
TRACEDATA2
Trace data
Trace buffer TRACEDATA[2]
28
P0.12
P0.12
Digital I/O
General purpose I/O

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TRACEDATA1
TRACEDATA1
Trace data
Trace buffer TRACEDATA[1]
29
GND
GND
Ground
30
VCC
VCC
VCC
Power supply: 1.7 V ~ 5.5 V, recommend to 3.3 V
31
D-
D-
USB
USB D-
32
D+
D+
USB
USB D+
33
GND
GND
Ground
34
P0.13
P0.13
Digital I/O
General purpose I/O
35
P0.14
P0.14
Digital I/O
General purpose I/O
36
P0.15
P0.15
Digital I/O
General purpose I/O
37
P0.16
P0.16
Digital I/O
General purpose I/O
38
P0.17
P0.17
Digital I/O
General purpose I/O
39
P0.18
P0.18
Digital I/O
General purpose I/O
nRESET
nRESET
Configurable as pin RESET
40
P0.20
P0.20
Digital I/O
General purpose I/O
41
P0.21
P0.21
Digital I/O
General purpose I/O
42
P0.22
P0.22
Digital I/O
General purpose I/O
43
P0.24
P0.24
Digital I/O
General purpose I/O
44
P1.00
P1.00
Digital I/O
General purpose I/O
TRACEDATA0
TRACEDATA0
Trace data
Trace buffer TRACEDATA[0]
45
ANT
ANT
RF
Single-ended radio antenna connection
46
GND
GND
Ground
47
SWDIO
SWDIO
Debug
Serial wire debug I/O for debug and programming
48
SWDCLK
SWDCLK
Debug
Serial wire debug clock input for debug and
programming
49
P1.01
P1.01
Digital I/O
General purpose I/O
50
P1.02
P1.02
Digital I/O
General purpose I/O
51
P1.04
P1.04
Digital I/O
General purpose I/O
52
P1.06
P1.06
Digital I/O
General purpose I/O
53
P1.07
P1.07
Digital I/O
General purpose I/O

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54
P0.09
P0.09
Digital I/O
General purpose I/O
NFC1
NFC1
NFC input
NFC antenna connection
55
P0.10
P0.10
Digital I/O
General purpose I/O
NFC2
NFC2
NFC input
NFC antenna connection
56
GND
GND
Ground
57
GND
GND
Ground
58
GND
GND
Ground
59
GND
GND
Ground
60
GND
GND
Ground

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3 Specifications
3.1 Recommended Operating Conditions
The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the
table below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND07
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
5.5
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND07
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±4000
V
Moisture Sensitivity Level
3
Charged Device Model
±750
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-ND07
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND07

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-ND07
4.4 Antenna
4.4.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.

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（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 7. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate

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isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the
ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions

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below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing the failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 8. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.
Figure 9. Default Package by Tray

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Figure 10. Package by Tape & Reel

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6 Revision History
Date
Version No.
Description
2020.08.26
V1.0
The initial version is released.
2023.05.25
V1.0
Update MSL level.
Update the Shenzhen office address.
Modify the mistake of pin descriptions.
Note:
1. The document will be optimized and updated from time to time. Before using this document, please make sure it is
the latest version.
2. To obtain the latest document, please download it from the official website: www.rfstariot.com and www.szrfstar.com.

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7 Contact Us
SHENZHEN RF-STAR TECHNOLOGY CO., LTD.
Shenzhen HQ:
Add.: Room 502, Podium Building No. 12, Shenzhen Bay Science and Technology Ecological Park, Nanshan District,
Shenzhen, Guangdong, China, 518063
Tel.: [phone]
Chengdu Branch:
Add.: N2-1604, Global Center, North No. 1700, Tianfu Avenue, Hi-Tech District, Chengdu, Sichuan, China, 610095
Tel.: [phone]
Email: [e-mail], [e-mail]
Web.: www.rfstariot.com, www.szrfstar.com