Texas Instruments DAC8574 User manual

DAC8574 Evaluation Module
June 2003 Data Acquisition - Digital/Analog Converters
User’s Guide
SLAU109

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products & application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Secruity www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated

EVM IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION
PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided
may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective
considerations, including product safety measures typically found in the end product incorporating the goods.
As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic
compatibility and therefore may not meet the technical requirements of the directive.
Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned
within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE
WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,
IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY
PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user
indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products
received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction
of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic
discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE
TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM
User’s Guide prior to handling the product. This notice contains important safety information about temperatures
and voltages. For further safety concerns, please contact the TI application engineer.
Persons handling the product must have electronics training and observe good laboratory practice standards.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any
machine, process, or combination in which such TI products or services might be or are used.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated

EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input and output voltage ranges described in the
EVM user’s guide.
Exceeding the specified input range may cause unexpected operation and/or irreversible
damage to the EVM. If there are questions concerning the input range, please contact a TI
field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or
possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to
connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than
60°C. The EVM is designed to operate properly with certain components above 60°C as long
as the input and output ranges are maintained. These components include but are not limited
to linear regulators, switching transistors, pass transistors, and current sense resistors. These
types of devices can be identified using the EVM schematic located in the EVM User’s Guide.
When placing measurement probes near these devices during operation, please be aware
that these devices may be very warm to the touch.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2003, Texas Instruments Incorporated

Information About Cautions and Warnings
iii
Preface
Read This First
About This Manual
This user’s guide describes the characteristics, operation, and the use of the
DAC8574 evaluation module. It covers all pertinent areas involved to properly
use this EVM board along with the devices that it supports. The physical PCB
layout, schematic diagram and circuit descriptions are included.
How to Use This Manual
This document contains the following chapters:
Chapter 1 —EVM Overview
Chapter 2—PCB Design and Performance
Chapter 3—EVM Operation
Information About Cautions and Warnings
This book may contain cautions and warnings.
The information in a caution or a warning is provided for your protection. Read
each caution and warning carefully.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.

Trademarks
iv
Related Documentation From Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas
Instruments Literature Response Center (PIC) at [phone] or the
Product Information Center (PIC) at [phone]. When ordering, identify
this manual by its title and literature number. Updated documents can also be
obtained through our website at www.ti.com.
Data Sheets: Literature Number:
DAC8574 SLAS377A
REF02 SBVS-003A
OPA627 PDS-998H
OPA2132 PDS-1309B
Questions about this or other Data Converter EVM’s?
If you have questions about this or other Texas Instruments Data Converter
evaluation modules, feel free to e-mail the Data Converter Application Team
at [email protected]. Inlcude in the subject heading the product you
have questions or concerns with.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Trademarks
TI Logo is a trademark of Texdas Instruments Incorporated.
I2C is a trademark of Phillips Corporation.

Contents
v
Contents
1 EVM Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Power Requirements 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.1 Supply Voltage 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2.2 Reference Voltage 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 EVM Basic Functions 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 PCB Design and Performance 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 PCB Layout 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 EVM Performance 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Bill of Materials 2-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 EVM Operation 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Factory Default Setting 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Host Processor Interface 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 EVM Stacking 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 The Output Op-Amp 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.1 Unity Gain Output 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2 Output Gain of Two 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.3 Capacitive Load Drive 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 Optional Signal Conditioning Op-Amp (U8B) 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 Jumper Setting 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7 Schematic 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Contents
vi
Figures
1-1 EVM Block Diagram 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1 Top Silkscreen 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-2 Layer 1 (Top Signal Plane) 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-3 Layer 2 (Ground Plane) 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-4 Layer 3 (Power Plane) 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-5 Layer 4 (Bottom Signal Plane) 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-6 Bottom Silkscreen 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-7 Drill Drawing 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-8 DAC8574 EVM Test Parameters and Results 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-9 INL and DNL Characterization Graph of DAC A 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-10 INL and DNL Characterization Graph of DAC B 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-11 INL and DNL Characterization Graph of DAC C 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-12 INL and DNL Characterization Graph of DAC D 2-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2-1 Parts List 2-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-1 Factory Default Jumper Setting 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-2 DAC Output Channel Mapping 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-3 Unity Gain Output Jumper Settings 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-4 Gain of Two Output Jumper Settings 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-5 Capacitive Load Drive Output Jumper Settings 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3-6 Jumper Setting Functions 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1
EVM Overview
EVM Overview
This chapter gives a general overview of the DAC8574 evaluation module
(EVM), and describes some of the factors that must be considered in using this
module.
Topic Page
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Power Requirements 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 EVM Basic Functions 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Features
1-2
1.1 Features
This EVM features the DAC8574 digital-to-analog converter (DAC). The
DAC8574 EVM is a simple evaluation module designed for a quick and easy
way to evaluate the functionality and performance of the high resolution,
quad-channel, and serial I2Cinput DAC. This EVM features a serial I2C
interface to communicate with any host microprocessor or TI DSP base
system.
1.2 Power Requirements
The following sections describe the power requirements of this EVM.
1.2.1 Supply Voltage
The dc power supply requirement for the digital section (VDD) of this EVM is
typically 5 V connected to the J5-1 or via J6-10 terminal (when plugged in with
another EVM board or interface card) and is referenced to ground through the
J5-2 and J6-5 terminal. The dc power supply requirements for the analog
section of this EVM are as follows; the VCC and VSS ranges from 15.75 V to
-15.75 V maximum and connects through J1-3 and J1-1 respectively, or
through J6-1 and J6-2 terminals. The 5 VA connects through J5-3 or J6-3
and the 3.3 VA connects through J6-8. All of the analog power supplies are
referenced to analog ground through J1-2 and J6-6 terminals.
The device under test, U1, analog power supply can be powered by either 5 VA
or 3.3 VA by selecting the proper position of jumper W1. This allows the
DAC8574 analog section to operate in either supply power while the I/O and
digital section is powered by 5 V, VDD.
The VCC supply source is mainly used to provide the positive rail of the external
output op-amp, U2, the reference chip, U3 and the reference buffer, U8. The
negative rail of the output op-amp, U2, can be selected between VSS and
AGND via W5 jumper. The external op-amp is installed as an option to provide
output signal conditioning or boost capacitive load drive and for other output
mode requirement desired.
Caution
To avoid potential damage to the EVM board, make sure that the
correct cables are connected to their respective terminals as
labeled on the EVM board.
Stresses above the maximum listed voltage ratings may cause
permanent damage to the device.

EVM Basic Functions
1-3
EVM Overview
1.2.2 Reference Voltage
The 5-V precision voltage reference is provided to supply the external voltage
reference for the DAC through REF02, U3, via jumper W4 by shorting pins 1
and 2. The reference voltage goes through an adjustable 100 kΩ
potentiometer, R11, in series with 20 kΩ, R10, to allow the user to adjust the
reference voltage to its desired settings. The voltage reference is then
buffered through U8A as seen by the device under test. The test points TP1,
TP2 and TP5 are also provided, as well as J4-18 and J4-20, to allow the user
to connect other external reference source if the onboard reference circuit is
not desired. The external voltage reference should not exceed 5-V dc.
The REF02 precision reference is powered by VCC (15 V) through J1-3 or
J6-1 terminal.
Caution
When applying an external voltage reference through TP1 or J4-20,
make sure that it does not exceed 5 V maximum. Otherwise, this
can permanently damage the DAC8574, U1, device under test.
1.3 EVM Basic Functions
The DAC8574 EVM is designed primarily as a functional evaluation platform
to test certain functional characteristics of the DAC8574 DAC. Functional
evaluation of the DAC device can be accomplished with the use of any
microprocessor, TI DSP, or some sort of a waveform generator.
The headers J2 and P2 are the connectors provided to allow the control signals
and data required to interface a host processor or waveform generator to the
DAC8574 EVM using a custom built cable.
A specific adapter interface card is also available for most of TI’s DSP starter
kit (DSK) and the card model depend on the type of the TI DSP starter kit to
be used. Make sure to specify the DSP that is used to interface with to acquire
the right adapter interface card. In addition, there is also an MSP430 based
platform (HPA449) that uses the MSP430F449 microprocessor, which this
EVM can connect to and interface with. For more details or information
regarding the adapter interface card or the HPA449 platform, please call Texas
Instruments Inc. or email us at [email protected].
The DAC outputs can be monitored through the selected pins of J4 header
connector. All the outputs can be switched through their respective jumpers
W2, W11, W12 and W13, for the reason of stacking. Stacking allows a total of
eight DAC channels to be used provided that the I2C address is unique for
each EVM board stacked.
In addition, the option of selecting one DAC output that can be fed to the
noninverting side of the output op-amp, U2, is also possible by using a jumper
across the selected pins of J4. The output op-amp, U2, must first be configured
correctly for the desired waveform characteristic, refer to Section 3 of this
user’s guide.

EVM Basic Functions
1-4
A block diagram of the EVM is shown in Figure 1-1.
Figure 1-1.EVM Block Diagram
DAC Module
Output
Buffer
Module
VCC
VSS
VCC
GND
GND
VDD
DAC Out
4 CH
(J1)
(J5)
(J6)
(P6)
External
Reference
Module
VDD
(J2)
(P2)
A0
A1
LDAC
SCL
SDA
TP2
W4
TP1
VSS
W2
W11
W12
W13
(J4)
(P4) 8 CH
TP3
A2
A0 A2
TP5
W6
W9W7
W3
W15
W5
VSS
VREFH
VREFL
VREFH
3.3 VA
5 VA
A3
A1
W8
A3
W10

2-1
PCB Design and Performance
PCB Design and Performance
This chapter describes the layout design of the PCB, thereby, describing the
physical and mechanical characteristics of the EVM. This section also shows
the resulting performance of the EVM, which can be compared to the device
specification listed in the data sheet. The list of components used on the
module is also included in this section.
Topic Page
2.1 PCB Layout 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 EVM Performance 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Bill of Materials 2-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2

PCB Layout
2-2
2.1 PCB Layout
The DAC8574 EVM is designed to preserve the performance quality of the
DAC, device under test, as specified in the data sheet. Carefully analyzing the
EVM’s physical restrictions and the given or known elements that contributes
to the EVM’s performance degradation is the key to a successful design
implementation. These obvious attributes that diminish the performance of the
EVM can be taken care of during the schematic design phase, by properly
selecting the right components and building the circuit correctly. The circuit
must include adequate bypassing, identifying and managing the analog, and
digital signals and knowing or understanding the components mechanical
attributes.
The obscure part of the design is the layout process where lack of knowledge
and inexperience can easily present a problem. The main concern here is
primarily with the placement of components and the proper routing of signals.
The bypass capacitors should be placed as close as possible to the pins and
the analog and digital signals should be properly separated from each other.
The power and ground plane is very important and must be carefully
considered in the layout process. A solid plane is ideally preferred but
sometimes impractical, so when solid planes are not possible, a split plane can
do the job as well. When considering a split plane design, analyze the
component placement and carefully split the board into its analog and digital
sections starting from the device under test. The ground plane plays an
important role in controlling the noise and other effects that otherwise
contributes to the error of the DAC output. To ensure that the return currents
are handled properly, route the appropriate signals only in their respective
sections, meaning the analog traces should only lay directly above or below
the analog section and the digital traces in the digital section. Minimize the
length of the traces, but use the biggest possible trace width allowable in the
design. These design practices discussed can be seen in the following figures
presented on the following pages.
The DAC8574 EVM board is constructed on a four-layer printed-circuit board
using a copper-clad FR-4 laminate material. The printed-circuit board has a
dimension of 43,1800 mm (1.7000 inch) X 82,5500 mm (3.2500 inch), and the
board thickness is 1,5748 mm (0.0620 inch). Figures 2-1 through 2-6 show
the individual artwork layers.

PCB Layout
2-3
PCB Design and Performance
Figure 2-1.Top Silkscreen
Figure 2-2.Layer 1 (Top Signal Plane)
Figure 2-3.Layer 2 (Ground Plane)

PCB Layout
2-4
Figure 2-4.Layer 3 (Power Plane)
Figure 2-5.Layer 4 (Bottom Signal Plane)
Figure 2-6.Bottom Silkscreen

PCB Layout
2-5
PCB Design and Performance
Figure 2-7.Drill Drawing

EVM Performance
2-6
2.2 EVM Performance
The EVM performance test is performed using a high density DAC bench test
board, an Agilent 3458A digital multimeter, and a PC running the LABVIEW
software. The EVM board is tested for all codes of 65535 and the device under
test (DUT) is allowed to settle for 1ms before the meter is read. This process
is repeated for all codes to generate the measurements for INL and DNL
results and is shown in Figure 2-9.
The parameters and results of the DAC8574 EVM characterization test can be
seen in Figure 2-8.
Figure 2-8.DAC8574 EVM Test Parameters and Results

EVM Performance
2-7
PCB Design and Performance
Figure 2-9.INL and DNL Characterization Graph of DAC A

EVM Performance
2-8
Figure 2-10. INL and DNL Characterization Graph of DAC B