Texas Instruments DRV8833 User manual

PWM
nSLEEP
nFAULT
2.7 to 10.8 V
Controller
M
+ t
+ t
DRV8833
Stepper or
Brushed DC
Motor Driver
1.5 A
1.5 A
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DRV8833
SLVSAR1E –JANUARY 2011–REVISED JULY 2015
DRV8833 Dual H-Bridge Motor Driver
1 Features 3 Description
The DRV8833 device provides a dual bridge motor
1• Dual-H-Bridge Current-Control Motor Driver driver solution for toys, printers, and other
– Can Drive Two DC Motors or One Stepper mechatronic applications.
Motor The device has two H-bridge drivers, and can drive
– Low MOSFET ON-Resistance: HS + LS 360 two DC brush motors, a bipolar stepper motor,
mΩsolenoids, or other inductive loads.
• Output Current (at VM= 5 V, 25°C) The output driver block of each H-bridge consists of
– 1.5-A RMS, 2-A Peak per H-Bridge in PWP N-channel power MOSFETs configured as an H-
and RTY Package Options bridge to drive the motor windings. Each H-bridge
– 500-mA RMS, 2-A Peak per H-Bridge in PW includes circuitry to regulate or limit the winding
current.
Package Option
• Outputs can be in Parallel for Internal shutdown functions with a fault output pin are
provided for overcurrent protection, short-circuit
– 3-A RMS, 4-A Peak (PWP and RTY) protection, undervoltage lockout, and
– 1-A RMS, 4-A Peak (PW) overtemperature. A low-power sleep mode is also
• Wide Power Supply Voltage Range: provided.
2.7 to 10.8 V The DRV8833 is packaged in a 16-pin WQFN
• PWM Winding Current Regulation and Current package with PowerPAD™ (Eco-friendly: RoHS & no
Limiting Sb/Br).
• Thermally Enhanced Surface-Mount Packages Device Information(1)
2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)
TSSOP (16) 5.00 mm × 4.40 mm
• Battery-Powered Toys DRV8833 HTSSOP (16) 5.00 mm × 4.40 mm
• POS Printers WQFN (16) 4.00 mm × 4.00 mm
• Video Security Cameras (1) For all available packages, see the orderable addendum at
• Office Automation Machines the end of the data sheet.
• Gaming Machines
• Robotics
Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

DRV8833
SLVSAR1E –JANUARY 2011–REVISED JULY 2015 www.ti.com
Table of Contents
8.1 Application Information............................................ 12
1 Features.................................................................. 18.2 Typical Application.................................................. 12
2 Applications ........................................................... 19 Power Supply Recommendations...................... 14
3 Description............................................................. 19.1 Bulk Capacitance.................................................... 14
4 Revision History..................................................... 29.2 Power Supply and Logic Sequencing..................... 14
5 Pin Configuration and Functions......................... 310 Layout................................................................... 15
6 Specifications......................................................... 510.1 Layout Guidelines ................................................. 15
6.1 Absolute Maximum Ratings ...................................... 510.2 Layout Example .................................................... 15
6.2 ESD Ratings ............................................................ 510.3 Thermal Considerations........................................ 16
6.3 Recommended Operating Conditions....................... 510.4 Power Dissipation ................................................. 16
6.4 Thermal Information.................................................. 511 Device and Documentation Support................. 17
6.5 Electrical Characteristics........................................... 611.1 Documentation Support ........................................ 17
6.6 Typical Characteristics.............................................. 711.2 Community Resources.......................................... 17
7 Detailed Description.............................................. 811.3 Trademarks........................................................... 17
7.1 Overview................................................................... 811.4 Electrostatic Discharge Caution............................ 17
7.2 Functional Block Diagram......................................... 811.5 Glossary................................................................ 17
7.3 Feature Description................................................... 912 Mechanical, Packaging, and Orderable
7.4 Device Functional Modes........................................ 11 Information ........................................................... 17
8 Application and Implementation ........................ 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (March 2015) to Revision E Page
• Updated Features bullets to include specifications for other packages................................................................................. 1
• Added note back to Pin Functions regarding the different I/O types ..................................................................................... 3
• Corrected the device name and current regulation description in Overview ......................................................................... 8
• Corrected output current to 1.5-A RMS from 700-mA RMS .................................................................................................. 8
Changes from Revision C (January 2013) to Revision D Page
• Added ESD Ratings table,Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
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1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
AIN1
AIN2
VINT
GND
VM
VCP
BIN2
BIN1
BOUT1
nFAULT
BOUT2
BISEN
AISEN
AOUT2
AOUT1
nSLEEP
1
2
3
4
5 6 7
8
16 15 14 13
12
11
10
9
GND
(PPAD)
AOUT1
nSLEEP
AIN1
AIN2
VINT
GND
VM
VCP
BIN1
BIN2
BOUT1
nFAULT
BOUT2
BISEN
AOUT2
AISEN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
(PPAD)
AIN1
AIN2
VINT
GND
VM
VCP
BIN2
BIN1
BOUT1
nFAULT
BOUT2
BISEN
AISEN
AOUT2
AOUT1
nSLEEP
DRV8833
www.ti.com SLVSAR1E –JANUARY 2011–REVISED JULY 2015
5 Pin Configuration and Functions
PWP Package RTY Package
16-Pin HTSSOP 16-Pin WQFN
Top View Top View
PW Package
16-Pin TSSOP
Top View
Pin Functions
PIN EXTERNAL COMPONENTS
I/O(1) DESCRIPTION
HTSSOP, OR CONNECTIONS
NAME WQFN TSSOP
POWER AND GROUND
11 Device ground. HTSSOP package Both the GND pin and device PowerPAD
GND 13 —
PPAD has PowerPAD. must be connected to ground.
Bypass to GND with 2.2-μF, 6.3-V
VINT 12 14 — Internal supply bypass capacitor.
Connect to motor supply. A 10-µF
VM 10 12 — Device power supply (minimum) ceramic bypass capacitor to
GND is recommended.
Connect a 0.01-μF, 16-V (minimum) X7R
VCP 9 11 IO High-side gate drive voltage ceramic capacitor to VM.
CONTROL
Logic input controls state of AOUT1.
AIN1 14 16 I Bridge A input 1 Internal pulldown.
Logic input controls state of AOUT2.
AIN2 13 15 I Bridge A input 2 Internal pulldown.
Logic input controls state of BOUT1.
BIN1 7 9 I Bridge B input 1 Internal pulldown.
Logic input controls state of BOUT2.
BIN2 8 10 I Bridge B input 2 Internal pulldown.
Logic high to enable device, logic low to
nSLEEP 15 1 I Sleep mode input enter low-power sleep mode and reset all
internal logic. Internal pulldown.
(1) I = Input, O = Output, OZ = Tri-state output, OD = Open-drain output, IO = Input/output
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Pin Functions (continued)
PIN EXTERNAL COMPONENTS
I/O(1) DESCRIPTION
HTSSOP, OR CONNECTIONS
NAME WQFN TSSOP
STATUS
Logic low when in fault condition
nFAULT 6 8 OD Fault output (overtemperature, overcurrent)
OUTPUT
Connect to current sense resistor for bridge
AISEN 1 3 IO Bridge A ground / ISENSE A, or GND if current control not needed
Connect to current sense resistor for bridge
BISEN 4 6 IO Bridge B ground / ISENSE B, or GND if current control not needed
AOUT1 16 2 O Bridge A output 1 Connect to motor winding A
AOUT2 2 4 O Bridge A output 2
BOUT1 5 7 O Bridge B output 1 Connect to motor winding B
BOUT2 3 5 O Bridge B output 2
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VM Power supply voltage –0.3 11.8 V
Digital input pin voltage –0.5 7 V
xISEN pin voltage –0.3 0.5 V
Peak motor drive output current Internally limited A
TJOperating junction temperature –40 150 °C
Tstg Storage temperature –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000
Electrostatic
V(ESD) V
Charged device model (CDM), per JEDEC specification JESD22-C101, all
discharge ±1500
pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
TA= 25°C (unless otherwise noted) MIN NOM MAX UNIT
VMMotor power supply voltage range(1) 2.7 10.8 V
VDIGIN Digital input pin voltage range –0.3 5.75 V
IOUT RTY package continuous RMS or DC output current per bridge(2) 1.5 A
(1) RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.
(2) VM= 5 V, power dissipation and thermal limits must be observed.
6.4 Thermal Information DRV8833
PWP RTY PW
THERMAL METRIC(1) UNIT
(HTSSOP) (WQFN) (TSSOP)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 40.5 37.2 103.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32.9 34.3 38 °C/W
RθJB Junction-to-board thermal resistance 28.8 15.3 48.1 °C/W
ψJT Junction-to-top characterization parameter 0.6 0.3 3 °C/W
ψJB Junction-to-board characterization parameter 11.5 15.4 47.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.8 3.5 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SUPPLY
IVM VM operating supply current VM= 5 V, xIN1 = 0 V, xIN2 = 0 V 1.7 3 mA
IVMQ VM sleep mode supply current VM= 5 V 1.6 2.5 μA
VUVLO VM undervoltage lockout voltage VMfalling 2.6 V
VM undervoltage lockout
VHYS 90 mV
hysteresis
LOGIC-LEVEL INPUTS
nSLEEP 0.5
VIL Input low voltage V
All other pins 0.7
nSLEEP 2.5
VIH Input high voltage V
All other pins 2
VHYS Input hysteresis 0.4 V
nSLEEP 500
RPD Input pulldown resistance kΩ
All except nSLEEP 150
IIL Input low current VIN = 0 1 μA
VIN = 3.3 V, nSLEEP 6.6 13
IIH Input high current μA
VIN = 3.3 V, all except nSLEEP 16.5 33
tDEG Input deglitch time 450 ns
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOL Output low voltage IO= 5 mA 0.5 V
IOH Output high leakage current VO= 3.3 V 1 μA
H-BRIDGE FETs
VM= 5 V, I O= 500 mA, TJ= 25°C 200
VM= 5 V, IO= 500 mA, TJ= 85°C 325
HS FET on resistance VM= 2.7 V, I O= 500 mA, TJ= 25°C 250
VM= 2.7 V, IO= 500 mA, TJ= 85°C 350
RDS(ON) mΩ
VM= 5 V, I O= 500 mA, TJ= 25°C 160
VM= 5 V, IO= 500 mA, TJ= 85°C 275
LS FET on resistance VM= 2.7 V, I O= 500 mA, TJ= 25°C 200
VM= 2.7 V, IO= 500 mA, TJ= 85°C 300
IOFF Off-state leakage current VM= 5 V, TJ= 25°C, VOUT = 0 V –1 1 μA
MOTOR DRIVER
ƒPWM Current control PWM frequency Internal PWM frequency 50 kHz
tRRise time VM= 5 V, 16 Ωto GND, 10% to 90% VM180 ns
tFFall time VM= 5 V, 16 Ωto GND, 10% to 90% VM160 ns
tPROP Propagation delay INx to OUTx VM= 5 V 1.1 µs
tDEAD Dead time(1) VM= 5 V 450 ns
PROTECTION CIRCUITS
IOCP Overcurrent protection trip level 2 3.3 A
tDEG OCP Deglitch time 4 µs
tOCP Overcurrent protection period 1.35 ms
tTSD Thermal shutdown temperature Die temperature 150 160 180 °C
(1) Internal dead time. External implementation is not necessary.
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0
100
200
300
400
500
600
700
800
2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8
RDS(ON) (HS + LS) (m)
VVM (V)
-40°C
25°C
85°C
C004
0
100
200
300
400
500
600
700
800
±40 ±30 ±20 ±10 0 10 20 30 40 50 60 70 80
RDS(ON) (HS + LS) (m)
Temperature (C)
2.7 V
5 V
10.8 V
C003
0.0
0.5
1.0
1.5
2.0
2.5
3.0
2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8
IVM (mA)
VVM (V)
±40C
25°C
85°C
C001
±5.0
0.0
5.0
10.0
15.0
20.0
25.0
2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8
IVMQ (uA)
VVM (V)
±40C
25°C
85°C
C002
DRV8833
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Electrical Characteristics (continued)
TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CURRENT CONTROL
VTRIP xISEN trip voltage 160 200 240 mV
tBLANK Current sense blanking time 3.75 µs
SLEEP MODE
tWAKE Start-up time nSLEEP inactive high to H-bridge on 1 ms
6.6 Typical Characteristics
Figure 2. Sleep Current
Figure 1. Operating Current
Figure 3. RDS(on) (HS + LS) Figure 4. RDS(on) (HS + LS)
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Over-
Temp
AOUT1
GND
AIN1
VM
Logic
AOUT2
VM
Gate
Drive
&
OCP
BOUT1
VM
BOUT2
VM
Gate
Drive
&
OCP
BISEN
AISEN
Step
Motor
Drives 2x DC motor
or 1x Stepper
ISEN
ISEN
AIN2
BIN1
BIN2
Charge
Pump
0.01uF
VM
VM VCP
VM
Internal
Ref &
Regs
VINT
DCM
DCM
nFAULT
nSLEEP
2.2uF
10uF
DRV8833
SLVSAR1E –JANUARY 2011–REVISED JULY 2015 www.ti.com
7 Detailed Description
7.1 Overview
The DRV8833 device is an integrated motor driver solution for brushed DC or bipolar stepper motors. The device
integrates two NMOS H-bridges and current regulation circuitry. The DRV8833 can be powered with a supply
voltage from 2.7 to 10.8 V and can provide an output current up to 1.5-A RMS.
A simple PWM interface allows easy interfacing to the controller circuit.
The current regulation is a fixed frequency PWM slow decay.
The device includes a low-power sleep mode, which lets the system save power when not driving the motor.
7.2 Functional Block Diagram
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xOUT1
xOUT2
VM
xISEN
xIN2
Pre-
drive
VCP, VINT
VM
+
-
PWM
OCP
OCP
xIN1
REF (200mV)
DCM
Optional
DRV8833
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7.3 Feature Description
7.3.1 Fixed-Frequency PWM Motor Drivers
DRV8833 contains two identical H-bridge motor drivers with current-control PWM circuitry. Figure 5 shows a
block diagram of the circuitry.
Figure 5. Motor Control Circuitry
7.3.2 Bridge Control and Decay Modes
The AIN1 and AIN2 input pins control the state of the AOUT1 and AOUT2 outputs; similarly, the BIN1 and BIN2
input pins control the state of the BOUT1 and BOUT2 outputs. Table 1 shows the logic.
Table 1. H-Bridge Logic
xIN1 xIN2 xOUT1 xOUT2 FUNCTION
Coast/fast
0 0 Z Z decay
0 1 L H Reverse
1 0 H L Forward
Brake/slow
1 1 L L decay
The inputs can also be used for PWM control of the motor speed. When controlling a winding with PWM, when
the drive current is interrupted, the inductive nature of the motor requires that the current must continue to flow.
This is called recirculation current. To handle this recirculation current, the H-bridge can operate in two different
states: fast decay or slow decay. In fast decay mode, the H-bridge is disabled and recirculation current flows
through the body diodes; in slow decay, the motor winding is shorted.
To PWM using fast decay, the PWM signal is applied to one xIN pin while the other is held low; to use slow
decay, one xIN pin is held high.
Table 2. PWM Control of Motor Speed
xIN1 xIN2 FUNCTION
PWM 0 Forward PWM, fast decay
1 PWM Forward PWM, slow decay
0 PWM Reverse PWM, fast decay
PWM 1 Reverse PWM, slow decay
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CHOP ISENSE
200 mV
IR
xOUT1 xOUT2
1
2
3
Forward drive
Slow decay
Fast decay
VM
1
2
1
2
3
Reverse drive
Slow decay
Fast decay
xOUT1 xOUT2
3
VM
1
2
3
FORWARD REVERSE
DRV8833
SLVSAR1E –JANUARY 2011–REVISED JULY 2015 www.ti.com
Figure 6 shows the current paths in different drive and decay modes.
Figure 6. Drive and Decay Modes
7.3.3 Current Control
The current through the motor windings may be limited, or controlled, by a fixed-frequency PWM current
regulation, or current chopping. For DC motors, current control is used to limit the start-up and stall current of the
motor. For stepper motors, current control is often used at all times.
When an H-bridge is enabled, current rises through the winding at a rate dependent on the DC voltage and
inductance of the winding. If the current reaches the current chopping threshold, the bridge disables the current
until the beginning of the next PWM cycle. Immediately after the current is enabled, the voltage on the xISEN pin
is ignored for a fixed period of time before enabling the current sense circuitry. This blanking time is fixed at 3.75
μs. This blanking time also sets the minimum on time of the PWM when operating in current chopping mode.
The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor
connected to the xISEN pins with a reference voltage. The reference voltage is fixed at 200 mV.
The chopping current is calculated in Equation 1.
(1)
Example: If a 1-Ωsense resistor is used, the chopping current will be 200 mV/1 Ω= 200 mA.
Once the chopping current threshold is reached, the H-bridge switches to slow decay mode. Winding current is
recirculated by enabling both of the low-side FETs in the bridge. This state is held until the beginning of the next
fixed-frequency PWM cycle.
If current control is not needed, the xISEN pins should be connected directly to ground.
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