Ublox LEON-G100 ECALL Quick setup guide

LEON-G100 / LEON-G200
quad-band GSM/GPRS
Data and Voice Modules
System Integration Manual
29.5 x 18.9 x 3.0 mm
www.u-blox.com
locate, communicate, accelerate
Abstract
This document describes the features and integration of the
LEON-G100/G200 quad-band GSM/GPRS data and voice modules.
The LEON-G100/G200 are complete and cost efficient solutions,
bringing full feature quad-band GSM/GPRS data and voice
transmission technology in a compact form factor.

LEON-G100 / LEON-G200 - System Integration Manual
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Page 2 of 125
Document Information
Title
LEON-G100 / LEON-G200
Subtitle
quad-band GSM/GPRS
Data and Voice Modules
Document type
System Integration Manual
Document number
GSM.G1-HW-09002-G3
Document status
Preliminary
Document status information
Objective
Specification
This document contains target values. Revised and supplementary data will be published
later.
Advance
Information
This document contains data based on early testing. Revised and supplementary data will
be published later.
Preliminary
This document contains data from product verification. Revised and supplementary data
may be published later.
Released
This document contains the final product specification.
This document applies to the following products:
Name
Type number
Firmware version
PCN / IN
LEON-G100
LEON-G100-04S-00
LEON-G100-05S-00
LEON-G100-06S-00
LEON-G100-06S-01
LEON-G100-07S-00
LEON-G100-08S-00
LEON-G100-06A-00
LEON-G100-07A-00
07.40.00
07.50.00
07.60.00
07.60.02
07.70
07.83
07.60.00
07.70
GSM.G1-SW-10007
GSM.G1-SW-10008
GSM.G1-SW-10012
GSM.G1-SW-10013
GSM.G1-SW-12002
UBX-TN-13001
GSM.G1-SW-10012
GSM.G1-SW-12002
LEON-G100 ECALL
LEON-G100-71S-00
TBD
TBD
LEON-G200
LEON-G200-04S-00
LEON-G200-05S-00
LEON-G200-06S-00
LEON-G200-06S-01
07.40.00
07.50.00
07.60.00
07.60.02
GSM.G1-SW-10007
GSM.G1-SW-10008
GSM.G1-SW-10012
GSM.G1-SW-10013
This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They
can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make
changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without
express permission is strictly prohibited. Copyright © 2013, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries.
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other
countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.

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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
AT Commands Manual: This document provides the description of the supported AT commands by the LEON
GSM/GPRS Voice and Data Modules to verify all implemented functionalities.
System Integration Manual: This Manual provides hardware design instructions and information on how to
set up production and final product tests.
Application Note: document provides general design instructions and information that applies to all u-blox
Wireless modules. See Section Related documents for a list of Application Notes related to your Wireless
Module.
How to use this Manual
The LEON-G100 / LEON-G200 System Integration Manual provides the necessary information to successfully
design in and configure these u-blox wireless modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox Wireless Integration, please:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com
Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
Contact the nearest of the Technical Support offices by email. Use our service pool email addresses rather than
any personal email address of our staff. This makes sure that your request is processed as soon as possible. You
will find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
Module type (e.g. LEON-G100) and firmware version
Module configuration
Clear description of your question or the problem
A short description of the application
Your complete contact details

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Contents
Preface ................................................................................................................................3
Contents..............................................................................................................................4
1System description .......................................................................................................7
1.1 Overview .............................................................................................................................................. 7
1.2 Architecture.......................................................................................................................................... 8
1.2.1 Functional blocks........................................................................................................................... 9
1.2.2 Hardware differences between LEON-G100 and LEON-G200 ...................................................... 10
1.3 Pin-out ............................................................................................................................................... 10
1.4 Operating modes................................................................................................................................ 13
1.5 Power management ........................................................................................................................... 15
1.5.1 Power supply circuit overview...................................................................................................... 15
1.5.2 Module supply (VCC) .................................................................................................................. 16
1.5.3 Current consumption profiles ...................................................................................................... 23
1.5.4 Battery charger (LEON-G200 only) ............................................................................................... 26
1.5.5 RTC Supply (V_BCKP) .................................................................................................................. 31
1.6 System functions ................................................................................................................................ 32
1.6.1 Module power on ....................................................................................................................... 32
1.6.2 Module power off ....................................................................................................................... 36
1.6.3 Module reset ............................................................................................................................... 37
1.6.4 Note: Tri-stated external signal .................................................................................................... 40
1.7 RF connection..................................................................................................................................... 40
1.8 SIM interface ...................................................................................................................................... 41
1.8.1 SIM functionality ......................................................................................................................... 42
1.9 Serial Communication......................................................................................................................... 43
1.9.1 Asynchronous serial interface (UART)........................................................................................... 43
1.9.2 DDC (I2C) interface ...................................................................................................................... 55
1.10 Audio.............................................................................................................................................. 60
1.10.1 Analog Audio interface ............................................................................................................... 60
1.10.2 Digital Audio interface................................................................................................................. 66
1.10.3 Voice-band processing system ..................................................................................................... 69
1.11 ADC input (LEON-G100 only).......................................................................................................... 70
1.11.1 ADC Calibration .......................................................................................................................... 71
1.12 General Purpose Input/Output (GPIO) ............................................................................................. 73
1.12.1 LEON-G100-06x / LEON-G200-06S and subsequent versions ....................................................... 73
1.12.2 LEON-Gx00-04S and LEON-Gx00-05S versions ............................................................................ 75
1.13 Schematic for module integration ................................................................................................... 79
1.14 Approvals........................................................................................................................................ 80
1.14.1 Compliance with FCC and IC Rules and Regulations.................................................................... 80
2Design-In.....................................................................................................................83

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2.1 Design-in checklist .............................................................................................................................. 83
2.1.1 Schematic checklist ..................................................................................................................... 83
2.1.2 Layout checklist ........................................................................................................................... 83
2.1.3 Antenna checklist ........................................................................................................................ 84
2.2 Design Guidelines for Layout .............................................................................................................. 84
2.2.1 Layout guidelines per pin function............................................................................................... 84
2.2.2 Footprint and paste mask ............................................................................................................ 90
2.2.3 Placement ................................................................................................................................... 92
2.3 Module thermal resistance.................................................................................................................. 92
2.4 Antenna guidelines............................................................................................................................. 93
2.4.1 Antenna termination ................................................................................................................... 94
2.4.2 Antenna radiation ....................................................................................................................... 95
2.4.3 Antenna detection functionality .................................................................................................. 97
2.5 ESD Immunity Test Precautions ........................................................................................................... 99
2.5.1 General precautions .................................................................................................................. 100
2.5.2 Antenna interface precautions................................................................................................... 102
2.5.3 Module interfaces precautions................................................................................................... 103
3Feature description ..................................................................................................104
3.1 Firmware (upgrade) Over The Air (FOTA) (LEON-G200 only).............................................................. 104
3.2 Firmware (upgrade) Over AT (FOAT) ................................................................................................. 104
3.2.1 Overview ................................................................................................................................... 104
3.2.2 FOAT procedure ........................................................................................................................ 104
3.3 Firewall............................................................................................................................................. 104
3.4 TCP/IP............................................................................................................................................... 104
3.4.1 Multiple IP addresses and sockets .............................................................................................. 104
3.5 FTP ................................................................................................................................................... 105
3.6 HTTP................................................................................................................................................. 105
3.7 SMTP................................................................................................................................................ 105
3.8 GPS .................................................................................................................................................. 105
3.9 Jamming detection ........................................................................................................................... 105
3.10 Smart Temperature Management ................................................................................................. 106
3.10.1 Smart Temperature Supervisor (STS) .......................................................................................... 106
3.10.2 Threshold Definitions................................................................................................................. 108
3.11 Hybrid positioning and CellLocateTM .............................................................................................. 108
3.11.1 Positioning through cellular information: CellLocateTM ............................................................... 108
3.11.2 Hybrid positioning ..................................................................................................................... 110
4Handling and soldering ...........................................................................................111
4.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 111
4.2 Soldering .......................................................................................................................................... 111
4.2.1 Soldering paste.......................................................................................................................... 111
4.2.2 Reflow soldering ....................................................................................................................... 111
4.2.3 Optical inspection...................................................................................................................... 113
4.2.4 Cleaning.................................................................................................................................... 113

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4.2.5 Repeated reflow soldering......................................................................................................... 113
4.2.6 Wave soldering.......................................................................................................................... 113
4.2.7 Hand soldering .......................................................................................................................... 113
4.2.8 Rework...................................................................................................................................... 113
4.2.9 Conformal coating .................................................................................................................... 113
4.2.10 Casting...................................................................................................................................... 114
4.2.11 Grounding metal covers ............................................................................................................ 114
4.2.12 Use of ultrasonic processes........................................................................................................ 114
5Product Testing.........................................................................................................115
5.1 u-blox in-series production test......................................................................................................... 115
5.2 Test parameters for OEM manufacturer ............................................................................................ 115
5.2.1 ‘Go/No go’ tests for integrated devices...................................................................................... 116
5.2.2 Functional tests providing RF operation ..................................................................................... 116
AGlossary ....................................................................................................................119
Related documents.........................................................................................................121
Revision history..............................................................................................................122
Contact............................................................................................................................125

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1System description
1.1 Overview
LEON-G100/LEON-G200 GSM/GPRS modules integrate a full-featured Release 99 GSM-GPRS protocol stack,
with the following main characteristics.
Quad-band support: GSM 850 MHz, EGSM 900 MHz, DCS 1800 MHz and PCS 1900 MHz
Power class 4 (33 dBm nominal maximum output power) for GSM/EGSM bands
Power class 1 (30 dBm nominal maximum output power) for DCS/PCS bands
GPRS multi-slot class 10
All GPRS coding schemes from CS1 to CS4 are supported
GPRS bit rate: 85.6 kb/s (max.), 53.6 kb/s (typ.) in down-link; 42.8 kb/s (max.), 26.8 kb/s (typ.) in up-link
CS (Circuit Switched) Data calls are supported in transparent/non transparent mode up to 9.6 kb/s
Encryption algorithms A5/1 for GSM and GPRS support
Bearer service fax Group 3 Class 2.0 support
Class B Mobile Stations (i.e. the data module can be attached to both GPRS and GSM services, using one
service at a time)
Network operation modes I to III are supported
GPRS multi-slot class determines the maximum number of timeslots available for upload and download and thus
the speed at which data can be transmitted and received: higher classes typically allow faster data transfer rates.
GPRS multi-slot class 10 uses a maximum of 4 slots in download (reception) and 2 slots in upload (transmission),
with 5 slots in total.
The network automatically configures the number of timeslots used for reception or transmission (voice calls
take precedence over GPRS traffic). The network also automatically configures channel encoding (CS1 to CS4).
The maximum GPRS bit rate of the mobile station depends on the coding scheme and number of time slots.

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1.2 Architecture
Memory UART
2 Analog Audio
DDC (for GPS)
GPIO
ADC
SIM Card
Vcc
V_BCKP
Power-On
Reset
26 MHz 32.768 kHz
Headset Detection
RF
Transceiver
Power
Management
Baseband
ANT SAW
Filter
Switch
PA
Digital Audio
Figure 1: LEON-G100 block diagram
Memory
Vcc
V_BCKP
26 MHz 32.768 kHz
Charger
RF
Transceiver
Power
Management
Baseband
ANT SAW
Filter
Switch
PA
UART
2 Analog Audio
DDC (for GPS)
GPIO
SIM Card
Power-On
Reset
Headset Detection
Digital Audio
Figure 2: LEON-G200 block diagram

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1.2.1 Functional blocks
LEON-G100/LEON-G200 modules consist of the following functional blocks:
RF
Baseband
Power Management
1.2.1.1 RF
The RF block is composed of the following main elements:
RF transceiver (integrated in the GSM/GPRS single chip) performing modulation, up-conversion of the
baseband I/Q signals, down-conversion and demodulation of the RF received signals. The RF transceiver
includes:
Constant gain direct conversion receiver with integrated LNAs;
Highly linear RF quadrature demodulator;
Digital Sigma-Delta transmitter modulator;
Fractional-N Sigma-Delta RF synthesizer;
3.8 GHz VCO;
Digital controlled crystal oscillator.
Transmit module, which amplifies the signals modulated by the RF transceiver and connects the single
antenna input/output pin of the module to the suitable RX/TX path, via its integrated parts:
Power amplifier;
Antenna switch;
RX diplexer SAW (band pass) filters
26 MHz crystal, connected to the digital controlled crystal oscillator to perform the clock reference in active
or connected mode
1.2.1.2 Baseband
The Baseband block is composed of the following main elements:
Baseband integrated in the GSM/GPRS single chip, including:
Microprocessor;
DSP (for GSM/GPRS Layer 1 and audio processing);
Peripheral blocks (for parallel control of the digital interfaces);
Audio analog front-end;
Memory system in a multi-chip package integrating two devices:
NOR flash non-volatile memory;
PSRAM volatile memory;
32.768 kHz crystal, connected to the oscillator of the RTC to perform the clock reference in idle or power-
off mode
1.2.1.3 Power Management
The Power Management block is composed of the following main elements:
Voltage regulators integrated in the GSM/GPRS single chip for direct connection to battery
Charging control circuitry

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1.2.2 Hardware differences between LEON-G100 and LEON-G200
Hardware differences between the LEON-G100 and the LEON-G200 modules:
Charging control circuitry is available on the LEON-G200 module only
ADC input is provided on the LEON-G100 module only
1.3 Pin-out
Table 1 describes the pin-out of LEON-G100/LEON-G200 modules, with pins grouped by function.
Function
Pin
No
I/O
Description
Remarks
Power
VCC
50
I
Module Supply
Clean and stable supply is required: low ripple and
low voltage drop must be guaranteed.
Voltage provided has to be always above the
minimum limit of the operating range.
Consider that there are large current spike in
connected mode, when a GSM call is enabled.
See section 1.5.2
GND
1, 3, 6,
7, 8, 17,
25, 36,
45, 46,
48, 49
N/A
Ground
GND pins are internally connected but good (low
impedance) external ground can improve RF
performances: all GND pins must be externally
connected to ground
V_BCKP
2
I/O
Real Time Clock supply
V_BCKP = 2.0 V (typical) generated by the module
to supply Real Time Clock when VCC supply
voltage is within valid operating range.
See section 1.5.5
VSIM
35
O
SIM supply
SIM supply automatically generated by the
module.
See section 1.8
V_CHARGE
(LEON-G200-xx)
4
I
Charger voltage supply
input
V_CHARGE and CHARGE_SENSE must be
externally connected.
The external supply used as charging source must
be voltage and current limited.
See section 1.5.4
CHARGE_SENSE
(LEON-G200-xx)
5
I
Charger voltage
measurement input
V_CHARGE and CHARGE_SENSE must be
externally connected.
The external supply used as charging source must
be voltage and current limited.
See section 1.5.4
RF
ANT
47
I/O
RF antenna
50 nominal impedance.
See section 1.7, 2.2.1.1 and 2.4
Audio
HS_DET
(LEON-Gx00-05S
or previous)
18
I
Headset detection input
Internal active pull-up to 2.85 V enabled.
See section 1.10.1.3
HS_DET
(LEON-G100-06x
LEON-G200-06S
or subsequent)
18
I/O
GPIO
Internal active pull-up to 2.85 V enabled when the
“headset detection” function is enabled (default).
See section 1.12 and section 1.10.1.3
I2S_WA
26
O
I2S word alignment
Check device specifications to ensure compatibility
of supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.

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Function
Pin
No
I/O
Description
Remarks
I2S_TXD
27
O
I2S transmit data
Check device specifications to ensure compatibility
of supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
I2S_CLK
28
O
I2S clock
Check device specifications to ensure compatibility
of supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
I2S_RXD
29
I
I2S receive data
Internal active pull-up to 2.85 V enabled. Check
device specifications to ensure compatibility of
supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
HS_P
37
O
First speaker output
with low power single-
ended analog audio
This audio output is used when audio downlink
path is “Normal earpiece“ or “Mono headset“.
See section 1.10.1
SPK_P
38
O
Second speaker output
with high power
differential analog audio
This audio output is used when audio downlink
path is “Loudspeaker“.
See section 1.10.1
SPK_N
39
O
Second speaker output
with power differential
analog audio output
This audio output is used when audio downlink
path is “Loudspeaker“.
See section 1.10.1
MIC_BIAS2
41
I
Second microphone
analog signal input and
bias output
This audio input is used when audio uplink path is
set as “Headset Microphone“.
See section 1.10.1
MIC_GND2
42
I
Second microphone
analog reference
Local ground of second microphone.
See section 1.10.1
MIC_GND1
43
I
First microphone analog
reference
Local ground of the first microphone.
See section 1.10.1
MIC_BIAS1
44
I
First microphone analog
signal input and bias
output
This audio input is used when audio uplink path is
set as “Handset Microphone“.
See section 1.10.1
SIM
SIM_CLK
32
O
SIM clock
Must meet SIM specifications
See section 1.8.
SIM_IO
33
I/O
SIM data
Internal 4.7k pull-up to VSIM.
Must meet SIM specifications
See section 1.8.
SIM_RST
34
O
SIM reset
Must meet SIM specifications
See section 1.8.
UART
DSR
9
O
UART data set ready
Circuit 107 (DSR) in V.24.
See section 1.9.1.
RI
10
O
UART ring indicator
Circuit 125 (RI) in V.24.
See section 1.9.1.
DCD
11
O
UART data carrier detect
Circuit 109 (DCD) in V.24.
See section 1.9.1.
DTR
12
I
UART data terminal
ready
Internal active pull-up to 2.85 V enabled.
Circuit 108/2 (DTR) in V.24.
See section 1.9.1.
RTS
13
I
UART ready to send
Internal active pull-up to 2.85 V enabled.
Circuit 105 (RTS) in V.24.
See section 1.9.1.
CTS
14
O
UART clear to send
Circuit 106 (CTS) in V.24.
See section 1.9.1.

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Function
Pin
No
I/O
Description
Remarks
TxD
15
I
UART transmitted data
Internal active pull-up to 2.85 V enabled.
Circuit 103 (TxD) in V.24.
See section 1.9.1.
RxD
16
O
UART received data
Circuit 104 (RxD) in V.24. See section 1.9.1.
DDC
SCL
30
O
I2C bus clock line
Fixed open drain. External pull-up required.
See section 1.9.2
SDA
31
I/O
I2C bus data line
Fixed open drain. External pull-up required.
See section 1.9.2
ADC
ADC1
(LEON-G100-xx)
5
I
ADC input
Resolution: 12 bits.
Consider that the impedance of this input changes
depending on the operative mode
See section 1.11
GPIO
GPIO1
20
I/O
GPIO
Add a test point to provide access to the pin for
debugging.
See section 1.12
GPIO2
21
I/O
GPIO
See section 1.12 and section 1.9.2
GPIO3
(LEON-G100-06x
LEON-G200-06S
or subsequent)
23
I/O
GPIO
See section 1.12 and section 1.9.2
GPIO4
(LEON-G100-06x
LEON-G200-06S
or subsequent)
24
I/O
GPIO
See section 1.12 and section 1.9.2
System
PWR_ON
19
I
Power-on input
PWR_ON pin has high input impedance.
Do not keep floating in noisy environment:
external pull-up required.
See section 1.6.1
RESET_N
22
I/O
Reset signal
See section 1.6.3
Reserved
Reserved
(LEON-Gx00-05S
or previous)
23
Do not connect
Reserved
(LEON-Gx00-05S
or previous)
24
Do not connect
Reserved
40
Do not connect
Reserved
(LEON-G100-xx)
4
Do not connect
Table 1: LEON-G100 / LEON-G200 pin-out

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1.4 Operating modes
LEON-G100/LEON-G200 modules include several operating modes, each have different features and interfaces.
Table 2 summarizes the various operating modes and provides general guidelines for operation.
Operating Mode
Description
Features / Remarks
Transition condition
General Status: Power-down
Not-Powered
Mode
VCC supply not present or
below normal operating
range.
Microprocessor switched off
(not operating).
RTC only operates if supplied
through V_BCKP pin.
Module is switched off.
Application interfaces are not accessible.
Internal RTC timer operates only if a valid
voltage is applied to V_BCKP pin.
Any external signal connected to the
UART I/F, I2S I/F, HS_DET, GPIOs must be
tristated to avoid an increase of module
power-off consumption.
Module cannot be switched on by a
falling edge provided on the PWR_ON
input, neither by a preset RTC alarm, nor
by charger detection on the V_CHARGE
and CHARGE_SENSE pins.
Power-Off Mode
VCC supply within normal
operating range.
Microprocessor not
operating.
Only RTC runs.
Module is switched off: normal
shutdown after sending the
AT+CPWROFF command (refer to u-blox
AT Commands Manual [2]).
Application interfaces are not accessible.
Only internal RTC timer in operation.
Any external signal connected to the
UART I/F, I2S I/F, HS_DET, GPIOs must be
tristated to avoid an increase of the
module power-off consumption.
Module can be switched on by a falling
edge provided on the PWR_ON input, by
a preset RTC alarm, or by charger
detection on the V_CHARGE and
CHARGE_SENSE pins.
General Status: Normal Operation
Idle-Mode
Microprocessor runs with
32 kHz as reference oscillator.
Module does not accept data
signals from an external
device.
If power saving is enabled, the module
automatically enters idle mode whenever
possible.
If hardware flow control is enabled, the
CTS line indicates that the module is in
active-mode and the UART interface is
enabled: the line is driven in the OFF
state when the module is not prepared
to accept data by the UART interface.
If hardware flow control is disabled, the
CTS line is fixed to ON state.
Module by default is not set to
automatically enter idle mode whenever
possible, unless power saving
configuration is enabled by appropriate
AT command (refer to u-blox AT
Commands Manual [2], AT+UPSV).
If the module is registered with the
network and power saving is enabled, it
automatically enters idle mode and
periodically wakes up to active mode to
monitor the paging channel for the
paging block reception according to
network indication.
If module is not registered with the
network and power saving is enabled, it
automatically enters idle mode and
periodically wakes up to monitor external
activity.
Module wakes up from idle-mode to
active-mode for an incoming voice or
data call.
Module wakes up from idle mode to
active mode if an RTC alarm occurs.
Module wakes up from idle mode to
active mode when data is received on
UART interface (refer to 1.9.1 section).
Module wakes up from idle mode to
active mode when the RTS input line is
set to the ON state by the DTE if the
AT+UPSV=2 command is sent to the
module (refer to 1.9.1 section).
Active-Mode
Microprocessor runs with
26 MHz as reference
oscillator.
The module is ready to accept
data signals from an external
device.
Module is switched on and is fully active:
power saving is not enabled.
The application interfaces are enabled.
If power saving is enabled, the module
automatically enters idle mode whenever
possible.

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Operating Mode
Description
Features / Remarks
Transition condition
Connected-Mode
Voice or data call enabled.
Microprocessor runs with
26 MHz as reference
oscillator.
The module is ready to accept
data signals from an external
device.
The module is switched on and a voice
call or a data call (GSM/GPRS) is in
progress.
Module is fully active.
Application interfaces are enabled.
When call terminates, module returns to
the last operating state (Idle or Active).
General Status: Charging (LEON-G200 only)
Pre-charge mode
Battery connected to VCC.
Battery voltage level is below
the VCC normal operating
range.
Charger connected to
V_CHARGE and
CHARGE_SENSE inputs with
proper voltage and current
characteristics.
Charging of the deeply
discharged battery is enabled
while the module is switched
off.
Microprocessor switched off
(not operating).
Module is switched off and cannot be
switched on (not powered mode).
The Pre-Charge phase of the charging
process is enabled: charging of the
deeply discharged battery is forced by
HW at low current while the module is
switched off
When battery voltage level reaches the
VCC normal operating range with a
charger connected to V_CHARGE and
CHARGE_SENSE inputs, the module
enters charge mode.
Charge-mode
Battery connected to VCC.
Battery voltage level is within
the VCC normal operating
range.
Charger connected to
V_CHARGE and
CHARGE_SENSE inputs with
proper voltage and current
characteristics.
Charging process enabled
while the module is switched
on and normal operations are
enabled.
Microprocessor runs with
32 kHz or 26 MHz as
reference oscillator.
Module is switched on and normal
operations are enabled (Idle mode,
Active mode or Connected mode).
The charging process is enabled:
charging of battery is controlled by the
microprocessor while the module is
switched on
When the charger is removed from
V_CHARGE and CHARGE_SENSE
inputs, the module returns to normal
operations (Idle-mode, Active-mode or
Connected-mode).
Table 2: Module operating modes summary

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1.5 Power management
1.5.1 Power supply circuit overview
V_BCKP
GSM/GPRS Chipset
PSRAM
NOR Flash
MCP Memory
4-Bands GSM FEM
Antenna
Switch
PA
LDOs BB
LDOs RF
RTC
LDO
LDO EBU
Charging Control
1 µF
1 µF
LDO
VSIM
VCC
LEON-G100 /
LEON-G200
2 x 22 µF
2
35
50
Figure 3: Power supply concept
Power supply is via VCC pin. This is the only main power supply pin.
VCC pin connects the RF Power Amplifier and the integrated power management unit within the module: all
supply voltages needed by the module are generated from the VCC supply by integrated voltage regulators.
V_BCKP is the Real Time Clock (RTC) supply. When the VCC voltage is within the specified extended operating
range, the module supplies the RTC: 2.0 V typical are generated by the module on the V_BCKP pin. If the VCC
voltage is under the minimum specified extended limit, the RTC can be externally supplied via V_BCKP pin.
When a 1.8 V or a 3 V SIM card type is connected, LEON-G100/LEON-G200 automatically supply the SIM card
via VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is
implemented, in accordance to the ISO-IEC 78-16-e specifications.
The integrated power management unit also provides the control state machine for system start up, including
start up with discharged batteries, pre-charging and system reset control.
LEON-G100/LEON-G200 feature a power management concept optimized for most efficient use of battery
power. This is achieved by hardware design utilizing power efficient circuit topology, and by power management
software controlling the power saving configuration of the module. Battery management runs in the context of
the operation and maintenance process:
Battery charging control, in order to maintain the full capacity of the battery
Collecting and processing of measurements of battery voltage

LEON-G100 / LEON-G200 - System Integration Manual
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1.5.2 Module supply (VCC)
LEON-G100/LEON-G200 modules must be supplied through VCC pin by a DC power supply. Voltages must be
stable, due to the surging consumption profile of the GSM system (described in the section 1.5.3).
Name
Description
Remarks
VCC
Module Supply
Clean and stable supply is required: low ripple and low
voltage drop must be guaranteed.
Voltage provided has to be always above the minimum limit
of the operating range.
Consider that there are large current spike in connected
mode, when a GSM call is enabled.
GND
Ground
GND pins are internally connected but good (low impedance)
external ground can improve RF performances: all GND pins
must be externally connected to ground.
Table 3: Module supply pins
VCC pin ESD sensitivity rating is 1 kV (HBM JESD22-A114F). A higher protection level could be required
if the line is externally accessible on the application board. A higher protection level can be achieved
mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this
pin if it is externally accessible on the application board.
The voltage provided to VCC pin must be within the normal operating range limits specified in the LEON-G100 /
LEON-G200 Data Sheet [1]. Complete functionality of the module is only guaranteed within the specified
operational normal voltage range.
The module cannot be switched on if the VCC voltage value is below the specified normal operating
range minimum limit: ensure that the input voltage at VCC pin is above the minimum limit of the
normal operating range for more than 1 second after the start of the switch-on of the module.
When LEON-G100/LEON-G200 modules are in operation, the voltage provided to VCC pin can exceed the
normal operating range limits but must be within the extended operating range limits specified in
LEON-G100/LEON-G200 Data Sheet [1]. Module reliability is only guaranteed within the specified operational
extended voltage range.
The module switches off when VCC voltage value drops below the specified extended operating range
minimum limit: ensure that the input voltage at VCC pin never drops below the minimum limit of the
extended operating range when the module is switched on, not even during a GSM transmit burst,
where the current consumption can rise up to maximum peaks of 2.5 A in case of a mismatched
antenna load.
Operation above the extended operating range maximum limit is not recommended and
extended exposure beyond it may affect device reliability.
Stress beyond the VCC absolute maximum ratings may cause permanent damage to the
module: if necessary, voltage spikes beyond VCC absolute maximum ratings must be limited to
values within the specified boundaries by using appropriate protection.

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GSM.G1-HW-09002-G3 Preliminary System description
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When designing the power supply for the application, pay specific attention to power losses and
transients. The DC power supply has to be able to provide a voltage profile to the VCC pin with the
following characteristics:
oVoltage drop during transmit slots has to be lower than 400 mV
oUndershoot and overshoot at the start and at the end of transmit slots have to be not present
oVoltage ripple during transmit slots has to be:
lower than 100 mVpp if fripple ≤200 kHz
lower than 10 mVpp if 200 kHz < fripple ≤400 kHz
lower than 2 mVpp if fripple > 400 kHz
Figure 4: Description of the VCC voltage profile versus time during a GSM call
Any degradation in power supply performance (due to losses, noise or transients) will directly affect the
RF performance of the module since the single external DC power source indirectly supplies all the
digital and analog interfaces, and also directly supplies the RF power amplifier (PA).
1.5.2.1 VCC application circuits
The LEON module must be supplied through the VCC pin by one (and only one) proper DC power supply from
the following:
Switching regulator
Low Drop-Out (LDO) linear regulator
Rechargeable Li-Ion battery
Primary (disposable) battery
Time
undershoot
overshoot
ripple
ripple
drop
Voltage
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
Time
undershoot
overshoot
ripple
ripple
drop
Voltage
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)

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GSM.G1-HW-09002-G3 Preliminary System description
Page 18 of 125
Main Supply
Available?
Battery
Li-Ion 3.7 V
Linear LDO
Regulator
Main Supply
Voltage >5 V?
Switching
Step-Down
Regulator
No, portable device
No, less than 5 V
Yes, greater than 5 V
Yes, always available
Figure 5: VCC supply concept selection
The switching step-down regulator is the typical choice when the available primary supply source has a nominal
voltage much higher (e.g. greater than 5 V) than the LEON-G100/LEON-G200 operating supply voltage. The use
of switching step-down provides the best power efficiency for the overall application and minimizes current
drawn from main supply source.
The use of an LDO linear regulator becomes convenient for primary supplies with relatively low voltage (e.g. less
than 5 V). In this case a switching regulator with a typical efficiency of 90% reduces the benefit of voltage
step-down for input current savings. Linear regulators are not recommended for high voltage step-down as they
will dissipate a considerable amount of power in thermal energy.
If the LEON-G100/LEON-G200 is deployed in a mobile unit with no permanent primary supply source available,
then a battery is required to provide VCC. A standard 3-cell Lithium-Ion battery pack directly connected to VCC
is the typical choice for battery-powered devices. Batteries with Ni-MH chemistry should be avoided, since they
typically reach a maximum voltage during charging that is above the maximum rating for VCC.
The use of primary (disposable) batteries is uncommon, since the typical cells available are seldom capable of
delivering the burst peak current for a GSM call due to high internal resistance.
The following sections highlight some design aspects for each of these supplies.
Switching regulator
The characteristics of the switching regulator connected to the VCC pin should meet the following requirements:
Power capabilities: the switching regulator with its output circuit must be capable of providing a proper
voltage value to the VCC pin and delivering 2.5 A current pulses with a 1/8 duty cycle to the VCC pin
Low output ripple: the switching regulator and output circuit must be capable of providing a clean (low
noise) VCC voltage profile
High switching frequency: for best performance and for smaller applications select a switching frequency
≥600 kHz (since an L-C output filter is typically smaller for high switching frequency). Using a switching
regulator with a variable switching frequency or with a switching frequency lower than 600 kHz must be
carefully evaluated since this can produce noise in the VCC voltage profile and therefore impact and worsen
GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator
output and the VCC supply pin can mitigate the ripple on VCC, but adds extra voltage drop due to resistive
losses in series inductors
PWM mode operation: select preferably regulators with Pulse Width Modulation (PWM) mode. Pulse
Frequency Modulation (PFM) mode and PFM/PWM mode transitions while in active mode must be avoided
to reduce the noise on the VCC voltage profile. Switching regulators able to switch between low ripple

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GSM.G1-HW-09002-G3 Preliminary System description
Page 19 of 125
PWM mode and high efficiency burst or PFM mode can be used, provided the mode transition occurs when
the GSM module changes status from idle mode (current consumption approximately 1 mA) to active mode
(current consumption approximately 100 mA): it is permissible to use a regulator that switches from the
PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA)
Figure 6 and the components listed in Table 4 show an example of a high reliability power supply circuit, where
the VCC module supply is provided by a step-down switching regulator capable to deliver 2.5 A current pulses,
with low output ripple, with 1 MHz fixed switching frequency in PWM mode operation. The use of a switching
regulator is suggested when the difference from the available supply rail and the VCC value is high: switching
regulators provide good efficiency transforming a 12 V supply to the 3.8 V typical value of the VCC supply. The
following power supply circuit example is implemented on the LEON Evaluation Board.
LEON-G100
LEON-G200
12V
C6
R3
C5
R2
C3C2
C1
R1
VIN
RUN
VC
RT
PG
SYNC
BD
BOOST
SW
FB
GND
6
7
10
9
5
C7
1
2
3
8
11
4
C8 C9
L2
D1 R4
R5
L1
C4
U1
50 VCC
GND
Figure 6: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator
Reference
Description
Part Number - Manufacturer
C1
47 µF Capacitor Aluminum 0810 50 V
MAL215371479E3 - Vishay
C2
10 µF Capacitor Ceramic X7R 5750 15% 50 V
C5750X7R1H106MB - TDK
C3
10 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C103KA01 - Murata
C4
680 pF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71H681KA01 - Murata
C5
22 pF Capacitor Ceramic COG 0402 5% 25 V
GRM1555C1H220JZ01 - Murata
C6
10 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C103KA01 - Murata
C7
470 nF Capacitor Ceramic X7R 0603 10% 25 V
GRM188R71E474KA12 - Murata
C8
22 µF Capacitor Ceramic X5R 1210 10% 25 V
GRM32ER61E226KE15 - Murata
C9
330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ
T520D337M006ATE045 - KEMET
D1
Schottky Diode 40 V 3 A
MBRA340T3G - ON Semiconductor
L1
10 µH Inductor 744066100 30% 3.6 A
744066100 - Wurth Electronics
L2
1 µH Inductor 7445601 20% 8.6 A
7445601 - Wurth Electronics
R1
470 kΩResistor 0402 5% 0.1 W
2322-705-87474-L - Yageo
R2
15 kΩResistor 0402 5% 0.1 W
2322-705-87153-L - Yageo
R3
33 kΩResistor 0402 5% 0.1 W
2322-705-87333-L - Yageo
R4
390 kΩResistor 0402 1% 0.063 W
RC0402FR-07390KL - Yageo
R5
100 kΩResistor 0402 5% 0.1 W
2322-705-70104-L - Yageo
U1
Step Down Regulator MSOP10 3.5 A 2.4 MHz
LT3972IMSE#PBF - Linear Technology
Table 4: Suggested components for VCC voltage supply application circuit using a high reliability step-down regulator
Figure 7 and the components listed in Table 5 show an example of a low cost power supply circuit, where the
VCC module supply is provided by a step-down switching regulator capable of delivering 2.5 A current pulses,
transforming a 12 V supply input.

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LEON-G100
LEON-G200
12V
R5
C6C1
VCC
INH
FSW
SYNC
OUT
GND
2
6
31
7
8
C3
C2
D1 R1
R2
L1
U1
50 VCC
GND
FB
COMP
5
4
R3
C4
R4
C5
Figure 7: Suggested schematic design for the VCC voltage supply application circuit using a low cost step-down regulator
Reference
Description
Part Number - Manufacturer
C1
22 µF Capacitor Ceramic X5R 1210 10% 25 V
GRM32ER61E226KE15 –Murata
C2
100 µF Capacitor Tantalum B_SIZE 20% 6.3V 15mΩ
T520B107M006ATE015 –Kemet
C3
5.6 nF Capacitor Ceramic X7R 0402 10% 50 V
GRM155R71H562KA88 –Murata
C4
6.8 nF Capacitor Ceramic X7R 0402 10% 50 V
GRM155R71H682KA88 –Murata
C5
56 pF Capacitor Ceramic C0G 0402 5% 50 V
GRM1555C1H560JA01 –Murata
C6
220 nF Capacitor Ceramic X7R 0603 10% 25 V
GRM188R71E224KA88 –Murata
D1
Schottky Diode 25V 2 A
STPS2L25 –STMicroelectronics
L1
5.2 µH Inductor 30% 5.28A 22 mΩ
MSS1038-522NL –Coilcraft
R1
4.7 kΩResistor 0402 1% 0.063 W
RC0402FR-074K7L –Yageo
R2
910 ΩResistor 0402 1% 0.063 W
RC0402FR-07910RL –Yageo
R3
82 ΩResistor 0402 5% 0.063 W
RC0402JR-0782RL –Yageo
R4
8.2 kΩResistor 0402 5% 0.063 W
RC0402JR-078K2L –Yageo
R5
39 kΩResistor 0402 5% 0.063 W
RC0402JR-0739KL –Yageo
U1
Step Down Regulator 8-VFQFPN 3 A 1 MHz
L5987TR –ST Microelectronics
Table 5: Suggested components for VCC voltage supply application circuit using a low cost step-down regulator
Low Drop-Out (LDO) linear regulator
The characteristics of the LDO linear regulator connected to VCC pin should meet the following requirements:
Power capabilities: the LDO linear regulator with its output circuit has to be capable to provide a proper
voltage value to VCC pin and has to be capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC
pin
Power dissipation: the power handling capability of the LDO linear regulator has to be checked to limit its
junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input
voltage to the min output voltage to evaluate the power dissipation of the regulator)
Figure 8 and the components listed in Table 6 show an example of a power supply circuit, where the VCC
module supply is provided by an LDO linear regulator capable to deliver 2.5 A current pulses, with proper power
handling capability. The use of a linear regulator is suggested when the difference from the available supply rail
and the VCC value is low: linear regulators provide good efficiency transforming a 5 V supply to the 3.8 V typical
value of the VCC supply.