PNI RM3000-f User manual

User Manual
RM3000-f & RM2000-f
Geomagnetic Sensor Suite

Table of Contents
1COPYRIGHT & WARRANTY INFORMATION............................................................4
2INTRODUCTION..........................................................................................................5
3SPECIFICATIONS .......................................................................................................6
3.1 GEOMAGNETIC SENSOR SUITE CHARACTERISTICS ..............................6
3.2 SEN-XY-F AND SEN-Z-F CHARACTERISTICS.............................................7
3.3 3D MAGIC CHARACTERISTICS....................................................................8
3.4 TYPICAL SENSOR SUITE OPERATING PERFORMANCE..........................9
3.5 DIMENSIONS, PACKAGING, AND PAD & MASK LAYOUT........................13
3.5.1 Sen-XY-f...........................................................................................13
3.5.1 Sen-Z-f (13070) ................................................................................14
3.5.2 Sen-Z-f (13101) ................................................................................16
3.5.3 3D MagIC .........................................................................................18
3.6 SOLDERING .................................................................................................19
4GEOMAGNETIC SENSOR SUITE OVERVIEW & SET-UP......................................21
4.1 OVERVIEW ...................................................................................................21
4.2 LAYOUT ........................................................................................................23
4.2.1 Sensor Orientation............................................................................23
4.2.2 Local Magnetic Field Considerations ...............................................23
4.2.3 Other Layout Considerations............................................................24
4.3 3D MAGIC PIN-OUT .....................................................................................24
4.4 SPI TIMING REQUIREMENTS.....................................................................28
4.5 IDLE MODE...................................................................................................29
53D MAGIC OPERATION –STANDARD MODE .......................................................30
5.1 CYCLE COUNT REGISTERS.......................................................................30
5.2 SINGLE-AXIS MEASUREMENT (SAM) OPERATION .................................32
5.2.1 SAM SPI Activity Sequence .............................................................32
5.2.2 SAM Command Byte........................................................................33
5.2.3 Making a Single-Axis Measurement.................................................33
5.3 MULTI-AXIS MEASUREMENT (MAM) OPERATION...................................34
5.3.1 MAM SPI Activity Sequence.............................................................34
5.3.2 MAM Command Byte .......................................................................34
5.3.3 MAM Axes Select Byte.....................................................................35
5.3.4 Making a Multi-Axis Measurement...................................................35
63D MAGIC OPERATION –LEGACY MODE.............................................................37
6.1 LEGACY OPERATION..................................................................................37
6.1.1 Legacy Operation SPI Activity Sequence.........................................38
6.1.2 Legacy Command Byte....................................................................38
6.1.3 Making a Legacy Measurement.......................................................39
6.2 ENHANCED LEGACY OPERATION ............................................................40
6.2.1 Clock Divide Command Byte............................................................41
6.2.2 Clock Divide Register.......................................................................41
6.2.3 Command Sequence for Setting Clock Divide Value.......................42
6.2.4 Changes to the Period Select Value ................................................42

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List of Figures
Figure 3-1: Sample Rate vs. Resolution –Standard Mode......................................................9
Figure 3-2: Gain vs. Cycle Counts –Standard & Legacy Modes...........................................10
Figure 3-3: Single-Axis Sample Rate vs. Cycle Counts –Standard & Legacy Modes ..........10
Figure 3-4: Gain vs. Cycle Counts –Standard Mode.............................................................11
Figure 3-5: Single-Axis Sample Rate vs. Cycle Counts –Standard Mode ............................11
Figure 3-6: Current Consumption vs. Cycle Counts –Standard Mode..................................12
Figure 3-7: Sen-XY-f Sensor Dimensions ..............................................................................13
Figure 3-8: Sen-XY-f Tape and Reel Dimensions..................................................................13
Figure 3-9: Sen-XY-f Recommended Solder Pad, Paste, & Mask Layout.............................14
Figure 3-10: Sen-Z-f (13070) Sensor Dimensions .................................................................14
Figure 3-11: Sen-Z-f (13070) Tape and Reel Dimensions.....................................................15
Figure 3-12: Sen-Z-f (13070) Recommended Solder Pad, Paste, & Mask Layout................15
Figure 3-13: Sen-Z-f (13101) Sensor Dimensions .................................................................16
Figure 3-14: Sen-Z-f (13101) Tape and Reel Dimensions.....................................................16
Figure 3-15: Sen-Z-f (13101) Recommended Solder Pad, Paste, & Mask Layout................17
Figure 3-16: 3D MagIC MLF Mechanical Drawing.................................................................18
Figure 3-17: 3D MagIC MLF Tape Dimensions......................................................................18
Figure 3-18: Recommended Solder Reflow Profile................................................................19
Figure 4-1: RM3000-f reference schematic –Standard Mode...............................................21
Figure 4-2: LR Oscillator Circuit Biasing Diagram..................................................................22
Figure 4-3: RM3000-f North-East-Down (NED) Sensor Layout .............................................23
Figure 4-4: SPI Timing Diagram.............................................................................................28
Figure 5-1: SPI Activity Sequence Diagram for SAM Operation............................................32
Figure 5-2: SPI Activity Sequence Diagram for MAM Operation ...........................................34
Figure 6-1: SPI Activity Sequence Diagram for Legacy Operation ........................................38
List of Tables
Table 3-1: Geomagnetic Sensor Suite Performance................................................................6
Table 3-2: Sen-XY-f and Sen-Z-f Absolute Maximum Ratings.................................................7
Table 3-3: Sen-XY-f and Sen-Z-f Characteristics.....................................................................7
Table 3-4: 3D MagIC Absolute Maximum Ratings...................................................................8
Table 3-5: 3D MagIC Recommended Operating Conditions....................................................8
Table 3-6: Recommended Solder Processing Parameters....................................................20
Table 4-1: 3D MagIC Pin Assignments ..................................................................................25
Table 4-2: SPI Timing Specifications .....................................................................................29
Table 5-1: Cycle Count Register Commands.........................................................................31
Table 5-2: SAM Axis Select Bits.............................................................................................33
Table 5-3: MAM Axes Select Bits...........................................................................................35
Table 6-1: Legacy Period Select Bits .....................................................................................39
Table 6-2: Legacy Axis Select Bits.........................................................................................39
Table 6-3: Clock Divide Bits ...................................................................................................41
Table 6-4: Enhanced Legacy Mode with CD = 1....................................................................42

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1 Copyright & Warranty Information
© Copyright PNI Sensor Corporation 2011
All Rights Reserved. Reproduction, adaptation, or translation without prior written permission is prohibited, except as allowed under copyright laws.
Revised August 2012: for the most recent version visit our website at www.pnicorp.com
PNI Sensor Corporation
133 Aviation Blvd, Suite 101
Santa Rosa, CA 95403, USA
Tel: [phone]
Fax: [phone]
Warranty and Limitation of Liability. PNI Sensor Corporation ("PNI") manufactures its Products from parts and components that are new or
equivalent to new in performance. PNI warrants that each Product to be delivered hereunder, if properly used, will, for ninety (90) days following the
date of shipment unless a different warranty time period for such Product is specified: (i) in PNI’s Price List in effect at time of order acceptance; or (ii)
on PNI’s web site (www.pnicorp.com) at time of order acceptance, be free from defects in material and workmanship and will operate in accordance
with PNI’s published specifications and documentation for the Product in effect at time of order. PNI will make no changes to the specifications or
manufacturing processes that affect form, fit, or function of the Product without written notice to the Customer, however, PNI may at any time, without
such notice, make minor changes to specifications or manufacturing processes that do not affect the form, fit, or function of the Product. This warranty
will be void if the Products’ serial number, or other identification marks have been defaced, damaged, or removed. This warranty does not cover wear
and tear due to normal use, or damage to the Product as the result of improper usage, neglect of care, alteration, accident, or unauthorized repair.
THE ABOVE WARRANTY IS IN LIEU OF ANY OTHER WARRANTY, WHETHER EXPRESS, IMPLIED, OR STATUTORY, INCLUDING, BUT NOT
LIMITED TO, ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE
ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. PNI NEITHER ASSUMES NOR AUTHORIZES ANY PERSON TO ASSUME
FOR IT ANY OTHER LIABILITY.
If any Product furnished hereunder fails to conform to the above warranty, Customer’s sole and exclusive remedy and PNI’s sole and exclusive liability
will be, at PNI’s option, to repair, replace, or credit Customer’s account with an amount equal to the price paid for any such Product which fails during
the applicable warranty period provided that (i) Customer promptly notifies PNI in writing that such Product is defective and furnishes an explanation of
the deficiency; (ii) such Product is returned to PNI’s service facility at Customer’s risk and expense; and (iii) PNI is satisfied that claimed deficiencies
exist and were not caused by accident, misuse, neglect, alteration, repair, improper installation, or improper testing. If a Product is defective,
transportation charges for the return of the Product to Customer within the United States and Canada will be paid by PNI. For all other locations, the
warranty excludes all costs of shipping, customs clearance, and other related charges. PNI will have a reasonable time to make repairs or to replace
the Product or to credit Customer’s account. PNI warrants any such repaired or replacement Product to be free from defects in material and
workmanship on the same terms as the Product originally purchased.
Except for the breach of warranty remedies set forth herein, or for personal injury, PNI shall have no liability for any indirect or speculative damages
(including, but not limited to, consequential, incidental, punitive and special damages) relating to the use of or inability to use this Product, whether
arising out of contract, negligence, tort, or under any warranty theory, or for infringement of any other party’s intellectual property rights, irrespective of
whether PNI had advance notice of the possibility of any such damages, including, but not limited to, loss of use, revenue or profit. In no event shall
PNI’s total liability for all claims regarding a Product exceed the price paid for the Product. PNI neither assumes nor authorizes any person to assume
for it any other liabilities.
Some states and provinces do not allow limitations on how long an implied warranty lasts or the exclusion or limitation of incidental or consequential
damages, so the above limitations or exclusions may not apply to you. This warranty gives you specific legal rights and you may have other rights that
vary by state or province.

RM3000-f & RM2000-f Sensor Suite User Manual –August 2012 Page 5 of 42
2 Introduction
Thank you for purchasing PNI Sensor Corporation’s RM2000-f or RM3000-f Geomagnetic
Sensor Suite (pn 90042-f and pn 90043-f, respectively). The RM2000-f is comprised of two
Sen-XY-f geomagnetic sensors (pn 13060) and a 3D MagIC ASIC MLF controller (pn 12927),
and this forms the basis for a 2-axis (horizontal) digital compass. The RM3000-f is the same as
the RM2000-f but adds a Sen-Z-f geomagnetic sensor (pn 13070 or pn 13101), such that
compassing measurements are not constricted to the horizontal plane. Note there are two
versions of the Sen-Z-f sensor: the 13070 which has the same package as PNI’s legacy Sen-Z
sensor, and the 13101 which is larger but provides for more robust mounting to the user’s PCB.
When implementing an RM3000-f or RM2000-f Geomagnetic Sensor Suite, each geomagnetic
sensor serves as the inductive element in a simple LR relaxation oscillation circuit, with the
sensor’s effective inductance proportional to the magnetic field parallel to the sensor axis. The
LR circuit is driven by the 3D MagIC ASIC. Since the LR circuit’s oscillation frequency varies
with the strength of the magnetic field parallel to the sensor, the 3D MagIC’s internal clock is
used to measure the circuit’s oscillation frequency (cycle counts) and hence the magnetic field.
The 3D MagIC also contains an interface circuitry to communicate with a host microprocessor
on an SPI bus. The 3D MagIC can control and measure up to three PNI geomagnetic sensors,
with each sensor individually selected for measurement and individually configured for
measurement gain (resolution).
Since the Geomagnetic Sensor Suite works in the frequency domain, resolution and noise are
established cleanly by the number of cycle counts. In comparison, fluxgate and MR technologies
require expensive and complex signal processing to obtain similar resolution and noise, and in
many respects the Geomagnetic Sensor Suite’s performance simply cannot be matched. Also,
the output from the 3D MagIC is inherently digital and can be fed directly into a microprocessor,
eliminating the need for signal conditioning or an analog/digital interface between the sensor and
a microprocessor. The simplicity of the Geomagnetic Sensor Suite combined with the lack of
signal conditioning makes it easier and less expensive to implement than alternative fluxgate or
magneto-resistive (MR) technologies.
For more information on PNI’s magneto-inductive sensor technology, see PNI’s whitepaper
“Magneto-Inductive Technology Overview” at http://www.pnicorp.com/technology/papers.

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3 Specifications
3.1 Geomagnetic Sensor Suite Characteristics
Table 3-1: Geomagnetic Sensor Suite Performance1
Parameter
Min
Typical
Max
Units
Field Measurement Range2
-800
+800
T
Gain @ 200 Cycle Counts
@ 2.8 V
55
counts/ T
@ 3.3 V
45
counts/ T
Noise @ 200 Cycle Counts
30
nT
Linearity - Best Fit over 200 T
0.6
1.0
% of 200 T
Max. Sample Rate per Axis @ 200 Cycle
Counts3
475
Hz
Average Current per Axis @
35 Hz and 200 Cycle Counts4
@ 2.8 V
0.20
mA
@ 3.3 V
0.25
mA
Bias Resistor (RB)
1.6 V to 2.2 V
60+(V-1.6)*67
2.2 V to 3.3 V
100
External Timing Resistor for Clock (REXT)
33
k
Circuit Oscillation Frequency
195
kHz
High Speed Clock Frequency
45
MHz
Operating Temperature
-40
+85
C
Footnotes:
1. Specifications subject to change. Unless otherwise noted, performance characteristics assume
the user implements the recommended bias resistors and external timing resistor for the high-
speed clock, as indicated in Figure 4-1, and the 3D MagIC ASIC is operated in Standard Mode.
Other bias resistors, external timing resistors and operating voltages may be used, but
performance may differ from the values listed.
2. Field measurement range is defined as the monotonic region of the output characteristic curve.
Field measurement range can be extended by using different bias resistors. For example, with
an 82 Ω bias resistor the field measurement range would be ±900 µT.
3. The maximum sample rate and gain/resolution are inversely related, so higher sample rates can
be obtained by reducing the number of cycle counts, but this also reduces gain and resolution.
4. Operating at reduced cycle counts will reduce current consumption, but also reduce resolution.
Operating at greater cycle counts will increase power consumption but have diminishing returns
in terms of improved resolution due to noise.

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3.2 Sen-XY-f and Sen-Z-f Characteristics
Table 3-2: Sen-XY-f and Sen-Z-f Absolute Maximum Ratings
Parameter
Minimum
Maximum
Units
Input Pin Current @ 25 C
50
mA
Voltage Across Coil
2.0
VDC
Storage Temperature
-40
+85
C
CAUTION:
Stresses beyond those listed above may cause permanent damage to the device. These
are stress ratings only. Assuming operation with the 3D MagIC per the guidelines in this
manual, these maximum ratings will not be violated.
Table 3-3: Sen-XY-f and Sen-Z-f Characteristics1
Parameter
Min
Typical
Max
Units
Inductance1
500-600
H
DC resistance @ 25C 15C
30
45
Resistance versus
temperature
0.4
%/C
Weight
Sen-XY-f
0.06 [0.002]
gm [oz]
Sen-Z-f
0.09 [0.003]
gm [oz]
Operating Temperature
-40
+85
C
Footnote:
1. 1 V peak-to-peak across the coil @ 100 kHz (sinewave). No DC bias resistance.
Measured orthogonal to Earth’s magnetic field.

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3.3 3D MagIC Characteristics
Table 3-4: 3D MagIC Absolute Maximum Ratings
Parameter
Minimum
Maximum
Units
Analog/Digital DC Supply Voltage (AVDD & DVDD)
-0.3
+3.7
VDC
Input Pin Voltage
-0.3
AVDD or DVDD
VDC
Input Pin Current @ 25C
-10.0
+10.0
mA
Storage Temperature
-40°
+125°
C
CAUTION:
Stresses beyond those listed above may cause permanent damage to the device. These
are stress ratings only. Operation of the device at these or other conditions beyond those
indicated in the operational sections of the specifications is not implied.
Table 3-5: 3D MagIC Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Units
Analog/Digital DC Supply Voltage
AVDD,
DVDD
1.6
3.3
3.6
VDC
Supply Voltage
Difference
(DVDD-AVDD)
During Operation
∆VDD_OP
-0.1
0
+0.1
VDC
Analog Unpowered
∆VDD_OFF
DVDD-0.1
DVDD
DVDD+0.1
VDC
Supply Voltage Ripple on AVDD or DVDD
VDD_ripple
0.05
VPP
High level input voltage
VIH
0.7*DVDD
DVDD
VDC
Low level input voltage
VIL
0
0.3*DVDD
VDC
High level output current
IOH
-1
mA
Low level output current
IOL
1
mA
Idle Mode Current
1
µA
Leakage Current @ DVDD pin
(AVDD=AVSS=DVSS=0V, DVDD=3.6V)
100
nA
Operating Temperature
TOP
-40
+85
C

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3.4 Typical Sensor Suite Operating Performance
Figure 3-1 plots typical gain-determined resolution as a function of the single axis sample
rate. The plot starts at 300 Hz since the usable resolution is limited by best-case system noise
of ~15 nT. The plot stops at 2400 Hz because this represents a cycle count of ~30, and
operating at cycle counts lower than this introduces significant quantization error. (The
number of cycle counts is determined by the user, as explained in Sections 5.1 and 6.2.)
Figure 3-1: Sample Rate vs. Resolution –Standard Mode
(Usable resolution will be limited by system noise at lower sample rates)
The plots below are representative of performance as a function of the number of cycle
counts, which is a parameter directly controlled by the user. The first two plots show
performance for operation in both Standard Mode and the default Legacy Mode out to 10,000
cycle counts. The maximum number of cycle counts in Legacy Mode is 4096. In Standard
Mode the maximum cycle counts is 65.5k, but there’s rarely a reason to operate in Standard
Mode much beyond 250 cycle counts, as discussed in the following paragraph.
Figure 3-4, Figure 3-5, and Figure 3-6 show performance when operating in Standard Mode
out to 250 cycle counts. Operation in Standard Mode at more than 250 cycle counts usually
is inefficient since more time and power is consumed per measurement, with diminishing
returns in usable (noise-limited) resolution.
0
30
60
90
120
150
300 600 900 1200 1500 1800 2100 2400
Gain-determinedResolution(nT)
SampleRate per Axis (Hz)

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Figure 3-2: Gain vs. Cycle Counts –Standard & Legacy Modes
(Resolution = 1/Gain, to the system’s noise limit)
Figure 3-3: Single-Axis Sample Rate vs. Cycle Counts –Standard & Legacy Modes
0.1
1
10
100
1000
10000
10 100 1000 10000
Gain(counts/µT)
CycleCounts
Standard Mode
Legacy Mode(default config.)
1
10
100
1000
10000
10 100 1000 10000
MaximumSingle-Axis Sample Rate
(Hz)
CycleCounts
Standard Mode
Legacy Mode(default config.)

RM3000-f & RM2000-f Sensor Suite User Manual –August 2012 Page 11 of 42
Figure 3-4: Gain vs. Cycle Counts –Standard Mode
(Resolution = 1/Gain, to the system’s noise limit)
Figure 3-5: Single-Axis Sample Rate vs. Cycle Counts –Standard Mode
0
10
20
30
40
50
60
025 50 75 100 125 150 175 200 225 250
Gain(counts/µT)
CycleCounts
0
300
600
900
1200
1500
1800
2100
2400
2700
3000
025 50 75 100 125 150 175 200 225 250
Maximum Single-Axis Sample Rate (Hz)
CycleCounts

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Figure 3-6: Current Consumption vs. Cycle Counts –Standard Mode
0
50
100
150
200
250
300
025 50 75 100 125 150 175 200 225 250
Current Consumption @ 35 Hz Single-Axis
SampleRate (uA)
CycleCounts

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3.5 Dimensions, Packaging, and Pad & Mask Layout
3.5.1 Sen-XY-f
Figure 3-7: Sen-XY-f Sensor Dimensions
Dimensions in mm
Full reel is 5000 pcs. Smaller quantities on cut tape.
Tape & reel meets ANSI/EIA standard EIA-418-B
Figure 3-8: Sen-XY-f Tape and Reel Dimensions

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Note: PNI recommends a 5 mil stencil. The solder paste area is much smaller than the pad to reduce
sensor tilt and misalignment. The above layout allows for rework: for minimal footprint, contact PNI.
Figure 3-9: Sen-XY-f Recommended Solder Pad, Paste, & Mask Layout
3.5.1 Sen-Z-f (13070)
Figure 3-10: Sen-Z-f (13070) Sensor Dimensions

RM3000-f & RM2000-f Sensor Suite User Manual –August 2012 Page 15 of 42
Dimensions in mm
Full reel is 1200 pcs. Smaller quantities on cut tape.
Tape & reel meets ANSI/EIA standard EIA-418-B
Figure 3-11: Sen-Z-f (13070) Tape and Reel Dimensions
Note: PNI recommends a 5 mil stencil. The solder paste area is much smaller than the pad to reduce
sensor tilt and misalignment.
Figure 3-12: Sen-Z-f (13070) Recommended Solder Pad, Paste, & Mask Layout

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3.5.2 Sen-Z-f (13101)
Figure 3-13: Sen-Z-f (13101) Sensor Dimensions
Dimensions in mm
Full reel is 1200 pcs. Smaller quantities on cut tape.
Tape & reel meets ANSI/EIA standard EIA-418-B
Figure 3-14: Sen-Z-f (13101) Tape and Reel Dimensions

RM3000-f & RM2000-f Sensor Suite User Manual –August 2012 Page 17 of 42
Note: PNI recommends a 5 mil stencil. The solder paste area is much smaller than the pad to reduce
sensor tilt and misalignment. The above layout allows for rework: for minimal footprint, contact PNI.
Figure 3-15: Sen-Z-f (13101) Recommended Solder Pad, Paste, & Mask Layout

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3.5.3 3D MagIC
Figure 3-16: 3D MagIC MLF Mechanical Drawing
Dimensions: mm
Full reel is 5000 pcs. Smaller quantities on cut-tape.
Tape & Reel meets ANSI/EIA standard EIA-418
Figure 3-17: 3D MagIC MLF Tape Dimensions

RM3000-f & RM2000-f Sensor Suite User Manual –August 2012 Page 19 of 42
3.6 Soldering
Figure 3-18 and Table 3-6 provide the recommended solder reflow profile and processing
parameters for RM3000-f components. After soldering PNI components to a board, it is
possible to wave solder the opposite side of the PCB.
IMPORTANT: PNI sensors require the use of halide-free solder pastes and processes for
reflow and cleaning. Please contact PNI if you would like recommendations.
Figure 3-18: Recommended Solder Reflow Profile
PB

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Table 3-6: Recommended Solder Processing Parameters1
Parameter
Symbol
Value
Preheat Temperature, Minimum
TSmin
150°C
Preheat Temperature, Maximum
TSmax
200°C
Preheat Time (TSmin to TSmax)
60 –180 seconds
Solder Melt Temperature
TL
>218°C
Ramp-Up Rate (TSmax to TL)
3°C/second maximum
Peak Temperature
TP
<260°C
Time from 25°C to Peak (TP)
6 minutes maximum
Time above TL
tL
60 –120 seconds
Soak Time (within 5°C of TP)
tP
10 –20 seconds
Rampdown Rate
4°C/second maximum
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY-f and Sen-
Z-f classified as moisture sensitivity level 1. 3D MagIC MLF classified as
moisture sensitivity level 3.