
Table of contents
SIMATIC IPC647E
Operating Instructions, 09/2022, A5E52254141-AA 9
8.12 Technical specifications of the interfaces.......................................................................... 171
8.12.1 Technical specifications of the connections on the device................................................. 171
8.12.2 Technical specifications of the connectors for the power supply of optional graphics
cards ............................................................................................................................... 172
8.13 Technical specifications of the telescopic rails .................................................................. 172
8.14 Technical specifications of the operating systems............................................................. 173
9 Dimension drawings .......................................................................................................................... 174
9.1 Dimension drawing of the device ..................................................................................... 174
9.2 Dimension drawing of the expansion cards ...................................................................... 176
9.3 Dimension drawing for drill holes for telescopic rails ........................................................ 176
10 Standards and approvals ................................................................................................................... 177
10.1 Certificates and approvals ................................................................................................ 177
10.1.1 ISO 9001 certificate ......................................................................................................... 177
10.1.2 Software license agreements ........................................................................................... 177
10.1.3 UL approval ..................................................................................................................... 177
10.1.4 UKCA marking ................................................................................................................. 177
10.1.5 FCC Rules (USA)............................................................................................................... 178
10.1.6 ICES Compliance (Canada) ............................................................................................... 178
10.1.7 RCM (Australia / New Zealand) ......................................................................................... 178
10.1.8 EAC (Eurasian Conformity) ............................................................................................... 179
10.1.9 KC Mark (Korea)............................................................................................................... 179
10.1.10 BIS (India)........................................................................................................................ 179
10.1.11 Marine approvals ............................................................................................................. 179
10.2 Directives and declarations .............................................................................................. 181
10.2.1 CE marking ...................................................................................................................... 181
10.2.2 Electromagnetic compatibility.......................................................................................... 181
10.2.3 Low-voltage guideline...................................................................................................... 181
10.2.4 RoHs directive.................................................................................................................. 181
A Hardware description ........................................................................................................................ 182
A.1 Motherboard ................................................................................................................... 182
A.1.1 Layout of the motherboard .............................................................................................. 182
A.1.2 Position of the interfaces on the motherboard.................................................................. 183
A.2 Bus board and bus frame ................................................................................................. 184
A.2.1 Structure of the bus board ............................................................................................... 184
A.2.2 Components of the bus frame.......................................................................................... 184
A.3 Interrupt assignment ....................................................................................................... 186
A.3.1 Interrupt assignment of expansion card slots on the bus board......................................... 186
A.3.2 Exclusive PCI hardware interrupt ...................................................................................... 187
A.4 System resources............................................................................................................. 188
A.4.1 Currently allocated system resources................................................................................ 188
A.4.2 I/O address allocation....................................................................................................... 188
A.4.3 Interrupt assignments...................................................................................................... 189
A.4.4 Memory address assignments .......................................................................................... 191