Xilinx Alveo U30 User manual

Alveo U30 Data Center
Accelerator Card
Installaon Guide
UG1425 (v1.1) November 2, 2020

Revision History
The following table shows the revision history for this document.
Section Revision Summary
11/02/2020 Version 1.1
Chapter 1: Introduction Updated operating power.
Installing the Card Updated output log.
Installing the Deployment Software Removed chapter.
Multiple Devices and YAML Configuration Removed chapter.
Changing XRT and Target Platform Versions Removed appendix.
06/16/2020 Version 1.0
Initial release. N/A
Revision History
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Table of Contents
Revision History...............................................................................................................2
Chapter 1: Introduction.............................................................................................. 4
Minimum System Requirements...............................................................................................5
Chapter 2: Card Installation Procedures...........................................................6
Safety Instructions...................................................................................................................... 6
Before You Begin.........................................................................................................................8
Installing the Card.......................................................................................................................9
Chapter 3: Troubleshooting.................................................................................... 11
Appendix A: Regulatory and Compliance Information...........................12
Safety Compliance.....................................................................................................................12
EMC Compliance........................................................................................................................12
CE Directives.............................................................................................................................. 13
CE Standards..............................................................................................................................13
Other Compliance Statements................................................................................................ 14
Appendix B: Additional Resources and Legal Notices............................. 18
Xilinx Resources.........................................................................................................................18
Documentation Navigator and Design Hubs.........................................................................18
References..................................................................................................................................18
Please Read: Important Legal Notices................................................................................... 19
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Chapter 1
Introduction
This document provides hardware installaon procedures for the Alveo™ U30 Data Center
accelerator card.
The Xilinx® Alveo U30 data center accelerator card, shown in the following gure, is a single slot,
half-height, half-length, low prole form factor passively-cooled card operang up to a 25W total
dissipated power (TDP). It has a bifurcated Gen3 x8 to form two independent Gen3 x4
PCI Express® (PCIe) compliant interfaces. It features two Zynq® UltraScale+™ MPSoCs to
accelerate HD video transcoding and analycs. It targets high density video transcoding
applicaon, capable of decoding, scaling, and encoding up to eight 1080p60 streams. The U30
card provides superb power and cost performance for such video applicaons.
Figure 1: Alveo U30 Card with Full-Height Bracket
Chapter 1: Introduction
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Minimum System Requirements
The minimum system requirements for running the Alveo™ U30 Data Center accelerator cards
are listed below:
Table 1: Minimum System Requirements
Component Requirement
Motherboard Can be used with either PCI Express®-compliant Gen3x16 or Gen3x8 with
x4x4 bifurcation enabled in the BIOS.
System Power Supply 75W
Operating System Linux, 64-bit:
•Ubuntu 16.04
System Memory For deployment installations, a minimum of 16 GB is required.
Internet Connection Required for downloading drivers and utilities.
Hard disk space Satisfy the minimum system requirements for your operating system.
Licensing None required for application deployment.
For details on the acceptable environmental condions, see Alveo U30 Data Center Accelerator
Cards Data Sheet (DS970).
Chapter 1: Introduction
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Chapter 2
Card Installation Procedures
To reduce the risk of re, electric shock, or injury, always follow basic safety precauons.
CAUTION! You must always use an ESD strap or other anstac device when handling hardware.
ATTENTION! Il est fortement recommandé d'uliser un bracelet ESD ou autres disposifs anstaques.
VORSICHT! Beim Umgang mit Hardware müssen sie immer ein Erdungs Armband oder ein anderes
anstasches Gerät verwenden.
Safety Instructions
Safety Information
To ensure your personal safety and the safety of your equipment:
• Keep your work area and the computer/server clean and clear of debris.
• Before opening the computer/system cover, unplug the power cord.
Dispositif de Sécurité
Pour assurer votre sécurité personnelle et la sécurité de votre équipement:
• Maintenez votre zone de travail et l'ordinateur/serveur propre et dégagé de débris.
• Avant d'ouvrir le capot de l'ordinateur/système, débranchez le cordon d'alimentaon.
Sicherheitsinformation
Um ihre persönliche Sicherheit und die Sicherheit ihrer Ausrüstung zu gewährleisten:
• Halten sie ihren Arbeitsbereich und den Computer / Server sauber und frei von Ablagerungen.
• Ziehen sie vor dem Öenen der Computer / Systemabdeckung das Netzkabel ab.
Chapter 2: Card Installation Procedures
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Electrostatic Discharge Caution
Electrostac discharge (ESD) can damage electronic components when they are improperly
handled, and can result in total or intermient failures. Always follow ESD-prevenon procedures
when removing and replacing components.
To prevent ESD damage:
• Use an ESD wrist or ankle strap and ensure that it makes skin contact. Connect the equipment
end of the strap to an unpainted metal surface on the chassis.
• Avoid touching the card against your clothing. The wrist strap protects components from ESD
on the body only.
• Handle the card by its bracket or edges only. Avoid touching the printed circuit board or the
connectors.
• Put the card down only on an anstac surface such as the bag supplied in your kit.
• If you are returning the card to Xilinx Product Support, place it back in its anstac bag
immediately.
Attention aux Décharge Électrostatique (ESD)
L'ESD peut endommager les composants électroniques lorsqu'ils sont mal manipulés, et peut
entraîner des défaillances totales ou intermientes. Suivez toujours les procédures de prévenon
contre les ESD lors du retrait et remplacement des composants.
Pour prévenir les dommages dus aux ESD:
•Ulisez une sangle de poignet ou de cheville an-ESD et assurez-vous qu'elle est en contact
avec la peau. Branchez l'extrémité du cable de la sangle à une surface métallique non peinte
du châssis et a la masse.
• Évitez de mere en contact la carte de circuit imprimé ou les connecteurs avec vos vêtements.
La sangle de poignet protège la carte ou connecteurs contre les ESD du corps seulement.
• Manipulez la carte uniquement par son support ou par ses bords. Évitez de toucher la carte de
circuit imprimé ou les connecteurs.
• Ne posez la carte de circuit imprimé ou les connecteurs que sur une surface anstaque telle
que le sac an-staque fourni avec la carte.
• Si vous retournez la carte a Xilinx, remeez-la dans son sac anstaque immédiatement.
Vorsicht Elektrostatische Entladung
Elektrostasche Entladung (ESD) kann elektronische Bauteile beschädigen, wenn sie
unsachgemäß behandelt werden, und es kann zu totalen oder zeitweiligen Ausfällen kommen.
Befolgen sie beim Enernen und Austauschen von Komponenten stets die ESD-
Schutzmaßnahmen.
Chapter 2: Card Installation Procedures
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So verhindern sie ESD-Schäden:
• Verwenden sie einen ESD-Handgelenk-oder Knöchelriemen und stellen sie sicher, dass er
Hautkontakt hat. Verbinden sie das Ende des Riemens mit einer unlackierten Metalloberäche
am Gehäuse.
• Berühren sie die Karte nicht mit ihrer Kleidung. Der Riemen schützt Komponenten nur vor
ESD am Körper.
• Fassen sie die Karte nur an der Halterung oder an den Kanten an. Berühren sie nicht die
Leiterplae oder die Anschlüsse.
• Legen sie die Karte nur auf einer anstaschen Oberäche ab, z.B. dem anstaschen Beutel
der mit dem Kit mitgeliefert wurde.
• Wenn sie die Karte an den Xilinx Product Support zurücksenden, legen Sie sie bie sofort
wieder in den anstaschen Beutel.
Before You Begin
IMPORTANT! Alveo™ cards are delicate and sensive electronic devices; equipment is to be installed by a
qualied technician only. This equipment is intended for installaon in a Restricted Access Locaon.
IMPORTANT! Les cartes Alveo™ sont des appareils électronique sensibles et fragiles; l'équipement doit
être installé par un technicien ceré seulement. Cet équipement est desné à être installé dans un lieu
d'accès restreint.
WICHTIG! Die Karten Alveo™ sind sensible und empndliche elektronische Geräte. Das Gerät darf nur
von einem qualizierten Techniker installiert werden. Dieses Gerät ist für die Installaon an einem Ort mit
begrenztem Zugang vorgesehen.
• Verify that the minimum card space is available to install your card. Card specicaons and
dimensions can be found in Alveo U30 Data Center Accelerator Cards Data Sheet (DS970).
• Check for card compability with the system. Also check for proper system requirements such
as power, bus type, and physical dimensions to support the card.
Replacing the Bracket
The Alveo U30 card can be used with either a full-height or half-height bracket. Depending on
your system, it may be necessary to switch between the full and half-height bracket on the card.
The bracket is secured to the card with four screws, as shown in the gure below. To replace the
bracket, follow the instrucons below.
1. Remove screws 1 and 2 from the card.
2. Remove screws 3 and 4 from the card.
Chapter 2: Card Installation Procedures
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3. Remove the bracket from the card.
4. Place the new bracket on the card and align it with the card's connectors and screw locaons.
5. Replace screws 1 and 2 on the new bracket.
6. Replace screws 3 and 4 on the new bracket.
Figure 2: Screw Locations on Bracket
Installing the Card
The following procedure is a guide for the Xilinx® Alveo™ U30 Data Center accelerator card
installaon. Consult your computer documentaon for addional informaon.
Note: For use with UL Listed Servers or ITE.
If you encounter any issues during installaon, see Chapter 3: Troubleshoong.
Chapter 2: Card Installation Procedures
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1. Shut down the host computer and unplug the power cord.
2. Open your computer by removing the casing.
3. If necessary, remove the adjacent PCIe® slot cover corresponding to the PCIe slot in which
you are installing the Alveo card.
4. Plug the Alveo card into the PCIe x8 or x16 slot on the motherboard.
5. Re-install the computer casing.
6. Connect the power cord and turn on the computer.
WARNING! Do not power-on a passively cooled card without adequate forced airow across the card
with proper air ow direcon, otherwise the card can be damaged. This card can heat up aer use in
the server. Use cauon when handling. For more informaon, see Alveo U30 Data Center Accelerator
Cards Data Sheet (DS970).
7. To verify that the device has been installed correctly, enter the following Linux command in
the terminal:
$ sudo lspci -vd 10ee:
If the card is successfully installed and found by the operang system, a message similar to
the one below will be displayed.
00:08.0 Processing accelerators: Xilinx Corporation Device d03c (rev 02)
Subsystem: Xilinx Corporation Device 000e
Physical Slot: 8
Flags: fast devsel, IRQ 11
Memory at fc000000 (32-bit, non-prefetchable) [size=32M]
Memory at fe050000 (32-bit, non-prefetchable) [size=64K]
Capabilities: [40] Power Management version 3
Capabilities: [48] MSI: Enable- Count=1/1 Maskable- 64bit+
Capabilities: [70] Express Endpoint, MSI 00
If you do not see a similar message, see Chapter 3: Troubleshoong.
Chapter 2: Card Installation Procedures
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Chapter 3
Troubleshooting
The following table lists potenal issues, causes, and xes related to card installaon.
Table 2: Card Troubleshooting
Issue Potential Cause Fix
Card not found. Card not correctly installed. Reinstall the card following the
installation instructions.
Check if the card shows up by typing
the following Linux command: lspci
-vd 10ee:
Card not compatible with server. Use qualified server. For system
capabilities, see Alveo U30 Data Center
Accelerator Cards Data Sheet (DS970).
Kernel version is incompatible. Run uname -r to check the kernel
version.
lspci no longer recognizes the card. Card is overheating. Ensure that operating ambient
conditions do not exceed specifications
and passive cards are in a system that
provides adequate airflow. For more
information about airflow
requirements, see Alveo U30 Data
Center Accelerator Cards Data Sheet
(DS970).
Chapter 3: Troubleshooting
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Appendix A
Regulatory and Compliance
Information
This product is designed and tested to conform to the European Union direcves and standards
described in this secon.
Safety Compliance
The following table shows the safety standards that apply to the Alveo U30 cards.
Table 3: Safety Standards
Safety Standard Alveo U30
IEC 62368-1:2014 (Second Edition) ✓
CSA C22.2 No. 60950-1-07, 2nd Edition, 2014-10-14 (Information Technology Equipment - Safety - Part
1: General Requirements)
✓
EN 60950-1:2006+A11:2009+A1:2012+A12:2011+A2:2013 (European Union) ✓
IEC 60950-1:2005 (2nd Edition); Am 1:2009 (International) ✓
EU LVD Directive 2014/35/EC ✓
EMC Compliance
The following tables show the EMC standards that apply to the Alveo U30 cards.
Class A Products
Table 4: EMC Standards
Standard Alveo U30
FCC Part 15 – Radiated & Conducted Emissions (USA) ✓
CAN ICES-3(A)/NMB-3(A) – Radiated & Conducted Emissions (Canada) ✓
CISPR 32 – Radiated & Conducted Emissions (International) ✓
Appendix A: Regulatory and Compliance Information
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Table 4: EMC Standards (cont'd)
Standard Alveo U30
EN55032: 2015 – Radiated & Conducted Emissions (European Union) ✓
EN55024: 2010 +A1:2001+A2:2003 – Immunity (European Union) ✓
EMC Directive 2014/30/EC ✓
VCCI (Class A)– Radiated & Conducted Emissions (Japan) ✓
CNS13438 – Radiated & Conducted Emissions (Taiwan) ✓
CNS 15663 - RoHS (Taiwan) ✓
AS/NZS CISPR 32 – Radiated and Conducted Emissions (Australia/New Zealand) ✓
Article 58-2 of Radio Waves Act, Clause 3 (Korea) ✓
Regulatory Compliance Markings
The following table shows the product cercaon markings that are provided, when required,
with the Alveo U30 cards.
Table 5: Product Certification Markings
Product Certification Markings Alveo U30
UL Listed Accessories Mark for the USA and Canada ✓
CE mark ✓
FCC markings ✓
VCCI marking ✓
Australian C-Tick mark ✓
Korea MSIP mark ✓
Taiwan BSMI mark ✓
German GS mark ✓
CE Directives
2014/35/EC, Low Voltage Direcve (LVD)
2014/30/EC, Electromagnec Compability (EMC) Direcve
CE Standards
EN standards are maintained by the European Commiee for Electrotechnical Standardizaon
(CENELEC). IEC standards are maintained by the Internaonal Electrotechnical Commission (IEC).
Appendix A: Regulatory and Compliance Information
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Electromagnetic Compatibility
EN:55032:2015, Informaon Technology Equipment Radio Disturbance Characteriscs – Limits and
Methods of Measurement
EN:55024:2015, Informaon Technology Equipment Immunity Characteriscs – Limits and Methods
of Measurement
This is a Class A product. In a domesc environment, this product can cause radio interference, in
which case the user might be required to take adequate measures.
Other Compliance Statements
The following secons only apply to Alveo U30 cards.
FCC Class A User Information
The Class A products listed above comply with Part 15 of the FCC Rules. Operaon is subject to
the following two condions:
1. This device may not cause harmful interference.
2. This device must accept any interference received, including interference that may cause
undesired operaon.
IMPORTANT! This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable
protecon against harmful interference when the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used
in accordance with the instrucons, may cause harmful interference to radio communicaons.
Operaon of this equipment in a residenal area is likely to cause harmful interference, in which case
the user will be required to correct the interference at his or her own expense.
IMPORTANT! Cet équipement a été testé et jugé conforme à la Class A digital device, conformément
à la règle 15 du standard FCC. Ces limites sont conçues pour fournir des protecons contre des
interférences nuisibles lorsque l'équipement est ulisé dans un environnement commercial. Cet
équipement génère, ulise et peut émere des énergies de radio-fréquence et, s'il n'est pas installé et
ulisé conformément aux instrucons, peut nuire aux communicaons radio. L'exploitaon de cet
équipement dans une zone résidenelle est suscepble de causer des interférences nuisibles, auquel
cas l'ulisateur peut être tenu de prendre des mesures adéquates à ses propres frais.
Appendix A: Regulatory and Compliance Information
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WICHTIG! Dieses Gerät wurde getestet und entspricht den Grenzwerten für digitale Geräte der
Klasse A gemäß Teil 15 der FCC-Besmmungen. Diese Grenzwerte bieten einen angemessenen Schutz
gegen schädliche Interferenzen, wenn das Gerät in einer gewerblichen Umgebung betrieben wird.
Dieses Gerät erzeugt und verwendet Hochfrequenzenergie und kann diese abstrahlen. Wenn es nicht
gemäß den Anweisungen installiert und verwendet wird, kann dies Funkstörungen verursachen. Der
Betrieb dieses Geräts in einem Wohngebiet kann schädliche Interferenzen verursachen. In diesem Fall
muss der Benutzer die Interferenz auf eigene Kosten beheben.
CAUTION! If the device is changed or modied without permission from Xilinx, the user may void his
or her authority to operate the equipment.
ATTENTION! Si l'appareil est modié sans l'autorisaon de Xilinx, l'ulisateur peut annuler son abilité
à uliser l'équipement.
VORSICHT! Wenn das Gerät ohne Erlaubnis von Xilinx geändert wird, kann der Benutzer seine
Berechgung zum Betrieb des Geräts verlieren.
Canadian Compliance (Industry Canada)
CAN ICES-3(A)/NMB-3(A)
VCCI Class A Statement
KCC Notice Class A (Republic of Korea Only)
BSMI Class A Notice (Taiwan)
Appendix A: Regulatory and Compliance Information
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Manufacturer Declaration European Community
Manufacturer Declaration
Xilinx declares that the equipment described in this document is in conformance with the
requirements of the European Council Direcve listed below:
• Low Voltage Direcve 2014/35/EU
• EMC Direcve 2014/30/EU
• RoHS 3 Direcve 2011/65/EU, 2015/863
These products follow the provisions of the European Direcve 2014/53/EU.
Dee produkt er i overensstemmelse med det europæiske direkv 2014/53/EU.
Dit product is in navolging van de bepalingen van Europees Direcef 2014/53/EU.
Tämä tuote noudaaa EU-direkivin 2014/53/EU määräyksiä.
Ce produit est conforme aux exigences de la Direcve Européenne 2014/53/EU.
Dieses Produkt entspricht den Besmmungen der Europäischen Richtlinie 2014/53/EU.
Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 2014/53/EU.
Questo prodoo è conforme alla Direva Europea 2014/53/EU.
Dee produktet er i henhold l bestemmelsene i det europeiske direkvet 2014/53/EU.
Este produto cumpre com as normas da Direva Européia 2014/53/EU.
Este producto cumple con las normas del Direcvo Europeo 2014/53/EU.
Denna produkt har llverkats i enlighet med EG-direkv 2014/53/EU.
This declaraon is based upon compliance of the Class A products listed above to the following
standards:
EN 55032 (CISPR 32 Class A) RF Emissions Control.
EN 55024:2010 (CISPR 24) Immunity to Electromagnec Disturbance.
Appendix A: Regulatory and Compliance Information
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EN 60950-1:2006/A11:2009A1:2010/A12:2011 Informaon Technology Equipment- Safety-
Part 1: General Requirements.
EN 50581:2012 - Technical documentaon for the assessment of electrical and electronic
products with respect to the restricon of hazardous substances.
CAUTION! In a domesc environment, Class A products may cause radio interference, in which case the
user may be required to take adequate measures.
ATTENTION! Dans un environnement domesque, les produits de Classe A peuvent causer des
interférences radio, auquel cas l'ulisateur peut être tenu de prendre des mesures adéquates.
VORSICHT! In einer häuslichen Umgebung können Produkte der Klasse A Funkstörungen verursachen. In
diesem Fall muss der Benutzer möglicherweise geeignete Maßnahmen ergreifen.
Responsible Party
Xilinx, Inc.
2100 Logic Drive, San Jose, CA 95124
United States of America
Phone: [phone]
Appendix A: Regulatory and Compliance Information
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Appendix B
Additional Resources and Legal
Notices
Xilinx Resources
For support resources such as Answers, Documentaon, Downloads, and Forums, see Xilinx
Support.
Documentation Navigator and Design Hubs
Xilinx® Documentaon Navigator (DocNav) provides access to Xilinx documents, videos, and
support resources, which you can lter and search to nd informaon. To open DocNav:
• From the Vivado® IDE, select Help → Documentaon and Tutorials.
• On Windows, select Start → All Programs → Xilinx Design Tools → DocNav.
• At the Linux command prompt, enter docnav.
Xilinx Design Hubs provide links to documentaon organized by design tasks and other topics,
which you can use to learn key concepts and address frequently asked quesons. To access the
Design Hubs:
• In DocNav, click the Design Hubs View tab.
• On the Xilinx website, see the Design Hubs page.
Note: For more informaon on DocNav, see the Documentaon Navigator page on the Xilinx website.
References
These documents provide supplemental material useful with this guide:
Appendix B: Additional Resources and Legal Notices
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1. Vis Unied Soware Plaorm Documentaon: Applicaon Acceleraon Development (UG1393)
2. Vis Unied Soware Plaorm Documentaon: Embedded Soware Development (UG1400)
3. Vis 2020.1 Soware Plaorm Release Notes in the Vis Unied Soware Plaorm
Documentaon (UG1416)
4. Vis Applicaon Acceleraon Development Flow Tutorials (GitHub)
Alveo Documents
1. Alveo U30 Data Center Accelerator Cards Data Sheet (DS970)
Additional Xilinx Resources
1. Xilinx licensing website: hps://www.xilinx.com/getproduct
2. Vis Developer Zone: hps://www.xilinx.com/products/design-tools/vis/vis-plaorm.html
3. Xilinx Community Forums: hps://forums.xilinx.com
4. Xilinx Third-Party End User License Agreement
5. End-User License Agreement
Please Read: Important Legal Notices
The informaon disclosed to you hereunder (the "Materials") is provided solely for the selecon
and use of Xilinx products. To the maximum extent permied by applicable law: (1) Materials are
made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL WARRANTIES AND
CONDITIONS, EXPRESS, IMPLIED, OR STATUTORY, INCLUDING BUT NOT LIMITED TO
WARRANTIES OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY
PARTICULAR PURPOSE; and (2) Xilinx shall not be liable (whether in contract or tort, including
negligence, or under any other theory of liability) for any loss or damage of any kind or nature
related to, arising under, or in connecon with, the Materials (including your use of the
Materials), including for any direct, indirect, special, incidental, or consequenal loss or damage
(including loss of data, prots, goodwill, or any type of loss or damage suered as a result of any
acon brought by a third party) even if such damage or loss was reasonably foreseeable or Xilinx
had been advised of the possibility of the same. Xilinx assumes no obligaon to correct any
errors contained in the Materials or to nofy you of updates to the Materials or to product
specicaons. You may not reproduce, modify, distribute, or publicly display the Materials
without prior wrien consent. Certain products are subject to the terms and condions of
Xilinx's limited warranty, please refer to Xilinx's Terms of Sale which can be viewed at hps://
Appendix B: Additional Resources and Legal Notices
UG1425 (v1.1) November 2, 2020 www.xilinx.com
U30 Installation and User Guide 19
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www.xilinx.com/legal.htm#tos; IP cores may be subject to warranty and support terms contained
in a license issued to you by Xilinx. Xilinx products are not designed or intended to be fail-safe or
for use in any applicaon requiring fail-safe performance; you assume sole risk and liability for
use of Xilinx products in such crical applicaons, please refer to Xilinx's Terms of Sale which can
be viewed at hps://www.xilinx.com/legal.htm#tos.
AUTOMOTIVE APPLICATIONS DISCLAIMER
AUTOMOTIVE PRODUCTS (IDENTIFIED AS "XA" IN THE PART NUMBER) ARE NOT
WARRANTED FOR USE IN THE DEPLOYMENT OF AIRBAGS OR FOR USE IN APPLICATIONS
THAT AFFECT CONTROL OF A VEHICLE ("SAFETY APPLICATION") UNLESS THERE IS A
SAFETY CONCEPT OR REDUNDANCY FEATURE CONSISTENT WITH THE ISO 26262
AUTOMOTIVE SAFETY STANDARD ("SAFETY DESIGN"). CUSTOMER SHALL, PRIOR TO USING
OR DISTRIBUTING ANY SYSTEMS THAT INCORPORATE PRODUCTS, THOROUGHLY TEST
SUCH SYSTEMS FOR SAFETY PURPOSES. USE OF PRODUCTS IN A SAFETY APPLICATION
WITHOUT A SAFETY DESIGN IS FULLY AT THE RISK OF CUSTOMER, SUBJECT ONLY TO
APPLICABLE LAWS AND REGULATIONS GOVERNING LIMITATIONS ON PRODUCT
LIABILITY.
Copyright
© Copyright 2020 Xilinx, Inc. Xilinx, the Xilinx logo, Alveo, Arx, Kintex, Spartan, Versal, Virtex,
Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United
States and other countries. PCI, PCIe, and PCI Express are trademarks of PCI-SIG and used under
license. All other trademarks are the property of their respecve owners.
Appendix B: Additional Resources and Legal Notices
UG1425 (v1.1) November 2, 2020 www.xilinx.com
U30 Installation and User Guide 20
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