Intrinsyc Open-Q 660 mSOM User manual

Open-Q™ 660 µSOM Development Kit
User Guide
[Document: ITC-01RND1336-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q Development Kit Based on
Snapdragon 600 Series (SDA660) Processor and Software License Agreement for the Open-Q 660 Development Kit, which you or the legal entity you
represent, as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation
(“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the Agreement, solely
in support of your permitted use of the Open-Q 660 Development Kit under the Agreement. Distribution of this document is strictly prohibited without
the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole
discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand
names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to
U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-Q™ 660 µSOM Development Kit User Guide
Document Number ITC-01RND1336-UG-001
Version 1.0
Date Apr. 30, 2019
History
REVISION DATE DESCRIPTION PAGES
1.0 April 30, 2019 Initial Draft All

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Table of Contents
1. INTRODUCTION.................................................................................. 6
1.1 Purpose........................................................................................................ 6
1.2 Scope........................................................................................................... 6
1.3 Intended Audience...................................................................................... 6
2. DOCUMENTS ...................................................................................... 7
2.1 Applicable Documents................................................................................ 7
2.2 Reference Documents................................................................................. 7
2.3 Terms and Acronyms.................................................................................. 7
3. Open-Q 660 µSOM Development Kit................................................. 9
3.1 Introduction................................................................................................. 9
3.2 Development Platform Notice.................................................................... 9
3.3 Anti-Static Handling Procedures ................................................................ 9
3.4 Development Kit Contents.......................................................................... 9
3.4.1 Important Locations.................................................................................................10
3.4.2 Block Diagram.........................................................................................................12
3.4.3 Optional Accessories ...............................................................................................13
3.5 Getting Started.......................................................................................... 14
3.5.1 Registration..............................................................................................................14
3.5.2 Configuration Switch Settings.................................................................................14
3.5.3 Powering Up the Development Kit..........................................................................14
3.6 Open-Q 660 µSOM................................................................................... 15
3.7 Open-Q 660 Carrier Board ....................................................................... 16
3.7.1 SOM Board to Board Connectors............................................................................17
3.7.2 Configuration – DIP Switch S2600 (23)..................................................................17
3.7.3 Input Power Selection (2) ........................................................................................18
3.7.4 SOM Current Sense Header J301 (5).......................................................................21
3.7.5 Coin Cell Battery Holder B300 (37)........................................................................21
3.7.6 Power Header J700 (36)...........................................................................................22
3.7.7 User Buttons and LEDs ...........................................................................................23
3.7.8 Debug Serial UART over USB J1600 (12)..............................................................24
3.7.9 USB Type C (for ADB) J2300 (11).........................................................................24
3.7.10 USB 2.0 Type A Connector J2400 (6).....................................................................25
3.7.11 Micro SD Card Socket J1500 (34)...........................................................................25
3.7.12 Display Connector J1300 (30).................................................................................26
3.7.13 Camera Connectors J1000 (15), J1100 (16), J1200 (17)..........................................27
3.7.14 Camera Flash/Torch Connectors J1001 (18) and J1201 (19)...................................28
3.7.15 Digital IO Expansion Header J2200 (31).................................................................30
3.7.16 Sensor IO Expansion Header J2100 (25).................................................................31
3.7.17 Audio Inputs Expansion Header J1900 (33)............................................................32
3.7.18 Audio Outputs Expansion Header J1901 (32) .........................................................33
3.7.19 Audio IO Expansion Headers 1 and 2, J2000 (9) and J2001 (7)..............................34
3.7.20 Audio Headset Jack J1800 (8).................................................................................36
3.7.21 WLAN / BT Antenna Connections..........................................................................37
3.7.22 Quiet Thermistor RT800 (35)..................................................................................39

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3.7.23 Haptic Output Header J802 (10)..............................................................................39
List of Figures
Figure 1. Assembled Open-Q 660 µSOM Development Kit...............................................................10
Figure 2. Open-Q 660 µSOM Dev Kit Block Diagram.......................................................................12
Figure 3. DIP switch assignments........................................................................................................17
Figure 4. Power source selector switch S300 (2).................................................................................19
Figure 5. Battery ID and Thermistor DIP Switch S301 (4) .................................................................19
Figure 6. J400 12V DC Power Jack (1) ...............................................................................................20
Figure 7. Battery Connector J300 (3)...................................................................................................20
Figure 8. SOM Current Sense Header J301 (5) ...................................................................................21
Figure 9. Coin Cell Battery Holder B300 ............................................................................................22
Figure 10. Power Header J700 (36) .....................................................................................................22
Figure 11. Debug UART over USB J1600 ..........................................................................................24
Figure 12. USB Type C (for ADB) J2300 ...........................................................................................24
Figure 13. USB 2.0 Type A Connector J2400 (6)................................................................................25
Figure 14. Micro SD Card Socket J1500.............................................................................................25
Figure 15. Display Connector J1300....................................................................................................26
Figure 16. Typical Camera Connector.................................................................................................27
Figure 17. Camera Flash/Torch Connectors J1001 (18) and J1201 (19).............................................28
Figure 18. Digital IO Expansion header J2200....................................................................................30
Figure 19. Sensor Expansion Header J2100 ........................................................................................31
Figure 20. Audio Inputs Expansion Header J1900 (33).......................................................................32
Figure 21. Audio Outputs Expansion Header J1901 (32)....................................................................33
Figure 22. Audio IO Expansion Headers 1 and 2, J2000 and J2001 ...................................................34
Figure 23. Audio Headset Jack J1800 (8)............................................................................................36
Figure 24. WLAN / BT SOM Connections (21, 22)............................................................................37
Figure 25. Channel 0 and 1 WLAN/BT routing and PCB Antennas on Carrier Board.......................38
Figure 26. Quiet Thermistor RT800 Location (34)..............................................................................39
Figure 27. Haptic Output Header J802 (10).........................................................................................39
List of Tables
Table 1. List of Development Kit Features itemized in the figure above............................................11
Table 2. Carrier Board Features...........................................................................................................16
Table 3 - System Configuration DIP Switch Settings..........................................................................18
Table 4. Battery Connector J300 Pinout..............................................................................................20
Table 5 - Power Header J301 Pinout....................................................................................................21
Table 6. Power Header J700 (36).........................................................................................................22

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Table 7. Development Kit Buttons.......................................................................................................23
Table 8. Development Kit LEDs (24)..................................................................................................23
Table 9. Camera Flash/Torch Connectors pinout ................................................................................29
Table 10. Digital IO Expansion Header J2200 Pinout.........................................................................30
Table 11 - Sensor Expansion Header J2100 Pinout.............................................................................31
Table 12. Audio Inputs Expansion Header Pinout J1900 (33) ............................................................32
Table 13. Audio Outputs Expansion Header Pinout J1901..................................................................33
Table 14. Audio IO Expansion Header #1 J2000 Pinout.....................................................................35
Table 15. Audio IO Expansion Header #2 J2001 Pinout.....................................................................36

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide instructions and technical information on the Open-Q
660 µSOM Development Kit.
You can find information on this and other Intrinsyc development kits on the Intrinsyc web site:
https://www.intrinsyc.com/development-kits/
1.2 Scope
This document will cover the following items on the Open-Q 660 µSOM Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•SOM
•Carrier Board
•Available peripherals
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the Intrinsyc
Open-Q 660 µSOM Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 660 µSOM Development Kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-QDevelopment
Kit
2.2 Reference Documents
The below listed documents are available on the Intrinsyc Technical Portal:
https://tech.intrinsyc.com (dev kit registration required).
REFERENCE
TITLE
R-1
Open-Q 660 µSOM HW Device Specification
R-2
Open-Q 660 µSOM – Carrier Board Design Guide
R-3
Open-Q 660 µSOM Schematics (SOM and Carrier)
R-4
Open-Q 660 µSOM Development Kit – Display Adapter Design Guide
R-5
Open-Q 660 µSOM Development Kit – Camera Adapter Design Guide
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral (Serial interfaces like
UART / SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group

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LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SOM
System on Module
SPMI
System Power Management Interface (Qualcomm PMIC /
baseband proprietary protocol)
SSBI
Single wire serial bus interface (Qualcomm proprietary mostly
PMIC / Companion chip and baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

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3. OPEN-Q 660 µSOM DEVELOPMENT KIT
3.1 Introduction
The Open-Q 660 provides a quick reference and evaluation platform for the Qualcomm Snapdragon
SDA660 Platform. The development kit is suited for Android application developers, OEMs,
consumer manufacturers, hardware component vendors, camera vendors, and product designers to
evaluate, optimize, test and deploy applications that can utilize the Qualcomm Snapdragon SDA660
Platform technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering
development, engineering evaluation, or demonstration purposes only and is meant for use in a
controlled environment. This device is not being placed on the market, leased or sold for use in a
residential environment or for use by the general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available
consumer device including those requirements specified in the European Union directives applicable
for Radio devices being placed on the market, FCC equipment authorization rules or other
regulations pertaining to consumer devices being placed on the market for use by the general public.
This development platform may only be used in a controlled user environment where operators have
obtained the necessary regulatory approvals for experimentation using a radio device and have
appropriate technical training. The device may not be used by members of the general population or
other individuals that have not been instructed on methods for conducting controlled experiments
and taking necessary precautions for preventing harmful interference and minimizing RF exposure
risks. Additional RF exposure information can be found on the FCC website at
http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 660 µSOM Development Kit has exposed electronics and chipsets. Proper anti-static
precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap.
3.4 Development Kit Contents
The Open-Q 660 µSOM Development Kit comes with Android software pre-programmed and
includes the following:
oOpen-Q 660 µSOM with the Snapdragon 660 (SDA660) processor
oMini-ITX form-factor carrier board
oAC power adapter

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3.4.1 Important Locations
The diagram below shows the locations of key components, interfaces, and controls.
21 43
5
36
37
35
6 8 10 9 11 127 13
14
17
19
16
18
15
20
21
22
23
24
29 27 25
28
34
30
33
31
32
26
Figure 1. Assembled Open-Q 660 µSOM Development Kit

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Table 1. List of Development Kit Features itemized in the figure above
Position
Feature Description
Reference Designator
1
DC Power Supply Jack
J400
2
Power Source Selector
S300
3
Battery Input Header
J300
4
Battery configuration DIP switch
S301
5
SOM Current Sense Probe Header
J301
6
USB 2.0 Type A Connector
J2400
7
Audio I/O Header #1
J2000
8
Audio Headset Jack
J1800
9
Audio I/O Header #2
J2001
10
Haptic Motor Header
J802
11
USB 3.0 Type-C connector for ADB
J2300
12
USB Serial Debug Console
J1600
13
WLAN/BT Channel 0 External Antenna Connector
J2701
14
WLAN Channel 1 External Antenna Connector
J2700
15
Camera 1 Connector
J1000
16
Camera 2 Connector
J1100
17
Camera 3 Connector
J1200
18
Flash 1 Header
J1001
19
Flash 2 Header
J1201
20
Open-Q 660 µSOM
21
Open-Q 660 µSOM, WLAN/BT CH0 Antenna Connector
J2200
22
Open-Q 660 µSOM, WLAN CH1 Antenna Connector
J2201
23
System Configuration DIP Switch
S2600
24
LED Charge
DS2504
24
LED Power
DS2503
24
LED Blue
DS2500
24
LED Green
DS2501
24
LED Red
DS2502
25
Sensors Expansion Header
J2100
26
Button Power
S2503
27
Button Volume +
S2500
28
Button Volume -
S2502
29
Button GP SW
S2501
30
Open-Q LCD Panel
31
Digital IO Expansion Header
J2200
32
Audio Outputs Expansion
J1901
33
Audio Inputs Expansion
J1900
34
Micro SD card socket
J1500
35
On-Board Quiet Thermistor
RT800
36
Power Header
J700
37
Coin Cell Holder
B300

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3.4.2 Block Diagram
The block diagram below shows the connectivity and major components of the Open-Q 660 µSOM
Development Kit.
Open-Q
tm
660 µSOM Development Board
Open-Q
tm
660 µSOM
GPIO
PM660
PMIC
SPMI
4 lane MIPI
Control / SPI / I
2
C
4 lane
CCI
UART
SPMI
PM660L
PMIC
GPIO
Camera
Conn 0
DC Input
Conn
Battery
connector
Power &
Batt Chg
Circuits
Pwr
Switches
& LEDs
Debug UART
microUSB
Display
connector
WiFi / BT
WCN3990
IQ + SSBI
4 lane MIPI
Control / SPI / I
2
C
4 lane
CCI
CCI
HS
SS
USB 3.0
Type-C
+ DP
3.5mm
Headset
Jack
µSD
socket
SDIO
Sensor Header
UART / SPI / I
2
C / GPIO
SDA660
UFS
flash
LPDDR4X
RAM
DSI 0
UART
USB SS 0
SDC2
BLSP
EBI
BLSP/GPIO
Audio Expansion
Header
WiFi/BT Ant
CH0
WCN
baseband
FTDI
Serial USB
VBUS
To Battery
Charge
Circuits
4 Lane
CSI 2
CSI 1
CSI 0
DSI 1
I2S Audio Out
GPIO/NFC Expansion
Header
BLSP/GPIO
PCB Trace
Antenna
PCB Trace
Antenna
U.FL
U.FL
U.FL
Boot Mode
Switches
SOM Power
Probe
Pwr
Pwr
Coin
Cell
Boot
Mode
Audio Outputs
U.FL
Coax Cables
USB SS 1
USB HS 1
SS
DisplayPort
DP video
USB HS 2
USB2
Type A
HS
VBUS
From PMIC
VBUS
supply
Camera
Conn 1
Camera
Conn 2
WCD9335
Codec
Audio
Input Header
Audio
Output Header
Audio Inputs
Headset I/O
SLIMBus Audio I/O
I2S
Flash
Outputs
JTAG JTAG
Testpoints
SDC1
UFS
WiFi Ant
CH1
Figure 2. Open-Q 660 µSOM Dev Kit Block Diagram

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3.4.3 Optional Accessories
Optional accessories are available for the Open-Q 660 µSOM Development Kit, like LCD Panel,
Camera adapter, and sensor board. Please visit the Intrinsyc product store for availability of these
accessories: https://shop.intrinsyc.com/collections/all, or contact [e-mail].

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3.5 Getting Started
This section explains how to setup the Open-Q 660 µSOM Development Kit and start using it.
3.5.1 Registration
To register the development kit and gain access to the Intrinsyc Technical Document Portal, please
visit: http://tech.intrinsyc.com/account/register.
To proceed with registration, the development kit serial number is required. These serial numbers
can be found on the labels that are present on the SOM and carrier boards. The labels contain the
following information:
•SOM: Serial Number, WIFI MAC address
•Carrier: Serial Number
Note: Please retain the SOM and carrier board serial numbers for warranty purposes.
Refer to http://tech.intrinsyc.com/account/serialnumber for more details about locating the
development kit serial number.
3.5.2 Configuration Switch Settings
The default configuration for the system configuration DIP switch S2600 is for all switches to be
open or OFF. For details about other configurations, see section 3.7.2.
3.5.3 Powering Up the Development Kit
The development kit can be powered up by either using a DC power supply or by connecting a
battery on the connector J400. Select the desired power source using the switch S300 on the carrier
board. The green LED DS2503 marked “POWER” on the board is the power LED and should glow
once the development kit is powered. To see the debug logs, connect a serial debug cable to the
J1600 connector.
To power-up the board, perform the following exact steps below detailed below:
1. At a static-safe workstation, remove the development kit board carefully from the anti-static
bag.
2. Connect the Power Adapter to the 12V DC Jack J400 and then press and hold the power
button until you see the Intrinsyc logo appears on the on-board display (~3 seconds).
3. Navigate using the touchscreen on the on-board display.

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3.6 Open-Q 660 µSOM
The Open-Q 660 µSOM contains the core Snapdragon 660 architecture. Measuring in at 50mm x
25mm, the SOM is where all the processing occurs. It is connected to the carrier board via three 100
pin Hirose DF40 connectors which allows essential power rails and signals to be exposed for
supporting other peripherals and interfaces on the platform.
For detailed information about the Open-Q 660 µSOM, see the device specification noted as
reference document R-1.

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3.7 Open-Q 660 Carrier Board
The Open-Q 660 Carrier board is a Mini-ITX form factor board with various connectors used for
connecting different peripherals. The table and sections below provide in depth information on the
carrier board properties, user interfaces, connectors, and expansion headers found on the carrier
board. This information is important for users wishing to connect other external hardware devices to
the Open-Q 660 µSOM Development Kit. Users must ensure that before connecting any hardware
device to the development kit, that it is compatible with the Open-Q 660 hardware specifications.
See Figure 1 for position on carrier board.
Table 2. Carrier Board Features
Item
Position
Description
Specification
Usage
Form Factor
Dimensions: 170mm x 170mm
Mini-ITX Form Factor
SOM Interface
20
3 x 100-pin Hirose DF40 connectors
SOM power and signal IO
connection to carrier board.
The Open-Q 660 SOM
connects to the carrier
board through this
interface.
Power
1
AC / Barrel charger
12 V DC Power Supply
Power Supply
Power
3
Battery connector for single cell lithium
battery
Input power option
Debug Serial via USB
12
Debug Serial UART console over USB for
development
USB Micro B connector
Development Serial
Connector for debug
output via USB
Buttons
29
General Purpose SW button
SMD Button
Additional button for
general purpose
26
Power Button
SMD Button
Power Button for
Suspend / Resume and
Power off
Volume Keys
27
Volume + key
SMD Button
Volume +Key
28
Volume – key
SMD Button
Volume – Key
Sensor Connector
25
24 pin Sensor Expansion Connector
Available via Intrinsyc
optional accessories kit
Digital IO Expansion
Header
31
Exposes general purpose IO for user
development
Audio Headset Jack
8
Audio Headset Jack
Audio Headset
Audio Inputs
Expansion
33
Audio Inputs Header
3 Analog Differential Inputs,
3 PDM Input Interfaces with
phantom power
Microphones
Audio Outputs
Expansion
32
Audio Outputs Header
3 Line outputs, 1 earphone
amplifier output
Amplifiers
Audio I/O
7, 9
2 x Audio I/O headers
3 x I2S, DMIC PDM,
SPI/I2C interfaces
Various digital audio
I/O functions
Haptic motor header
10
Haptic device driver
LRM and ERA capable
output driver
Haptic motor
Micro SD (on bottom)
34
Micro SD card
4bit Micro SD card support
External Storage
USB Type C
11
USB type C connector
For USB debugging
and client / host mode
USB Type A
6
Female Type A Connector
USB 2.0 Host interface
WLAN Antennas
13, 14
2 PCB Antennas
Coax connection to
SOM WiFi module
Coin Cell Holder
37
Coin Cell battery holder provided
for PMIC RTC
LEDs
24
Four LEDs
Two user driven LEDs

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Item
Position
Description
Specification
Usage
LCD Display and
Touch connector
30
100 pin for LCD signals
4-lane MIPI DSI
MIPI Alliance Specification
v1.01
MIPI D-PHY Specification
v0.65, v0.81, v0.90, v1.01
For connecting display
accessory
CSI Camera connectors
15, 16, 17
3 x camera connector
MIPI Alliance Specification
v1.00 for Camera Serial
Interface
For connecting camera
accessories.
Flash driver
18, 19
2 x Flash drivers
Low current flash driver
control
Flash control
Current Sense Header
5
3 pin header
Sense lines connected across
0.005 Ohm resistor
To measure current
consumption of SOM
3.7.1 SOM Board to Board Connectors
The Open-Q 660 µSOM connects to the carrier board via three 100 pin Hirose DF40 connectors (20)
which allows essential power rails and signals to be exposed for supporting other peripherals and
interfaces on the platform. For the list of signals exposed by the SOM, see the device specification
(Ref. R-1).
3.7.2 Configuration – DIP Switch S2600 (23)
There is a DIP switch S2600 on the top side of the Open-Q 660 carrier board. The 8-bit switch
allows the user to control the system configuration and boot options. The image below shows the
DIP switch assignments.
Figure 3. DIP switch assignments

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See the table below for a description of the DIP switch connections.
Table 3 - System Configuration DIP Switch Settings
Function
DIP
Switch
Description
Notes
FORCED_USB_BOOT
S2600-1
For factory mode programming. Connected
to APQ GPIO57.
For Intrinsyc use only. Leave open /
OFF.
WATCHDOG _DISABLE
S2600-2
Enables WATCHDOG_DISABLE when
DIP switch turned on. Connected to APQ
GPIO96
Unsupported feature. Leave switch open /
OFF.
BOOT_CONFIG[1]
S2600-3
APQ boot configuration bit 1. Connected to
APQ GPIO97
For default boot configuration, leave
open / OFF. Other boot configurations
not supported.
BOOT_CONFIG[2]
S2600-4
APQ boot configuration bit 2. Connected to
APQ GPIO98
For default boot configuration, leave
open / OFF. Other boot configurations
not supported.
BOOT_CONFIG[3]
S2600-5
APQ boot configuration bit 3. Connected to
APQ GPIO60
For default boot configuration, leave
open / OFF. Other boot configurations
not supported.
CBL_PWN_N
S2600-6
Controls the auto power of the SOM.
Default configuration is open / OFF. To
enable auto power on of the SOM, set
switch closed / ON.
USR_DEBUG 1
S2600-7
User debug switch
Default out of the box configuration is
OFF
USR_DEBUG 2
S2600-8
User debug switch
Default out of the box configuration is
OFF
3.7.3 Input Power Selection (2)
The development kit can be powered using either external DC power supply or by using a battery.
The input power source selection can be done using the power selection switch S300 as mentioned
below.
3.7.3.1 Input Power Selection Switch S300 (2)
The S300 switch is used to select the power source. To select the external DC power supply as the
power source, change the switch towards the BUCK position. To power up the kit using the battery,
change the switch towards the BATT position. Default position is BUCK.

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Figure 4. Power source selector switch S300 (2)
3.7.3.2 Battery ID and Thermistor Configuration DIP Switch S301 (4)
Battery ID and thermistor configuration is handled by the DIP switch S301. This switch has two sub
switches, one is used for battery ID and another one is used for battery thermistor. The battery
thermistor DIP switch should be closed to the ON position when power is supplied by the external
power supply or when the connected battery does not have a built-in thermistor. The battery ID DIP
switch should be closed to the ON position when power is supplied by the external power supply or
to force disabling of the SOM battery charger.
Figure 5. Battery ID and Thermistor DIP Switch S301 (4)

Open-Q™ 660 µSOM Development Kit User Guide
Version 1.0
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3.7.3.3 DC Power Input Jack J400 (1)
The Open-Q 660 µSOM Development Kit power source connects to the 12V DC power supply jack
J400. Starting from the power jack, the 12V power supply branches off into different voltage rails via
step down converters on the carrier board and PMIC on the SOM.
Figure 6. J400 12V DC Power Jack (1)
3.7.3.4 Battery Connector J300 (3)
The Open-Q 660 µSOM Development Kit can also be powered through a battery. Use the J300
connector on the carrier board to connect a battery to power up the kit as shown in the image below.
1
6
Figure 7. Battery Connector J300 (3)
Table 4. Battery Connector J300 Pinout
Pin No
Signal
Description
1
GND
System ground, Battery Negative Wire
2
GND
System ground, Battery Negative Wire
3
BATT_THERM_CONN
Thermistor
4
BATT_ID_CONN
ID Resistor
5
VBATT_CONN
Battery Positive Wire
6
VBATT_CONN
Battery Positive Wire