Intrinsyc Open-Q 2100 User manual

Open-Q™ 2100 Development Kit based on the
Snapdragon™ 2100 (APQ8009W) Processor
User Guide
[Document: ITC-01RND1260-UG-001 Version: 1.4]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q 2100 Development
Kit Based on Snapdragon™ 2100 Series (APQ8009W) Processor and Software License Agreement for the Open-Q 2100 Development Kit,
which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q™ Development Kit
from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part of the defined term
“Documentation” for purposes of the Agreement, solely in support of your permitted use of the Open-Q 2100 Development Kit under the
Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation
and its respective licensors, which they can withhold, condition or delay in its sole discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm® and Snapdragon™ are trademarks of Qualcomm® Incorporated, registered in the United States and other countries. Other
product and brand names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion
contrary to U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-Q™ 2100 Development Kit based on the Snapdragon™
2100 (APQ8009W) Processor User Guide
Document Number ITC-01RND1260-UG-001
Version 1.4
Date Mar. 11, 2019
Revision History
REVISION DATE DESCRIPTION PAGES
1.0 Apr 20, 2017 Initial Draft All
1.1 Jun 19, 2017
•Fixed wrong RAM/ eMMC size
information
•Fixed typo errors on the table 3.9-5
and section 3.8
•Added Getting started section 3.6
•Added section coin cell battery holder
FM connector, micro SD card and
Ethernet connector section 3.9.X
•Removed information related to REV 1
SOM and Carrier. Added REV2 carrier
board changes.
13,14
23
11
37, 38
All
1.2 Oct. 2, 2017 •Added instructions to change display
from HDMI to LCD. 13
1.3 Apr. 25, 2018 •Improved instructions for switching
display output 13
1.4 Mar. 11, 2019 •Fixed error in Wi-Fi specification
•Updated cover photo 16

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Table of Contents
1. INTRODUCTION.................................................................................. 5
1.1 Purpose...................................................................................................... 5
1.2 Scope......................................................................................................... 5
1.3 Intended Audience................................................................................... 5
2. DOCUMENTS ...................................................................................... 6
2.1 Applicable Documents............................................................................. 6
2.2 Reference Documents............................................................................. 6
2.3 Terms and Acronyms.............................................................................. 6
2.4 List of Figures........................................................................................... 8
2.5 List of Tables............................................................................................. 8
3. Open-Q 2100 Development Kit........................................................ 10
3.1 Introduction ............................................................................................. 10
3.2 Development Platform Notice.............................................................. 10
3.3 Anti-Static Handling Procedures.......................................................... 10
3.4 Kit Contents............................................................................................. 10
3.5 Hardware Identification Label............................................................... 11
3.6 Getting Started ....................................................................................... 12
3.6.1 Default DIP switch settings..................................................................................12
3.6.2 Powering up the Open-Q 2100 Development Kit.............................................12
3.6.3 Changing Display Output.....................................................................................13
3.7 System Block Diagram.......................................................................... 13
3.8 Open-Q 2100 SOM................................................................................ 14
3.8.1 SOM Mechanical Properties................................................................................15
3.8.2 SOM Block Diagram .............................................................................................15
3.8.3 Hardware Specification ........................................................................................16
3.8.4 SOM RF Specification for WIFI, BT, GNSS......................................................16
3.9 Open-Q 2100 SOM Carrier Board....................................................... 18
3.9.1 Dip switch S3400 Configuration Options...........................................................19
3.9.2 Dip switch S1700 Configuration Options...........................................................20
3.9.3 Carrier Board Expansion Connectors ................................................................21
3.9.4 DC Power Input J3000 .........................................................................................23
3.9.5 Battery Header J3200...........................................................................................24
3.9.6 Debug Serial UART over USB J2700 ................................................................25
3.9.7 Sensor IO Expansion Header J2600..................................................................25
3.9.8 Digital IO (Low Speed) expansion header J2601.............................................27
3.9.9 Audio IO Expansion (PMIC) Header J3600 ......................................................28
3.9.10 Headset jack J3702 ..............................................................................................29
3.9.11 On Board PCB mount WLAN Antenna ..............................................................29
3.9.12 Open-Q 2100 Display...........................................................................................30
3.9.13 HDMI Connector J2400........................................................................................30
3.9.14 Display Connector J2300.....................................................................................31
3.9.15 Camera Connector J2500....................................................................................34
3.9.16 USB 2.0 Client Port J2800...................................................................................36
3.9.17 USB 2.0 host interface .........................................................................................36

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3.9.18 Coin cell battery holder.........................................................................................37
3.9.19 FM connector J1801.............................................................................................37
3.9.20 Micro-SD card connector J1900 .........................................................................37
3.9.21 Ethernet connector J2801....................................................................................38
3.9.22 Power probe J202.................................................................................................38
3.9.23 GNSS external antenna connector J3501.........................................................39

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™
2100 Development Kit based on the Snapdragon™ 2100 (APQ8009W) Processor.
For more background information on this development kit, visit:www.intrinsyc.com
1.2 Scope
This document will cover the following items on the Open-Q 2100 Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•SOM
•Carrier Board
•Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the
Open-Q 2100 Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 2100 Development Kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q
Development Kit
2.2 Reference Documents
REFERENCE
TITLE
R-1
Hardware Document Set for the Snapdragon APQ8009W based Open-Q
Development Kit
R-2
Open-Q 2100 Schematics (SOM, Carrier)
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed
Peripheral (Serial interfaces like UART /
SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read
only memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication

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RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SOM
System On Module
SPMI
System Power Management Interface
(Qualcomm® PMIC / baseband proprietary
protocol)
SSBI
Single wire serial bus interface
(Qualcomm® proprietary mostly PMIC /
Companion chip and baseband processor
protocol)
UART
Universal Asynchronous Receiver
Transmitter
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed

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2.4 List of Figures
Figure 1 Open-Q 2100 Development Kit.............................................................................................11
Figure 2 Cable connection and DIP switches on the Open-Q 2100 Dev kit........................................12
Figure 3 Open-Q 2100 SOM + Carrier Board Block Diagram............................................................14
Figure 4 Open-Q 2100 SOM................................................................................................................15
Figure 5 SOM Block Diagram.............................................................................................................15
Figure 6 Open-Q 2100 SOM Antenna locations..................................................................................17
Figure 7 Open-Q 2100 Carrier Board ..................................................................................................18
Figure 8 S3400 DIP switch..................................................................................................................19
Figure 9 S1700 DIP switch..................................................................................................................20
Figure 10 J3000 12V DC Power Jack..................................................................................................23
Figure 11 TP3301 to measure VPH_PWR...........................................................................................23
Figure 12 J3200 Battery Header ..........................................................................................................24
Figure 13 J2700 Debug UART over USB ...........................................................................................25
Figure 14 J2600 Sensor Expansion Header .........................................................................................25
Figure 15 J2601 Digital IO (low speed) expansion header..................................................................27
Figure 16 J3600 Audio IO Expansion Header.....................................................................................28
Figure 17 J3702 Audio Line Out Jack.................................................................................................29
Figure 18 On Board PCB mount antenna connection..........................................................................29
Figure 19 HDMI Type A Connector....................................................................................................30
Figure 20 51-Pin Display Connector ...................................................................................................31
Figure 21 Display Board......................................................................................................................32
Figure 22 Display Board Default Configuration..................................................................................33
Figure 23 J2500 Camera Connector.....................................................................................................34
Figure 24 J2800 USB2.0 for ADB.......................................................................................................36
Figure 25 J2900 and J2901 USB2.0 Host Ports...................................................................................36
Figure 26 B1300 Coin cell holder........................................................................................................37
Figure 27 J1801 FM antenna connector...............................................................................................37
Figure 28 J1900 micro-SD card connector ..........................................................................................37
Figure 29 J2801 Ethernet connector ....................................................................................................38
Figure 30 J202 Power probe connector................................................................................................38
Figure 31 J3501 GNSS external antenna connector ............................................................................39
2.5 List of Tables
Table 3.8-1 Open-Q 2100 SOM Hardware Features ...........................................................................15
Table 3.8-2 Open-Q 2100 SOM Hardware Features ...........................................................................16
Table 3.9-1 Open-Q 2100 SOM Carrier Board Mechanical Properties...............................................18
Table 3.9-2 Dip Switch HW / SW configuration.................................................................................19
Table 3.9-3 Dip Switch HW / SW configuration.................................................................................20
Table 3.9-4 Carrier Board Expansion Options and Usage...................................................................21
Table 3.9-5 Battery Connector Header J3200 Pin out.........................................................................24
Table 3.9-6 Sensor Expansion Header J2600 Pin out..........................................................................25
Table 3.9-7 Digital IO (low speed) Expansion Header J2601 Pin out.................................................27
Table 3.9-8 Audio IO Expansion (PMIC) Header J3600 Pin out........................................................28
Table 3.9-9 MIPI CSI Camera Connector J2500 Pin out ....................................................................35

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Table 3.9-10 Power probe J202 Pin out...............................................................................................38
Table 3.9-11 DIP switch S3500 configurations...................................................................................39

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3. OPEN-Q 2100 DEVELOPMENT KIT
3.1 Introduction
The Open-Q2100 DevelopmentKit providesa referenceplatformforQualcomm’slatest2100
series - Snapdragon 2100 processor. This kit is suited for Android / Linux application
developers, OEMs, consumer manufacturers, hardware component vendors, video
surveillance, robotics, camera vendors, and flash chip vendors to evaluate, optimize, test and
deploy applications that can utilize the Qualcomm® Snapdragon 2100 series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for
engineering development, engineering evaluation, or demonstration purposes only and is
meant for use in a controlled environment. This device is not being placed on the market,
leased or sold for use in a residential environment or for use by the general public as an end
user device.
This development platform is not intended to meet the requirements of a commercially
available consumer device including those requirements specified in the European Union
directives applicable for Radio devices being placed on the market, FCC equipment
authorization rules or other regulations pertaining to consumer devices being placed on the
market for use by the general public.
This development platform may only be used in a controlled user environment where
operators have obtained the necessary regulatory approvals for experimentation using a
radio device and have appropriate technical training. The device may not be used by
members of the general population or other individuals that have not been instructed on
methods for conducting controlled experiments and taking necessary precautions for
preventing harmful interference and minimizing RF exposure risks. Additional RF exposure
information can be found on the FCC website at http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 2100 Development Kit has exposed electronics and chipsets. Proper anti-static
precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap.
3.4 Kit Contents
The Open-Q 2100 Development Kit includes the following:
oOpen-Q 2100 SOM with the Snapdragon 2100 (APQ8009W) processor,
memory, power management, and WiFi/BT components
onano-ITX form-factor carrier board
oAC power adapter and HDMI cable

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o4.5” FWVGA (480x854) 16.7 M LCD (Optional Accessory)
Figure 1 Open-Q 2100 Development Kit
The development kit comes with Android for Wearables 7.1.1 software pre-programmed on
the CPU board (SOM). Please contact Intrinsyc for availability of camera modules, sensor
boards, and other accessories: [e-mail]
3.5 Hardware Identification Label
Labels are present on the CPU board and the nano-ITX form-factor carrier board. The
following information is conveyed on these two boards:
CPU board (SOM):
•Serial Number
•WiFi MAC address
Refer to http://support.intrinsyc.com/account/serialnumber for more details about
locating the serial number, as this will be needed to register the development kit. To
register a development kit, please visit: http://support.intrinsyc.com/account/register
Note: Please retain the SOM and carrier board serial number for warranty purposes.

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3.6 Getting Started
The instruction in this section explains how to setup the Open-Q 2100 Development Kit.
3.6.1 Default DIP switch settings
The DIP switch S3400 and S1700 is by default set to OFF positions. This setting corresponds
to HDMI display selected, SMB charger enabled, USB forced boot disabled and eMMC boot
option selected. See section 3.9.1 and 3.9.2 for other DIP switch settings. Cable connections
and DIP switch positions are shown in figure below:
3.6.2 Powering up the Open-Q 2100 Development Kit
To power-up the board, perform the following steps below:
1. At a static-safe workstation, remove the development kit board carefully from the anti-
static bag.
2. Connect the HDMI output from the development kit to a display.
3. Connect the Power Adapter to the 12V DC Jack and then press and hold the power
button until you see the Intrinsyc logo appear on the display (~3 seconds).
4. Plug in a USB mouse to navigate the UI on the HDMI display.
5. If connecting the “Recovery USB” port to a PC for ADB access, make sure to connect
this only after the 12V power adapter is connected. Also note that when using the
Recovery USB port, the host USB ports and Ethernet port are disabled.
J3000 (DC IN)
J3200 (Battery
Connector)
J2800, microB USB (recovery/
ADB port)
Figure 2 Cable connection and DIP switches on the Open-Q 2100 Dev kit
WARNING!
The above steps should be followed in exact sequence when battery is not
connected to the Dev Kit. Failing to do so prevents system from booting. If a
battery is not connected, the user has to always plug in the 12V power source
before the USB ADB cable is plugged in.

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3.6.3 Changing Display Output
The Open-Q 2100 Dev Kit is shipped pre-configured to HDMI display. If you need to change
the display output between LCD and HDMI, use the following commands to switch the
display. Note that you also must switch the HDMI/DSI select DIP switch.
For OSD LCD display
adb reboot bootloader
fastboot oem select-display-panel osd_disp_fwvga_video
fastboot reboot
Switch the HDMI/DSI select switch (S3400-1) to ON to route display signals to the
LCD panel. See section 3.9.1.
For HDMI 720p mode
adb reboot bootloader
fastboot oem select-display-panel adv7533_720p
fastboot reboot
Switch the HDMI/DSI select switch (S3400-1) to OFF to route display signals to the
DSI-HDMI bridge chip. See section 3.9.1.
Please, note that once <fastboot oem> feature is used it will be the only way to switch
between HDMI and LCD modes unless the device is re-flashed.
3.7 System Block Diagram
The Open-Q 2100 SOM development platform consists of three major components
oOpen-Q 2100 SOM
oCarrier board for I/O and connecting with external peripherals
oDisplay Adapter Board (optional accessory)
The following diagram explains the interconnectivity and peripherals on the development kit.

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512 MB
LPDDR3,
4 GB
eMMC
(PoP)
4-bit SDIO
SOM Carrier Board
Analog
Audio
Display & Touch
Connector
4L DSI
CSI
Audio
Exp. Connectors
(PMIC)
DC
Jack
USB
LEDs
BPLSs / GPIOs
Sensor
Connector
SSCs / GPIOs / IRQs
2 x Analog MIC
DSI
Controls
GPIO’s
Low
Speed
Expansion
Header
GPS PCB
antenna
Display Adapter
Coax
5V Buck
SDC2
Touchscreen
SPI/I2C
HDMI
RST/Vol -
POWER
VOL +
GENERAL
UART
USB
HUB
Type uB
(Recovery
debug/
Charging)
CSI 2Lane
GPIOs/INTs
TTL to
USB
GPIOs
USB Host
Type A
Coin Cell Battery
DSI 4L
DSI to
HDMI
Bridge
HDMI
Type A
Connector
FM
antenna
FM
Antenna
Header
1 x Earphone
1 x Headset
1 x Speaker
User/
Configuration
Switch
USB Host
Type A
Ethernet
Battery
Charger
Battery
Connector
USB HS
VPH_PWR
3.3V
Buck
5V Buck
1.8V
Buck
USB host/client Switch cable detect
DSI Switch Select
Chip Antenna
(2.5/5GHz)
Coax
WiFi/BT antenna
GNSS antenna
GNSS external
antenna (SMA
connector )
GNSS
front end
Power
sense
USB host VBUS
3.3V
Buck
USB HUB
(USB host/ Ethernet)
5V Boost
HDMI
1.2V
Buck
Camera
APQ8009W
CPU
PM8916
PMIC
WCN3620
WiFi/BT
WGR7640
GNSS
GPS Antenna
switch
headset
connector
Figure 3 Open-Q 2100 SOM + Carrier Board Block Diagram
3.8 Open-Q 2100 SOM
The SOM provides the basic common set of features with minimal integration efforts for end
users. It contains the following:
•Snapdragon™ 2100 Series (APQ8009W) main application processor
•LPDDR3 up to 533MHz 512MB RAM (POP)
•4GB eMMC flash memory (POP)
•PM8916-1 – PMIC for Peripheral LDOs, Boost Regulators
•WCN3620 Wi-Fi + BT combo chip
•GNSS Receiver (GPS, GLONASS, COMPASS)
15 mm
31.5 mm
15 mm
31.5 mm

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Figure 4 Open-Q 2100 SOM
3.8.1 SOM Mechanical Properties
Table 3.8-1 Open-Q 2100 SOM Hardware Features
Dimension
31.5 mm x 15 mm
Interface
2 x 100-pin Hirose DF40 connectors (B2B Connector)
Shielding
A top side shield can for the Wi-Fi/GPS RF section is installed by default.
3.8.2 SOM Block Diagram
The Open-Q 2100 SOM measuring 31.5mm x 15mm is where all the processing occurs. It is
connected to the carrier board via two 100 pinHirose DF40 connectors.The purpose of these
connectors is to bring out essential signals such that other peripherals can be connected to
the platform.
APQ8009W
512MB
LPDDR3,
4GB
eMMC
(PoP)
PM8916-1
4-bit SDIO
4L DSI
USB HS
WCN3620
WiFi/BT
GNSS
WGR7640
Open-Q™ 2100
System on Module
IQ + SSBI
CSI 0
JTAG JTAG DSI 0
USB
SDC2
RF
RF
Power Circuit
LEDs
RGBMPP
VBAT
UART
Audio
SPMI
2L CSI
GPIO/ MPP
GPIOs GPIOs
SPI/ I2C
UART
IQ + SSBI
Figure 5 SOM Block Diagram

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3.8.3 Hardware Specification
The Open-Q 2100 SOM platform encompasses the following hardware features:
Table 3.8-2 Open-Q 2100 SOM Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
APQ8009W
Qualcomm® Snapdragon™
2100 Processor
ARM Cortex-A7 CPU, quad
core, 32-bit up to 1.09GHz
PMIC (PM8916-1)
Qualcomm® PMIC,
Companion PMIC for
APQ8009W processor
NA
Memory
512MB LPDDR3,
4GB eMMC
Memory POP
Up to 533MHz LPDDR3 POP
on CPU BGA chip. Supports
via 4x32bit channels
Connectivity
Wi-Fi 2.4 GHz via
WCN3620
Wi-Fi Qualcomm WCN3620
Wi-Fi + BT Combo Chip
802.11b/g/n 2.4 GHz via
WCN3620.
BT 2.4 GHz via
WCN3620
WCN3620
Wi-Fi + BT Combo Chip
Support BT 4.0
GNSS via
WGR7640 – SSBI
Qualcomm®
Proprietary
Protocol
GNS Receiver Frontend
GPS, GLONASS, COMPASS
RF Interfaces
1xWLAN / BT
U.FL antenna
connector
Connect to antenna on
carrier board via coax cable
2.4 GHz WLAN antenna
1x GPS
Connect to external antenna
GPS/GLONASS/COMPASS
passive or active antenna
Interfaces
1 x MIPI CSI
Connect to camera
Connectors
CSI0
MIPI Alliance Specification
v1.0
1 x USB HS
Connect to 2 x dual stack
type A USB2.0 via USB line,
1 x micro USB B 2.0 via
switch (from USB line)
USB2.0
1 x MIPI DSI
Connect to 51- pin display
connector. Interfaces with
Intrinsyc Display Adapter
Board
MIPI Alliance Specification
v1.01. MIPI D-PHY
Specification v0.65, v0.81,
v0.90, v1.01
Connector
2 x board to board
connector
Connectors to interface with
carrier board
Hirose DF40C series 100pin
connector
3.8.4 SOM RF Specification for WIFI, BT, GNSS
The SOM includes the following radio interfaces:
oWi-Fi + BT: Antenna 1
oGNSS: Antenna 2

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Antenna 1: Antenna 1 is used for providing Wi-Fi and Bluetooth connectivity to WCN3620.
This antenna is meant to be connected to the carrier board via a coaxial cable or to an
external antenna. The WCN3620 requires an antenna to be connected here for correct
operation.
For details on connecting the Wi-Fi module to the on-board PCB antennas on the carrier
board, refer to section 3.9.11 below.
Antenna 2: Antenna 2 is for the GNSS receiver. This antenna is meant to be connected to
the carrier board via a coaxial cable or to an external antenna. The carrier board includes a
GNSS PCB antenna and option to use an external GNSS antenna via SMA connector. A
passive or an active antenna may be used and a 2.7V bias is provided on the antenna input
for powering an active antenna.
The operating frequencies for WGR7640 are:
GPS: 1574.42 MHz – 1576.42 MHz
GLONASS: 1598 MHz to 1606 MHz
Antenna 1
Antenna 2
Figure 6 Open-Q 2100 SOM Antenna locations

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3.9 Open-Q 2100 SOM Carrier Board
The Open-Q 2100 SOM Carrier board is a nano-ITX form factor board with various
connectors used for connecting different peripherals. The following are the mechanical
properties of the carrier board:
Table 3.9-1 Open-Q 2100 SOM Carrier Board Mechanical Properties
Dimensions
120mm x 120mm
Form Factor
nano-ITX
Major Interfaces
SOM: 2 x 100-pin Hirose DF40 connectors (B2B Connector)
Display: 51 pin JAE (JF08 series) connector
Camera: 41 pin JAE (JF08 series) connector
See section 3.9.3 for details regarding carrier board interfaces
Figure 7 Open-Q 2100 Carrier Board
Debug UART (USB)
Vol (-)
Vol (+)
GP SW
ON/OFF SW
Digital IO
Expansion
CSI0 Interface
(Camera)
Battery Connector
USB client (recovery/
charging)
DC INPUT (12V)
USB host
(type A) x2
USB host
(type A) x2
10/100 Ethernet
RJ45 jack
HDMI
source
W-Fi/ BT
Antenna
DSI0
Interface
(Display)
MicroSD card
slot
Audio (PMIC)
Expansion
SOM connector x2
(SOM shown)
GNSS PCB
Antenna
Headset
connector
GPS
external
Antenna
connector
DIP switches
Sensor
Header

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3.9.1 Dip switch S3400 Configuration Options
Figure 8 S3400 DIP switch
There is a DIP switch S3400 on the top side of the Open-Q 2100 SOM carrier board. The 4-
bit switch allows the user to control the system configuration. Table 3.9-2 below outlines the
pin outs and connections of this DIP switches.
Table 3.9-2 Dip Switch HW / SW configuration
Function
DIP
Switch
Description
Notes
DSI/HDMI SELECT
S3400-1
Toggles between DSI output
and HDMI output mode.
Enables DSI output when DIP
switch is turned ON
Default out of the box
configuration is OFF which is
the HDMI output mode
CHARGE EN
S3400-2
Enables battery charging
Default out of the box
configuration is OFF
USER SW1
S3400-3
User configurable general-
purpose switch
Default out of the box
configuration is OFF
USER SW2
S3400-4
User configurable general-
purpose switch
Default out of the box
configuration is OFF
S3400 DIP
Switch

Open-Q™ 2100 Development Kit based on the Snapdragon™ 2100 (APQ8009W) Processor User Guide Version 1.4
20
Copyright Intrinsyc Technologies Corporation
3.9.2 Dip switch S1700 Configuration Options
Figure 9 S1700 DIP switch
There is a DIP switch S1700 on the top side of the Open-Q 2100 SOM Carrier Board. The
2-bit switch allows the user to control the system configuration and boot option. Table 3.9-3
below outlines the pin outs and connections of this DIP switches.
Table 3.9-3 Dip Switch HW / SW configuration
Function
DIP Switch
Description
Notes
FORCE USB
BOOT
S1700-1
Toggles between FORCE USB boot
and EDL mode. Enables FORCE
USB (GPIO37) when DIP switch is
turned ON for boot recovery
purposes.
Default out of the box
configuration is OFF.
NOTE: FORCE USB boot option
is reserved for use by Intrinsyc
only for boot recovery purposes.
BOOT
CONFIG1
S1700-2
Enables APQ boot configuration 1
when DIP switch is turned ON.
Controlled by APQ GPIO77. See
schematic for boot configuration
options.
Default out of the box
configuration is OFF
Warning! Before making any changes to the dip switch, make sure to note down the
previous configuration. The default switch settings are above.
S1700 DIP
Switch