Intrinsyc Open-Q 660 User manual

Open-Q™ 660 HDK Hardware Development Kit
based on the Snapdragon™ 660 processor
User Guide
[Document: ITC-01IMP1315-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q™ 660 HDK Hardware
Development Kit based on the Snapdragon™ 660 processor and Software License Agreement for the Open-Q 660 Hardware Development
Kit, which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit
from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part of the defined term
“Documentation” for purposes of the Agreement, solely in support of your permitted use of the Open-Q 660 Hardware Development Kit under
the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation
and its respective licensors, which they can withhold, condition or delay in its sole discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm® and Snapdragon™are trademarks of Qualcomm® Incorporated, registered in the United States and other countries. Other
product and brand names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion
contrary to U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-Q™ 660 HDK Hardware Development Kit based on the
Snapdragon™ 660 processor User Guide
Document Number ITC-01IMP1315-UG-001
Version 1.0
Date October 24, 2017
Revision History
REVISION
DATE
DESCRIPTION
PAGES
1.0
October 24,
2017
Initial Draft
All

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Table of Contents
1. INTRODUCTION...................................................................................4
1.1 Purpose ..................................................................................................... 4
1.2 Scope......................................................................................................... 4
1.3 Intended Audience................................................................................... 4
2. DOCUMENTS.......................................................................................5
2.1 Applicable Documents............................................................................. 5
2.2 Reference Documents............................................................................. 5
2.3 Terms and Acronyms .............................................................................. 5
2.4 List of Figures........................................................................................... 7
2.5 List of Tables............................................................................................. 8
3. Open-Q 660 hardware DEVELOPMENT KIT......................................9
3.1 Introduction ............................................................................................... 9
3.2 Development Platform Notice................................................................ 9
3.3 Anti-Static Handling Procedures............................................................ 9
3.4 Kit Contents............................................................................................... 9
3.5 Hardware Identification Label............................................................... 11
3.6 System Block Diagram.......................................................................... 12
3.7 Open-Q 660 Processor Board ............................................................. 13
3.7.1 Processor Board Mechanical Properties........................................................... 14
3.7.2 Processor Board Block Diagram........................................................................ 14
3.7.3 Hardware Specification........................................................................................ 16
3.8 Open-Q 660 Carrier Board................................................................... 16
3.8.1 Dip switch S10 Configuration Options............................................................... 17
3.8.2 Carrier Board Expansion Connectors................................................................ 20
3.8.2.1 Power Options.....................................................................................................................21
3.8.2.2 Debug Serial UART header J2103...................................................................................22
3.8.2.3 Debug Serial UART over USB J2102 ..............................................................................23
3.8.2.4 JTAG header J2101............................................................................................................23
3.8.2.5 Sensor IO Expansion Header J2501................................................................................24
3.8.2.6 NFC Expansion Header J2401 .........................................................................................26
3.8.2.7 ANC Headset Jack J1501..................................................................................................28
3.8.2.8 Audio Inputs Expansion Header J1601............................................................................28
3.8.2.9 Audio Outputs Expansion Header J1602 ........................................................................29
3.8.2.10 USB TYPE A Connector J1101 ........................................................................................31
3.8.2.11 USB3.1 Type-C Connector J1201....................................................................................31
3.8.2.12 On Board PCB WLAN Antenna ........................................................................................31
3.8.2.13 On Board PCB GNSS Antenna.........................................................................................32
3.8.2.14 GNSS SMA Connector J3802...........................................................................................33
3.8.2.15 Camera connectors ............................................................................................................33
3.9 Display Card ........................................................................................... 37
3.9.1 Display Card Overview........................................................................................ 37
3.9.2 Display Card Connector J0501 .......................................................................... 38
3.9.2.1 Connecting the Display Card to the Development Kit....................................................39
3.9.3 Display panel......................................................................................................... 40

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™ 660
HDK Hardware Development Kit based on the Snapdragon™ 660 processor.
For more background information on this development kit, visit: www.intrinsyc.com
1.2 Scope
This document will cover the following items on the Open-Q 660 Hardware Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•Processor board
•Carrier Board
•Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the
Intrinsyc Open-Q 660 Hardware Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 660 Hardware Development
Kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q
Development Kit
2.2 Reference Documents
REFERENCE
TITLE
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral (Serial interfaces
like UART / SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SPMI
System Power Management Interface (Qualcomm® PMIC /
baseband proprietary protocol)
SSBI
Single wire serial bus interface (Qualcomm® proprietary mostly
PMIC / Companion chip and baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter

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UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

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2.4 List of Figures
Figure 1 Assembled Open-Q 660 Hardware Development Kit top........................................................ 10
Figure 2 Assembled Open-Q 660 Hardware Development Kit bottom.................................................. 11
Figure 3 Open-Q 660 Processor board + Carrier Board Block Diagram................................................ 12
Figure 4 Open-Q 660 PROCESSOR BOARD ....................................................................................... 13
Figure 5 Open-Q 660 Processor Board Block Diagram ......................................................................... 15
Figure 6 Open- Q™ 660 Carrier Board .................................................................................................. 17
Figure 7 J0701 12V DC Power Jack....................................................................................................... 22
Figure 8 J2103 3.3V TTL Debug UART................................................................................................ 22
Figure 9 J2102 Debug UART over USB................................................................................................ 23
Figure 10 J2101 JTAG header................................................................................................................ 23
Figure 11 J2501 SENSOR EXPANSION HEADER ............................................................................. 24
Figure 12 J2401 NFC EXPANSION HEADER..................................................................................... 26
Figure 13 ANC HEADPHONE JACK ................................................................................................... 28
Figure 14 J1601 Audio Inputs Expansion Header.................................................................................. 28
Figure 15 J1602 Audio Outputs Expansion Header................................................................................ 29
Figure 16 J1101 USB2.0 Type A Connector.......................................................................................... 31
Figure 17 J1201 USB3.1 Type-C Connector.......................................................................................... 31
Figure 18 On Board PCB WLAN Antennas........................................................................................... 32
Figure 19 GNSS On Board PCB GNSS Antennas ................................................................................. 32
Figure 20 GNSS SMA Connector........................................................................................................... 33
Figure 21 Camera Connectors (J1701, J1801, J1901)............................................................................ 33
Figure 22 HDK 660 Display Card .......................................................................................................... 37
Figure 23 Display Card Default Configuration....................................................................................... 39

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2.5 List of Tables
Table 3.7-1 Open-Q 660 Processor Board Mechanical Properties......................................................... 14
Table 3.7-2 Open-Q 660 Processor Board Hardware Features............................................................... 16
Table 3.8-1 Open-Q 660 Carrier Board Mechanical Properties ............................................................. 17
Table 3.8-2 Dip Switch S2301 HW / SW configuration......................................................................... 18
Table 3.8-3 Dip Switch S2302 HW / SW configuration......................................................................... 19
Table 3.8-4 Carrier Board Expansion Options and Usage...................................................................... 20
Table 3.8-5 Debug UART Header J2103 Pin-out................................................................................... 23
Table 3.8-6 JTAG Header J2101 Pin out................................................................................................ 24
Table 3.8-7 Sensor Expansion Header J2501 Pin out............................................................................. 25
Table 3.8-8 NFC Expansion Header J2401 pin out................................................................................. 27
Table 3.8-9 Audio Inputs Expansion Header J1601 Pin out ................................................................... 29
Table 3.8-10 Audio Inputs Expansion Header J1601 Pin out................................................................. 30
Table 3.8-11 GNSS Antenna Option ...................................................................................................... 33
Table 3.8-12 MIPI CSI Camera Connector Pinouts (J1701, J1801, J1901)........................................... 34
Table 3.8-13 MIPI CSI Camera Use Cases............................................................................................. 36
Table 3.9-1 Display Card Mechanical Properties................................................................................... 37
Table 3.9-2 Display Power Domains...................................................................................................... 39

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3. OPEN-Q 660 HARDWARE DEVELOPMENT KIT
3.1 Introduction
The Open-Q 660 Hardware Development Kit provides a quick reference or evaluation platform
for Qualcomm’s Snapdragon™660 processor. This kit is suited for Android / Linux application
developers, OEMs, consumer manufacturers, hardware component vendors, video
surveillance, robotics, camera vendors, and flash chip vendors to evaluate, optimize, test and
deploy applications that can utilize the Qualcomm® Snapdragon™660 series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering
development, engineering evaluation, or demonstration purposes only and is meant for use in
a controlled environment. This device is not being placed on the market, leased or sold for use
in a residential environment or for use by the general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available
consumer device including those requirements specified in the European Union directives
applicable for Radio devices being placed on the market, FCC equipment authorization rules
or other regulations pertaining to consumer devices being placed on the market for use by the
general public.
This development platform may only be used in a controlled user environment where operators
have obtained the necessary regulatory approvals for experimentation using a radio device and
have appropriate technical training. The device may not be used by members of the general
population or other individuals that have not been instructed on methods for conducting
controlled experiments and taking necessary precautions for preventing harmful interference
and minimizing RF exposure risks. Additional RF exposure information can be found on the
FCC website at http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 660 Hardware Development Kit has exposed electronics and chipsets. Proper
anti-static precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap
3.4 Kit Contents
The Open-Q 660 Hardware Development Kit includes the following:
oOpen-Q 660 Processor board with the Snapdragon™660 (SDA660) processor
main CPU board
oMini-ITX form-factor carrier board for I/O and connecting with external peripherals
o12V power adapter
oUSB type-C cable and charger

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o5.7” (1080x1920) AMOLED Display card (Additional Accessory)
oLithium ion battery 4.4V/3000mAh (Additional Accessory)
Figure 1 Assembled Open-Q 660 Hardware Development Kit top

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Figure 2 Assembled Open-Q 660 Hardware Development Kit bottom
The development kit comes with Android software pre-programmed on the CPU board or
processor board. Please contact Intrinsyc for availability of camera modules, sensor boards,
and other accessories: [email protected]
3.5 Hardware Identification Label
Labels are present on the CPU board. The following information is conveyed on these two
boards:
Processor board:
•Serial Number
•WIFI MAC address
Refer to http://support.intrinsyc.com/account/serialnumber for more details about locating
the serial number, as this will be needed to register the development kit. To register a
development kit, please visit: http://support.intrinsyc.com/account/register
Note: Please retain the and carrier board serial number for warranty purposes.

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B2B
3.0GHz CLK
8.6Gbps
USB to UART
Bridge
Universal
eMCP 12x15mm
B2B
BLSP2_UART
RCM
Carrier Board (1-6-1)
Baseband Daughter Card (2-6-2)
LEDs
Display Adaptor Card
QCT800s 5.7" FHD AMOLED
ImproveTouch
8.6Gbps-DPHY
1x 4lanes
Data/Clk
Vol+
Vol- (RESIN_N)
Power
38.4
1x4lanes
BLSP2_I2C
HVDCP
SPI
Wifi
Sensor Test Card
I2C
RX/TX
WCSS
WCSS1 WCI2
BLSP5_UART
LPI_UART1
LPI_SLIMBUS
WLAN-BT COEX
WLAN_CH0 CNTRL
WAN-WCN COEX
BT/FM HCI
BLE Sensor
BT/FM Audio
Coax
SPI
BLSP1_SPI
BLSP6_I2C
Camera Te st Card
Dual
Illumination LED
Rear Camera
Main Camera1
Blue Wire
Flash_LED1
Flash_LED2
I2C
1x4 lanes
Main Camera2
1x4 lanes
DMIC X3 Audio
Test Card
Front CAM
1x4 lanes
I2C
uMCP 11.5x13mm
UFS2.1 M-PHY
Data/Clk
SLIMBUS
Speaker
EBI0
EBI1
Receiver
Coax.
GNSS
Type C
Type A
JTAG
USB Hub
Type A
Boot Config
Micro B
FORCED_USB_BOOT
(CH1)
3.6 System Block Diagram
The following diagram explains the interconnectivity and peripherals on the development kit.
The following diagram explains the interconnectivity and peripherals on the development kit.
Magneto(CS1_N)
Accel/Gyro(CS_N)
Figure 3 Open-Q 660 Processor board + Carrier Board Block Diagram
I2C
8bit eMMC5.1
Sensor Exp.
Audio In
Exp.
Audio Out
Exp.
Sensor Exp.

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3.7 Open-Q 660 Processor Board
The Processor board provides the basic common set of features with minimal integration
efforts for end users. It contains the following:
•Snapdragon 660 (SDA660) main application processor
•Memory (eMCP/uMCP compatible design)
oNote: eMCP is the only configuration available from Intrinsyc
•eMCP: 64GB eMMC 5.1 + LPDDR4x up to 1866MHz 6GB RAM
•uMCP: 128GB UFS 2.1 + LPDDR4x up to 1866MHz 6GB RAM
•PMIC: PM660 + PM660A –PMIC for Peripheral LDOs, Boost Regulators
•WCN3980 Atheros Wi-Fi + BT +FM combo chip over SLIMbus, Analog IQ,
UART, PCM
•WCD9335 Audio Codec
•SDR660 GNSS support
Figure 4 Open-Q 660 PROCESSOR BOARD

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3.7.1 Processor Board Mechanical Properties
Table 3.7-1 Open-Q 660 Processor Board Mechanical Properties
Area
42 cm2(60 mm x 70 mm)
Interface
2 x 240-pin high speed board to board connectors.
Thermal
A top side heat sink and a bottom side heat conductive metal plate are
installed by default.
3.7.2 Processor Board Block Diagram
The Open-Q660 Processor board measuring 60mm x 70mm is where all the processing occurs.
It is connected to the carrier via two 240-pin high speed board-to-board connector. The purpose
of the connectors is to bring out essential signals such that other peripherals can interface with
the platform.

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B2B
3.0GHz CLK
8.6Gbps
JTAG
B2B
eMCP12x15mm
RX/TX
WCSS
WCSS1
WCI2
BLSP5_UART
LPI_UART1
LPI_SLIMBUS
BLSP1_SPI
BLSP6_I2C
Flash_LED1
Flash_LED2
BLSP2_UART
RCM
Baseband Daughter Card (2-6-2)
8.6Gbps-DPHY
1x 4lanes
Data/Clk
CXO
2xI/Q
WLAN-BTCOEX
WLAN_CH0CNTRL
WAN-WCNCOEX
BT/FM HCI
BLESensor
BT/FMAudio
SPI
I2C
I2C
1x4 lanes
UIM
UIM
1x4 lanes
1x4 lanes
I2C
SDA660
UFS2.1M-PHY
Data/Clk
EBI0
EBI1
clk/data
USB3.1+DP
USB2.0
UART
Figure 5 Open-Q 660 Processor Board Block Diagram
1x4lanes
8bit eMMC5.1
4bit SD3.0
SDC2
3
QLINK
3
QLINK
3
I2C

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3.7.3 Hardware Specification
Table 3.7-2 Open-Q 660 Processor Board Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
SDA660
Qualcomm® Snapdragon™ 660
Processor
Qualcomm® Kyro CPU,
quad core, 64-bit ARM V8
compliant processor,
2.2GHz
PMIC (PM660 & PM660A)
Qualcomm® PMIC, Companion PMIC
for SDA660 processor
NA
Memory
eMCP
64GB eMMC + 6GB LPDDR4X
eMMC 5.1+ LPDDR4x up
to 1866MHz
Connectivity
Wi-Fi 2.4 GHz/ 5GHz via
WCN3980WCN3980 –
Analog IQ, WSI 2.0,
Wi-Fi Atheros WCN3980WCN3980
Wi-Fi + BT +FM Combo Chip
802.11a/b/g/n/ac 2.4/5.0
GHz via
WCN3980WCN3980 over
analog IQ, WSI 2.0,
BT 2.4 GHz via
WCN3980WCN3980 –
UART / SLIMbus
Wi-Fi Atheros WCN3980WCN3980
Wi-Fi + BT +FM Combo Chip
Support BT 5.0 + HS and
backward compatible with
BT 1.x, 2.x + EDR
GNSS via SDR660 –Qlink
Qualcomm Proprietary
Protocol
GNSS Frontend
GNSS/ GLONASS/
COMPASS/Galilei
RF
2xWLAN / BT
Connect to antenna on carrier board
via coax cable
2.4/ 5 GHz
1x GNSS
Connect to antenna on carrier board
via coax cable
GNSS/ GLONASS/
COMPASS /Galilei
Audio
1 x Headset Output
Headset/ headphone output
Analog differential output
2 x Loud-speaker
2 x loud-speaker output
Digital output
1 x Earpiece output
Earpiece output
Analog differential output
3 x analog MICs
Analog MIC input
Analog differential input
3 x digital MICs
Digital MIC input
Digital input
Camera
3 x MIPI CSI
Camera Connectors
CSI0, CSI1, CSI2
MIPI Alliance Specification
v1.2
Display
1 x MIPI DSI (DSI0 & DSI1)
+ Touch
100-pin display Connector
100- pin display connector
MIPI Alliance Specification
v1.2.
MIPI D-PHY Specification
v0.65, v0.81, v0.90,
v1.01 ,v1.2
USB
1 x Type-A USB 2.0 HOST
1 x Type-C USB 3.1
Type-A USB 2.0 HOST
Type-C USB 3.1
USB2.0
USB3.1
Connectors
2 x 240pin Carrier
board connector
Connector for Carrier board
2 x 240 pin B2B connector
3.8 Open-Q 660 Carrier Board
The Open-Q 660 Carrier board is a Mini-ITX form factor board with various connectors used
for connecting different peripherals. The following are the mechanical properties of the carrier
board:

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Table 3.8-1 Open-Q 660 Carrier Board Mechanical Properties
Dimensions
289 cm2(170mm x 170mm)
Form Factor
Mini-ITX
Major Interfaces
Carrier board: 2x240 pin board to board connector
Display: 100 pin board to board connector
Thermal
Thermal pad is placed between the Carrier board and carrier board
Figure 6 Open- Q™ 660 Carrier Board
3.8.1 Dip switch S10 Configuration Options
There is a DIP switch S2301 on the south top side of the Open-Q 660 carrier board. The 8-bit
switch allows the user to control the system configuration and boot options. Table 3.8-1 below
outlines the pin outs and connections of this DIP switches.

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Table 3.8-2 Dip Switch S2301 HW / SW configuration
Function
DIP Switch
Description
Notes
FORCED_USB_BOOT
S2301-1
Toggles between FORCE
USB boot and EDL mode.
Enables FOCE USB
(GPIO 57) when DIP
switch turned on
Default out of the box
configuration is OFF
WATCHDOG _DISABLE
S2301-2
Enables
WATCHDOG_DISABLE
when DIP switch turned
on. Controlled by SDA-
GPIO 96
Default out of the box
configuration is OFF
BOOT_CONFIG[1]
S2301-3
Enables SDA boot
configuration 1 when DIP
switch turned on.
Controlled by SDA-GPIO
97
Default out of the box
configuration is OFF
BOOT_CONFIG[2]
S2301-4
Enables SDA boot
configuration 2 when DIP
switch turned on.
Controlled by SDA-
GPIO98
Default out of the box
configuration is OFF
BOOT_CONFIG[3]
S2301-5
Enables SDA boot
configuration 3 when DIP
switch turned on.
Controlled by SDA
GPIO60
See schematic for boot
configuration options.
Carrier board
Default out of the box
configuration is OFF
N/C
S2301-6
NA
NA
N/C
S2301-7
NA
NA
N/C
S2301-8
NA
NA
There is another DIP switch S2302 on the north top side of Open-Q 660 carrier board. The
8-bit switch allows the user to control the system configuration and boot options.

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Table 3.8-3 Dip Switch S2302 HW / SW configuration
Function
DIP Switch
Description
Notes
CHARGE_DISABLE
S2302-1
Disable charge when DIP
switch turned on
Default out of the box
configuration is OFF
which enables system
charge from USB
Note: make sure turn on
this switch when DC-12V
input and USB are both
present
N/C
S2302-2
NA
NA
HUB_RESET_SW
S2302-3
Enables hardware reset
from general
switch(J2204) when DIP
switch turned on
Default out of the box
configuration is OFF
Note: Default HUB reset
control is from s/w,
hardware rework is
needed to enable this
function
MSM_PS_HOLD
S2302-4
Enables the
JTAG_PS_HOLD mode
when DIP switch turned
on
Default out of the box
configuration is OFF
N/C
S2302-5
NA
NA
N/C
S2302-6
NA
NA
N/C
S2302-7
NA
NA
BLSP_TP_CONFIG
S2302-8
Config the signals
connected to BLSP_TP
Default out of the box
configuration is OFF
Note: SSC SPI2 is routed
to BLSP_TP by default
Warning! : Before making any changes to the dip switch, make sure to note down the
previous configuration. The default switch settings are above.

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3.8.2 Carrier Board Expansion Connectors
The following table lists the connectors, expansions and their usages on the carrier board:
Table 3.8-4 Carrier Board Expansion Options and Usage
Domain
Description
Specification
Usage
Power
AC / Barrel charger
12 V DC Power Supply
5 A
Power Supply
Battery connector
8 pin header
For providing power from
4.35V/3000mAh battery
Debug Serial via USB
Debug Serial UART
console over USB for
development
USB Micro B connector
Development Serial
Connector for debug output
via USB
JTAG
OS / Firmware /QFROM
Programming / Debugging
JTAG
Standard 20-pin connector,
ARM and OpenDSP –
Lauterbach
QFROM / eMMC / Platform
EEPROM programming
ARM / Open DSP
debugging
Buttons
Power
SMD Button
Power Button for Suspend /
Resume and Power off
Volume +
SMD Button
Volume +Key
Volume –
SMD Button
Volume –Key
General Purpose
SMD Button
Reserved button for general
purpose
NFC Board Header
20 pin NFC expansion
connectors
NA
NA
Micro SD
Micro SD card
4bit Micro SD card support
External Storage
ANC Audio Jack
Audio Jack
Supported using WCD9335
ANC audio jack providing
2lineout and 1 headset
drivers (shared with ANC)
Audio support
3-Digital Microphone via
audio input expansion
header
Audio expansion
Supported using WCD9335
Digital Audio header
For Digital audio input for
Digital MIC, I2S codec, Slim
bus interface.
3-Analog Microphone via
audio input expansion
header
Audio expansion
Supported using WCD9335
Analog Audio header
For Analog audio input for
Analog MIC (differential
signal)
2-Loud Speaker via audio
output expansion header
Audio expansion
Supported using WCD9335
Analog Audio header
For loud speaker output
after signal has been
processed
Earpiece via audio output
expansion header
Audio expansion
Supported using WCD9335
Analog Audio header
For earpiece output after
signal has been processed
USB 2.0 Host
USB 2.0 Host
Type-A dual port header
For Mouse and Keyboard
USB 3.1
USB 3.1
Type-C header
Transfer data to and from
CPU
WLAN Antenna
1X PCB Antenna
2.4 –5 GHz
Antenna to Carrier board