Intrinsyc Open-Q 845 mSOM User manual

Open-Q™ 845 µSOM Development Kit
User Guide
[Document: ITC-01DEV1430-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q Development Kit Based on
Snapdragon 845 Series (SDA845) Processor and Software License Agreement for the Open-Q 845 Development Kit, which you or the legal entity you
represent, as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation
(“Agreement”). You may use this document, which shall be considered part ofthe defined term “Documentation” for purposes of the Agreement, solely
in support of your permitted use of the Open-Q 845 Development Kit under the Agreement. Distribution of this document is strictly prohibited without
the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole
discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand
names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to
U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-Q™ 845 µSOM Development Kit User Guide
Document Number ITC-01DEV1430-UG-001
Version 1.0
Date Oct. 7, 2019
History
REVISION DATE DESCRIPTION PAGES
1.0 Oct. 7, 2019 Initial Release All

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Table of Contents
1. INTRODUCTION.................................................................................. 5
1.1 Purpose........................................................................................................ 5
1.2 Scope........................................................................................................... 5
1.3 Intended Audience...................................................................................... 5
2. DOCUMENTS ...................................................................................... 6
2.1 Applicable Documents................................................................................ 6
2.2 Reference Documents................................................................................. 6
2.3 Terms and Acronyms.................................................................................. 6
3. Open-Q 845 µSOM Development Kit................................................. 8
3.1 Introduction................................................................................................. 8
3.2 Development Platform Notice.................................................................... 8
3.3 Anti-Static Handling Procedures................................................................ 8
3.4 Development Kit Contents.......................................................................... 8
3.4.1 Important Locations...................................................................................................9
3.4.2 Block Diagram.........................................................................................................11
3.4.3 Optional Accessories ...............................................................................................12
3.5 Getting Started.......................................................................................... 13
3.5.1 Registration..............................................................................................................13
3.5.2 Configuration Switch Settings.................................................................................13
3.5.3 Powering Up the Development Kit..........................................................................13
3.6 Open-Q 845 µSOM................................................................................... 14
3.7 Open-Q 845 Carrier Board ....................................................................... 14
3.7.1 SOM Board to Board Connectors (33) ....................................................................15
3.7.2 Boot Configuration DIP Switch S2600 (37)............................................................15
3.7.3 Input Power Selection..............................................................................................16
3.7.4 SOM Current Sense Header J301 (35).....................................................................18
3.7.5 Coin Cell Battery Holder B300 (30)........................................................................19
3.7.6 Power Header J700 (36)...........................................................................................20
3.7.7 User Buttons and LEDs (7, 36)................................................................................20
3.7.8 Debug Serial UART over USB J1600 (12)..............................................................21
3.7.9 USB 3.1 Type C (for ADB) J2300 (11)...................................................................21
3.7.10 USB 3.1 Type A Connector J2400 (5).....................................................................21
3.7.11 Micro SD Card Socket J1500 (22)...........................................................................22
3.7.12 Display Connector J1400 (38).................................................................................23
3.7.13 Camera Connectors J1000 (15), J1100 (16), J1200 (17), J1300 (18).......................24
3.7.14 Camera Flash Connectors J1001 (19) and J1201 (20).............................................24
3.7.15 Mini-PCIe Card Connector J2801 (24)....................................................................25
3.7.16 Digital IO Expansion Header J2200 (23).................................................................26
3.7.17 Sensor IO Expansion Header J2100 (21).................................................................26
3.7.18 Audio Inputs Expansion Header J1900 (27)............................................................27
3.7.19 Audio Outputs Expansion Header J1901 (26) .........................................................27
3.7.20 Audio IO Expansion Header J2000 (10)..................................................................28
3.7.21 Audio Headset Jack J1800 (8) .................................................................................29
3.7.22 WLAN / BT Antenna Connections (13, 14) ............................................................29
3.7.23 Quiet Thermistor RT800 (35)..................................................................................30

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3.7.24 Haptic Output Header J802 (9)................................................................................30
List of Figures
Figure 1. Assembled Open-Q 845 µSOM Development Kit.................................................................9
Figure 2. Open-Q 845 µSOM Dev Kit Block Diagram.......................................................................11
Figure 3. DIP switch assignments........................................................................................................16
Figure 4. Input Power Selection Locations..........................................................................................17
Figure 5. SOM Current Sense Header J301 (5) ...................................................................................19
Figure 6. Mini-PCIe USB Enable DIP Switch (6)...............................................................................22
Figure 7. Micro SD Card Socket J1500...............................................................................................22
Figure 8. Display Connector J1400......................................................................................................23
Figure 9. Typical Connection for Camera Flash Connector................................................................25
Figure 10. Mini-PCIe and Optional SIM Card Sockets.......................................................................25
List of Tables
Table 1. List of Development Kit Features itemized in the figure above............................................10
Table 2. Carrier Board Features...........................................................................................................14
Table 3 - Boot Configuration DIP Switch Settings..............................................................................16
Table 4 – Battery ID / Thermistor Configuration DIP Switch Settings...............................................17
Table 5. Battery Connector J300 Pinout..............................................................................................18
Table 6 - Power Header J301 Pinout....................................................................................................19
Table 7. Power Header J700 (36).........................................................................................................20
Table 8. Development Kit Buttons (7).................................................................................................21
Table 9. Development Kit LEDs (36)..................................................................................................21
Table 10. Camera Flash Connectors pinout.........................................................................................24
Table 11. Digital IO Expansion Header J2200 Pinout.........................................................................26
Table 12 - Sensor Expansion Header J2100 Pinout.............................................................................26
Table 13. Audio Inputs Expansion Header Pinout J1900....................................................................27
Table 14. Audio Outputs Expansion Header Pinout J1901..................................................................28
Table 15. Audio IO Expansion Header Pinout J2000..........................................................................28
Table 16. Haptic Output Header Pinout J802 ......................................................................................30

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide instructions and technical information on the Open-Q
845 µSOM Development Kit.
You can find information on this and other Intrinsyc development kits on the Intrinsyc web site:
https://www.intrinsyc.com/development-kits/
1.2 Scope
This document will cover the following items on the Open-Q 845 µSOM Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•SOM
•Carrier Board
•Available peripherals
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the Intrinsyc
Open-Q 845 µSOM Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 845 µSOM Development Kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-QDevelopment
Kit
2.2 Reference Documents
The below listed documents are available on the Intrinsyc Technical Portal:
https://tech.intrinsyc.com (dev kit registration required).
REFERENCE
TITLE
R-1
Open-Q 845 µSOM HW Device Specification
R-2
Open-Q 845 µSOM – Carrier Board Design Guide
R-3
Open-Q 845 µSOM Schematics (SOM and Carrier)
R-4
Open-Q 845 µSOM Development Kit – Display Adapter Design Guide
R-5
Open-Q 845 µSOM Development Kit – Camera Adapter Design Guide
R-6
Open-Q 845 µSOM Development Kit – Battery Charging Tech Note
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface

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MPP
Multi-Purpose Pin
NFC
Near Field Communication
QUP
Qualcomm Universal Peripheral (Serial interfaces like UART /
SPI / I2C/ UIM)
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SOM
System on Module
SPMI
System Power Management Interface (Qualcomm PMIC /
baseband proprietary protocol)
SSBI
Single wire serial bus interface (Qualcomm proprietary mostly
PMIC / Companion chip and baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

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3. OPEN-Q 845 µSOM DEVELOPMENT KIT
3.1 Introduction
The Open-Q 845 provides a quick reference and evaluation platform for the Qualcomm Snapdragon
SDA845 Platform. The development kit is suited for Android application developers, OEMs,
consumer manufacturers, hardware component vendors, camera vendors, and product designers to
evaluate, optimize, test and deploy applications that can utilize the Qualcomm Snapdragon SDA845
Platform technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering
development, engineering evaluation, or demonstration purposes only and is meant for use in a
controlled environment. This device is not being placed on the market, leased or sold for use in a
residential environment or for use by the general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available
consumer device including those requirements specified in the European Union directives applicable
for Radio devices being placed on the market, FCC equipment authorization rules or other
regulations pertaining to consumer devices being placed on the market for use by the general public.
This development platform may only be used in a controlled user environment where operators have
obtained the necessary regulatory approvals for experimentation using a radio device and have
appropriate technical training. The device may not be used by members of the general population or
other individuals that have not been instructed on methods for conducting controlled experiments
and taking necessary precautions for preventing harmful interference and minimizing RF exposure
risks. Additional RF exposure information can be found on the FCC website at
http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 845 µSOM Development Kit has exposed electronics and chipsets. Proper anti-static
precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap.
3.4 Development Kit Contents
The Open-Q 845 µSOM Development Kit comes with Android software pre-programmed and
includes the following:
oOpen-Q 845 µSOM with the Snapdragon 845 (SDA845) processor
oMini-ITX form-factor carrier board
oAC power adapter

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3.4.1 Important Locations
The diagram below shows the locations of key components, interfaces, and controls.
21 43
29
30
34
58 9 10 11 12
713
14
17
20
16
19
15
37
36
2122
27
23
26
18
28
32
31
33
38
6
25
24
35
Figure 1. Assembled Open-Q 845 µSOM Development Kit

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Table 1. List of Development Kit Features itemized in the figure above
Position
Feature Description
Reference Designator
1
DC Power Supply Jack
J400
2
Power Source Selector
S300
3
Battery Input Header
J300
4
Battery Configuration DIP Switch
S301
5
USB 3.1 Type A Connector
J2400
6
Mini-PCIe USB Enable DIP Switch
S2401
7
Buttons: General Purpose / Power / Volume Up / Volume Down
S2501 / S2503 / S2500 /
S2502
8
Audio Headset Jack
J1800
9
Haptic Motor Header
J802
10
Audio I/O Header
J2000
11
USB 3.1 Type-C connector for ADB
J2300
12
USB Serial Debug Console
J1600
13
WLAN/BT Channel 0 External Antenna Connector
J2701
14
WLAN Channel 1 External Antenna Connector
J2700
15
Camera 1 Connector
J1000
16
Camera 2 Connector
J1100
17
Camera 3 Connector
J1200
18
Camera 4 Connector
J1300
19
Flash 1 Header
J1001
20
Flash 2 Header
J1201
21
Sensors Expansion Header
J2100
22
Micro SD card socket (on bottom side of Carrier Board)
J1500
23
Digital IO Expansion Header
J2200
24
Mini-PCIe Card Connector (on bottom side of Carrier Board)
J2801
25
SIM Card Socket for Mini-PCIe (on bottom side of Carrier Board)
J2800
26
Audio Outputs Expansion
J1901
27
Audio Inputs Expansion
J1900
28
Audio Codec Module (on top side of Carrier Board underneath
Display Adapter)
U1700
29
Power Header
J700
30
Coin Cell Holder
B300
31
Open-Q 845 µSOM, WLAN/BT CH0 Antenna Connector
J2200 (on µSOM)
32
Open-Q 845 µSOM, WLAN CH1 Antenna Connector
J2201 (on µSOM)
33
Open-Q 845 µSOM
34
On-Board Quiet Thermistor
RT800
35
SOM Current Sense Probe Header
J301
36
LEDs: (Charge State / Power / Blue / Green / Red)
DS2503 / DS2504 /
DS2500 / DS2501 /
DS2502
37
System Configuration DIP Switch
S2600
38
Open-Q LCD Panel

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3.4.2 Block Diagram
The block diagram below shows the connectivity and major components of the Open-Q 845 µSOM
Development Kit.
Open-Q
tm
845 µSOM Development Board
Open-Q
tm
845 µ SOM
GPIO
PM845
PMIC
SPMI
4 lane MIPI
Control / SPI / I
2
C
4 lane MIPI CSI
CCI
UART
SPMI
PMI8998
PMIC
GPIO
Camera
Conn 0
DC Input
Conn
Battery
connector
Power &
Batt Chg
Circuits
Pwr
Switches
& LEDs
Debug UART
microUSB
Display
connector
WiFi / BT
WCN3990
IQ + SSBI
4 lane MIPI
Control / SPI / I
2
C
4 lane MIPI CSI
CCI
CCI
SS
HS
USB3
Type-C
+ DP
3.5mm
Headset
Jack
µSD
socket
Dual-voltage SDIO
Sensor Header
ST Micro V6 Sensor Brd
UART / SPI / I
2
C / GPIO
SDA845
SDA845
UFS flash
64/32GB
LPDDR4X RAM
PoP – 4GB
DSI 0
Debug
UART
USB1 HS
SDC2
SSC
EBI 0-3
BLSP/GPIO
Digital Audio
Expansion Header
WiFi/BT Ant
Connectors
WCN
baseband
FTDI
Serial USB
VBUS
To Battery
Charge
Circuits
4 Lane MIPI CSI
CSI 2
CSI 1
CSI 0
DSI 1
I2S Audio Out
GPIO Expansion Header
BLSP/GPIO
PCB Trace
Antenna
PCB Trace
Antenna
U.FL
U.FL
U.FL
Boot Mode
Switches
SOM Power
Probe
Pwr
Pwr
Coin
Cell
Boot
Mode
Audio Outputs
U.FL
Coax Cables
USB1 SS Tx
USB1 SS RX
SS
DisplayPort
DP video/audio
USB3
Type A
Camera
Conn 1
Camera
Conn 2
WCD9340
Codec
Module
Audio
Input Header
Audio
Output Header
Audio Inputs
Headset I/O
SLIMBus
Audio I/O
SLIMBus
I2S
Flash
Outputs
JTAG JTAG
Testpoints
SDC4
UFS1
PM8005
PMIC
SPMI
CCI
2 Lane MIPI CSI
CSI 3
Camera
Conn 3
HS
SS
USB2 SS TX
USB2 SS RX
USB2 HS
SS
CCI 0
CCI 1
PCIe 0
PCIe 1
SIM
socket
Mini PCIe
socket
PCIe Gen3 1 lane
UFS2
SPI
SPI
USB HS
Mux
HS
HS
Figure 2. Open-Q 845 µSOM Dev Kit Block Diagram

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3.4.3 Optional Accessories
Optional accessories are available for the Open-Q 845 µSOM Development Kit, like LCD Panel,
Camera adapter, and sensor board. Please visit the Intrinsyc product store for availability of these
accessories: https://shop.intrinsyc.com/collections/all, or contact [e-mail].

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3.5 Getting Started
This section explains how to setup the Open-Q 845 µSOM Development Kit and start using it.
3.5.1 Registration
To register the development kit and gain access to the Intrinsyc Technical Document Portal, please
visit: http://tech.intrinsyc.com/account/register.
To proceed with registration, the development kit serial number is required. These serial numbers
can be found on the labels that are present on the SOM and carrier boards. The labels contain the
following information:
•SOM: Serial Number, WIFI MAC address
•Carrier: Serial Number
Note: Please retain the SOM and carrier board serial numbers for warranty purposes.
Refer to http://tech.intrinsyc.com/account/serialnumber for more details about locating the
development kit serial number.
3.5.2 Configuration Switch Settings
The default configuration for the system configuration DIP switch S2600 is for all switches to be
open or OFF. For details about other configurations, see section 3.7.2.
3.5.3 Powering Up the Development Kit
The development kit can be powered up by either using a DC power supply or by connecting a
battery on connector J300. Select the desired power source using the switch S300 on the carrier
board. The green LED DS2504 marked “POWER” on the board is the power LED and should glow
once the development kit is powered. To see the debug logs, connect a serial debug cable to the
J1600 connector.
To power-up the board, perform the following exact steps below detailed below:
1. At a static-safe workstation, remove the development kit board carefully from the anti-static
bag.
2. Connect the Power Adapter to the 12V DC Jack J400 and then press and hold the power
button until you see the Intrinsyc logo appears on the on-board display (~3 seconds).
3. Navigate using the touchscreen on the on-board display.

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3.6 Open-Q 845 µSOM
The Open-Q 845 µSOM contains the core Snapdragon 845 architecture. Measuring in at 50mm x
25mm, the SOM is where all the processing occurs. It is connected to the carrier board via three 100
pin Hirose DF40 connectors which allows essential power rails and signals to be exposed for
supporting other peripherals and interfaces on the platform.
For detailed information about the Open-Q 845 µSOM, see the device specification noted as
reference document R-1.
3.7 Open-Q 845 Carrier Board
The Open-Q 845 Carrier board is a Mini-ITX form factor board with various connectors used for
connecting different peripherals. The table and sections below provide in depth information on the
carrier board properties, user interfaces, connectors, and expansion headers found on the carrier
board. This information is important for users wishing to connect other external hardware devices to
the Open-Q 845 µSOM Development Kit. Users must ensure that before connecting any hardware
device to the development kit, that it is compatible with the Open-Q 845 hardware specifications.
See Figure 1 for position on carrier board.
Table 2. Carrier Board Features
Item
Position
Description
Specification
Usage
Form Factor
Dimensions: 170mm x 170mm
Mini-ITX Form Factor
SOM Interface
33
3 x 100-pin Hirose DF40 connectors
SOM power and signal IO
connection to carrier board.
The Open-Q 845 SOM
connects to the carrier board
through this interface.
Power
1
AC / Barrel charger
12 V DC Power Supply
Power Supply
Power
3
Battery connector for single cell
lithium battery
Input power option
Debug Serial via USB
12
Debug Serial UART console over
USB for development
USB Micro B connector
Development Serial
Connector for debug output
via USB
Buttons
7
General Purpose SW button
SMD Button
Additional button for
general purpose
7
Power Button
SMD Button
Power Button for Suspend /
Resume and Power off
Volume Keys
7
Volume + key
SMD Button
Volume +Key
7
Volume – key
SMD Button
Volume – Key
Sensor Connector
21
24 pin Sensor Expansion Connector
Available via Intrinsyc
optional accessories kit
Digital IO Expansion
Header
23
Exposes general purpose IO for user
development
Audio Headset Jack
8
Audio Headset Jack
Audio Headset
Audio Inputs
Expansion
27
Audio Inputs Header
3 Analog Differential Inputs,
3 PDM Input Interfaces with
phantom power
Microphones
Audio Outputs
Expansion
26
Audio Outputs Header
2 Line outputs, 1 earphone
amplifier output, 1 Soundwire
interface
Amplifiers
Audio I/O
10
Audio I/O headers
3 x I2S, 1x Analog
Differential Input
Various audio I/O functions
Haptic motor header
9
Haptic device driver
LRM and ERA capable
output driver
Haptic motor
Micro SD (on bottom)
22
Micro SD card
4bit Micro SD card support
External Storage

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Item
Position
Description
Specification
Usage
USB Type C
11
USB 3.1 type C connector
For USB debugging and
client / host mode
USB Type A
5
Female Type A Connector
USB 3.1 Host interface
WLAN Antennas
13, 14
2 PCB Antennas
Coax connection to SOM
WiFi module
Coin Cell Holder
30
Coin Cell battery holder provided
for PMIC RTC
LEDs
36
Five LEDs
Three user driven LEDs
LCD Display and
Touch connector
38
100 pin for LCD signals
2x 4-lane MIPI DSI
MIPI Alliance Specification
for DPHY v1.2
For connecting display
accessory
CSI Camera connectors
15, 16, 17,
18
4x camera connectors
MIPI Alliance Specification
for CSI-2 v1.3
For connecting camera
accessories.
Flash driver
19, 20
2 x Flash drivers
Low current flash driver
control
Flash control
Current Sense Header
35
3 pin header
Sense lines connected across
0.005 Ohm resistor
To measure current
consumption of SOM
Mini PCI Express
Connector (on bottom)
24
Mini PCI Express for external
peripheral connectivity
PCI Express Gen3 interface.
Can support half or full size
card
For external mini PCIe card
WWAN SIM Card (on
bottom)
25
WWAN SIM card connector
(optional)
For WWAN mini PCI
express cards
3.7.1 SOM Board to Board Connectors (33)
The Open-Q 845 µSOM connects to the carrier board via three 100 pin Hirose DF40 connectors
which allows essential power rails and signals to be exposed for supporting other peripherals and
interfaces on the platform. For the list of signals exposed by the SOM, see the device specification
(Ref. R-1).
3.7.2 Boot Configuration DIP Switch S2600 (37)
There is a DIP switch S2600 on the top side of the Open-Q 845 carrier board. The 8-bit switch
allows the user to control the system configuration and boot options. The image below shows the
DIP switch assignments.

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Figure 3. DIP switch assignments
See the table below for a description of the DIP switch connections.
Table 3 - Boot Configuration DIP Switch Settings
Function
DIP
Switch
Description
Notes
FORCED_USB_BOOT S2600-1
For factory mode programming. Connected
to CPU GPIO57.
For Intrinsyc use only. Leave open /
OFF.
WATCHDOG _DISABLE S2600-2
Enables WATCHDOG_DISABLE when
DIP switch turned on. Connected to CPU
GPIO101
Unsupported feature. Leave switch open /
OFF.
BOOT_CONFIG[1] S2600-3 CPU boot configuration bit 1. Connected to
CPU GPIO99
For default boot configuration, leave
open / OFF. Other boot configurations
not supported.
BOOT_CONFIG[2] S2600-4 CPU boot configuration bit 2. Connected to
CPU GPIO100
For default boot configuration, leave
open / OFF. Other boot configurations
not supported.
CBL_PWR_N S2600-5 Controls the auto boot of the SOM when
power is applied.
Default configuration is open / OFF. To
enable auto boot of the SOM when power
is applied, set switch closed / ON.
USR_DEBUG 1 S2600-6
User debug switch connected to test point
TP2600.
Default out of the box configuration is
OFF
USR_DEBUG 2 S2600-7
User debug switch connected to test point
TP2601.
Default out of the box configuration is
OFF
USR_DEBUG 3 S2600-8
User debug switch connected to test point
TP2602.
Default out of the box configuration is
OFF
3.7.3 Input Power Selection
The development kit can be powered using either external DC power supply or by using a battery.
The input power source selection is performed by using the connectors and selection switches shown
in the figure and subsections below.

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Figure 4. Input Power Selection Locations
3.7.3.1 Input Power Selection Switch S300 (2)
The S300 switch shown in the figure above is used to select the power source. To select the external
DC power supply as the power source, slide the switch towards the ‘12V’ position. To power up the
kit using the battery, slide the switch towards the ‘BATT’ position. The default position is ‘12V’.
3.7.3.2 Battery ID and Thermistor Configuration DIP Switch S301 (4)
The 2-position DIP switch S301 shown in the figure above configures the battery ID and thermistor
settings. The table below describes the settings for the battery ID / thermistor DIP switch.
Table 4 – Battery ID / Thermistor Configuration DIP Switch Settings
Function
DIP
Switch
Description
Notes
BATTERY THERMISTOR S301-1 Selects whether or not a 10K ohm thermistor is attached to the battery
connector J300.
For DC powered dev kit, set switch to
closed / ON (default). This enables the
use of the ‘fake’ 10K thermistor on the
carrier board.
For battery powered dev kit, set switch to
open / OFF if thermistor is included on
the battery pack. Otherwise keep switch
closed / ON.

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Function
DIP
Switch
Description
Notes
BATTERY ID S301-2 Informs the 845 µSOM whether a valid battery is connected. The setting is used as
input to enable or disable battery charging.
For DC power dev kit, set switch to
closed / ON (default) to disable battery
charging.
For battery power dev kit, set switch to
open / OFF to enable battery charging.
3.7.3.3 DC Power Input Jack J400 (1)
For a DC powered Open-Q 845 µSOM Development Kit, the DC power input jack J400 (see location
in figure above) is used to connect to the include +12V DC power supply. The 845 carrier board
includes circuitry to convert the +12V input into different voltage rails that are needed by 845 µSOM
and carrier board peripherals.
3.7.3.4 Battery Connector J300 (3)
For a battery powered Open-Q 845 µSOM Development Kit, the battery connector J300 (see location
in figure above) is used for connection to the battery. The table below describes the pinout of the
battery connector. For more information on powering the development kit from a battery, including
selecting a battery pack, see reference document R-6.
Table 5. Battery Connector J300 Pinout
Pin No
Signal
Description
1
GND
System ground, Battery Negative Wire
2
GND
System ground, Battery Negative Wire
3
BATT_THERM_CONN
10K Thermistor
4
BATT_ID_CONN
ID Resistor (optional)
5
VBATT_CONN
Battery Positive Wire
6
VBATT_CONN
Battery Positive Wire
3.7.4 SOM Current Sense Header J301 (35)
The SOM Current Sense header, J301, can be used to monitor the SOM’s current consumption on the
main SOM_SYS_PWR power rail. A close up of the J301 (PWR PROBE) location is shown below.

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Figure 5. SOM Current Sense Header J301 (5)
The table below summarizes the pin outs of header J301
Table 6 - Power Header J301 Pinout
Pin No
Signal
Description
1
SOM_PWR_SENSE_P
SOM power positive current sense line
2
SOM_PWR_SENSE_N
SOM power negative current sense line
3
GND
System Ground
To obtain power consumption measurements, the header is connected to a data acquisition unit
(Keithley 2701 or similar) and the voltages on the SOM_PWR_SENSE_P/N pins are captured a few
times a second over the test period (typically 30 minutes). The SOM power consumption is then
calculated as (where Rsense = 5 milliohms):
=∗
(−)

Use averaging to reduce noise.
3.7.5 Coin Cell Battery Holder B300 (30)
The coin cell holder allows the user to use a coin cell for supplying power to the SOM VCOIN
power input. It is recommended that the Panasonic ML621 series rechargeable coin cell be used (not
supplied with the development kit). See item 30 in Figure 1 for the coin cell battery holder location
on the 845 carrier board.

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3.7.6 Power Header J700 (36)
The Power Header J700 provides access to various carrier board voltage rails. The pinout of the
connector is listed in table below. See item 36 in Figure 1 for the power header location on the 845
carrier board.
Table 7. Power Header J700 (36)
Pin
No
Signal Description
Pin
No
Signal Description
1 MB_ELDO_CAM0_DVDD_1P1
+1.1V Carrier
Board LDO for
Camera 1 DVDD,
Camera core
2 MB_ELDO_CAM0_VCM_2P8
5
+2.85V Carrier
Board LDO for
Camera 1 VCM
3 MB_ELDO_CAM3_DVDD_1P1
+1.1V Carrier
Board LDO for
Camera 4 DVDD,
Camera core
4 GND System Ground
5 MB_VREG_1P8
+1.8V Carrier
Board Buck Power
Supply for general
+1.8V rail
6 MB_ELDO_CAM3_VCM_2P8
5
+2.85V Carrier
Board LDO for
Camera 4 VCM
7 MB_ELDO_CAM1_DVDD_1P1
+1.1V Carrier
Board LDO for
Camera 2 DVDD,
Camera core
8 MB_ELDO_CAM1_VCM_2P8
5
+2.8V Carrier
Board LDO for
Camera 2 VCM
9 MB_ELDO_CAM0_AVDD_2P8
5
+2.85V Carrier
Board LDO for
Camera 1 AVDD
10 GND System Ground
11 MB_VREG_1P8
+1.8V Carrier
Board Buck Power
Supply for general
+1.8V rail
12 MB_VREG_3P3
+3.3V Carrier
Board buck-boost
power supply for
general +3.3V rail
13 MB_ELDO_CAM2_DVDD_1P1
+1.1V Carrier
Board LDO for
Camera 3 DVDD,
Camera core
14 MB_ELDO_CAM2_VCM_2P8
5
+2.8V Carrier
Board LDO for
Camera 3 VCM
15 MB_ELDO_CAM1_AVDD_2P8
5
+2.85V Carrier
Board LDO for
Camera 2 AVDD
16 GND System Ground
17 MB_VREG_1P8
+1.8V Carrier
Board Buck Power
Supply for general
+1.8V rail
18 MB_VREG_3P3
+3.3V Carrier
Board buck-boost
power supply for
general +3.3V rail
19 MB_VREG_5P0
+5.0V Carrier
Board Boost Power
Supply for general
+5.0V rail.
20 DC_IN_12V Main +12.0V Power
from DC power jack
3.7.7 User Buttons and LEDs (7, 36)
There are four user buttons and four LED’s on the Open-Q 845 µSOM Development Kit as
described in the tables below. See items 7 and 36 in Figure 1 for the carrier board locations of the
user buttons and LEDs, respectively.