Intrinsyc LANTRONIX Open-Q 820 User manual

Open-Q™ 820 Development Kit based on the
Snapdragon™ 820 (APQ8096) Processor
User Guide
[Document: ITC-01IMP1200-UG-001 Version: 2.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q 820 Development Kit Based
on Snapdragon 820 Series (APQ8096) Processor and Software License Agreement for the Open-Q 820 Development Kit, which you or the legal entity
you represent, as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation
(“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the Agreement,
solely in support of your permitted use of the Open-Q 820 Development Kit under the Agreement. Distribution of this document is strictly prohibited
without the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay
in its sole discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand
names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to
U.S. and international law is strictly prohibited.

Open-Q™ 820 Development Kit based on the Snapdragon™ 820 (APQ8096) Processor User Guide Version 2.0
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IDENTIFICATION
Document Title Open-Q™ 820 Development Kit based on the Snapdragon™ 820
(APQ8096) Processor User Guide
Document Number ITC-01IMP1200-UG-001
Version 2.0
Date July 20, 2018
History
REVISION DATE DESCRIPTION PAGES
1.0 Dec 14, 2015 Initial Draft All
1.1 Jan 18, 2016 Second draft ready for release All
1.2 Feb 23, 2016 Third draft ready for release All
1.3 Apr 22, 2016 Replaced PMI8994 with PMI8996 All
1.4 June 7, 2016 WLAN PCB antenna information 18, 21,
34, 35
1.5 July 28, 2016 Prepared for public release All
1.6 Aug 2, 2016 Updated display sections 24, 34 -
40
1.7 Nov. 8, 2016 Updated PCI section 3.9.16 42
1.8 Dec 19, 2016 Reformatted document and reorganized headings
Updated automation connector, power header,
display section All
1.9 Feb 1, 2017 Added information on GPS antenna 33-34
2.0 July 20, 2018
Added information on WiFi/BT certification
Updated WiFi / BT Antenna numbering
Updated Table 3.8.21-1
16
16
40

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Table of Contents
1. INTRODUCTION.................................................................................. 5
1.1 Purpose........................................................................................................ 5
1.2 Scope........................................................................................................... 5
1.3 Intended Audience...................................................................................... 5
2. DOCUMENTS ...................................................................................... 6
2.1 Applicable Documents................................................................................ 6
2.2 Reference Documents................................................................................. 6
2.3 Terms and Acronyms.................................................................................. 6
2.4 List of Figures............................................................................................. 8
2.5 List of Tables.............................................................................................. 8
3. Open-Q™ 820 DEVELOPMENT KIT................................................... 9
3.1 Introduction................................................................................................. 9
3.2 Development Platform Notice.................................................................... 9
3.3 Anti-Static Handling Procedures ................................................................ 9
3.4 Kit Contents................................................................................................ 9
3.5 Hardware Identification Label.................................................................. 10
3.6 System Block Diagram............................................................................. 12
3.7 Open-Q 820 SOM..................................................................................... 12
3.7.1 SOM Mechanical Properties....................................................................................13
3.7.2 SOM Block Diagram ...............................................................................................13
3.7.3 Hardware Specification............................................................................................14
3.7.4 SOM RF Specification for WIFI, BT, GPS.............................................................16
3.8 Open-Q™ Carrier Board .......................................................................... 17
3.8.1 Dip switch S10 Configuration Options....................................................................17
3.8.2 Open-Q™ 820 Carrier Board Expansion Connectors..............................................18
3.8.3 Open-Q Power Specification ...................................................................................20
3.8.4 Power Probe Header J86..........................................................................................21
3.8.5 Debug Serial UART header J61 ..............................................................................21
3.8.6 Debug Serial UART over USB J22 .........................................................................22
3.8.7 JTAG header J51 .....................................................................................................22
3.8.8 Sensor IO Expansion Header J53.............................................................................23
3.8.9 NFC Expansion Header J52 (EXP1)........................................................................25
3.8.10 Education / GPIO header J54 (EXP2)......................................................................27
3.8.11 ANC Headset Jack J27 ............................................................................................28
3.8.12 Audio Inputs Expansion Header J50........................................................................29
3.8.13 Audio Outputs Expansion Header J26.....................................................................30
3.8.14 On Board PCB WLAN Antennas ............................................................................31
3.8.15 External and on Board PCB GPS Antenna..............................................................31
3.8.16 Open-Q Display.......................................................................................................32
3.8.17 HDMI Connector J25...............................................................................................32
3.8.18 Display Connector J2...............................................................................................33
3.8.19 PCI Express 1X Slot J30..........................................................................................37
3.8.20 Mini PCI Express Connector J72.............................................................................37
3.8.21 Camera connectors...................................................................................................39
3.8.22 Power Header via 20 Pin Connector J60 .................................................................42

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3.8.23 Automation Connector Header J59..........................................................................43
3.8.24 Ethernet AVB Expansion Header J73......................................................................44
3.8.25 VIP Expansion Header J71......................................................................................44

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™ 820
Development Kit based on the Snapdragon™ 820 (APQ8096) Processor
For more background information on this development kit, visit:
https://www.intrinsyc.com/snapdragon-embedded-development-kits/snapdragon-820-development-kit/
1.2 Scope
This document will cover the following items on the Open-Q 820:
•Block Diagram and Overview
•Hardware Features
•Configuration
•SOM
•Carrier Board
•Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the Intrinsyc
Open-Q 820 Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 820 development kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-QDevelopment
Kit
2.2 Reference Documents
REFERENCE
TITLE
R-1
Hardware Document Set for the Snapdragon APQ8096 based Open-Q
Development Kit
R-2
Open-Q 820 Schematics (SOM, Carrier)
R-3
Open-Q 820 Dev Kit SOM Tech Note 13
R-4
ITCNFA324 Module Certification OEM Integrator Instructions
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral
(Serial interfaces like UART / SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only
memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency

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SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SOM
System On Module
SPMI
System Power Management Interface
(Qualcomm PMIC / baseband proprietary
protocol)
SSBI
Single wire serial bus interface (Qualcomm
proprietary mostly PMIC / Companion chip
and baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

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2.4 List of Figures
Figure 1 Assembled Open-Q 820 Development Kit............................................................................10
Figure 2 Open-Q 820 Block Diagram..................................................................................................12
Figure 3 Open-Q 820 SOM.................................................................................................................13
Figure 4 SOM Block Diagram.............................................................................................................14
Figure 5 J21 12V DC Power Jack........................................................................................................20
Figure 6 J86 Power Probe Header........................................................................................................21
Figure 7 J61 3.3V TTL Debug UART.................................................................................................21
Figure 8 J22 Debug UART over USB .................................................................................................22
Figure 9 J51 JTAG header ...................................................................................................................22
Figure 10 J53 Sensor Expansion Header .............................................................................................23
Figure 11 J55 Gen-10 Sensor Connector (Samtec QSH-030 series) ...................................................25
Figure 12 J52 NFC Expansion Header (EXP1) ...................................................................................25
Figure 13 J54 Education / GPIO header ..............................................................................................27
Figure 14 ANC Headphone Jack..........................................................................................................28
Figure 15 J50 Audio Inputs Expansion Header ...................................................................................29
Figure 16 J26 Audio Outputs Expansion Header.................................................................................30
Figure 17 On Board PCB Antennas.....................................................................................................31
Figure 18 Display Board Block Diagram ............................................................................................35
Figure 19 Display Board Default Configuration..................................................................................36
Figure 20 J30 PCIe Connector.............................................................................................................37
Figure 21 J72 Mini PCIe Connector ....................................................................................................38
Figure 22 J72 Mounting holes for Mini PCIe Connector ....................................................................39
Figure 23 Camera Connectors (J5,J4,J3) .............................................................................................40
Figure 24 J60 Power Connector...........................................................................................................42
Figure 25 J59 Automation connector header.......................................................................................43
2.5 List of Tables
Table 3.7-1 Open-Q Hardware Features..............................................................................................15
Table 3.8-1 Dip Switch HW / SW configuration.................................................................................17
Table 3.8-2 Carrier Board Expansion options and their usage ............................................................18
Table 3.8-3 Power Header J86 Pin-out................................................................................................21
Table 3.8-4 Debug UART Header J61 Pin-out....................................................................................21
Table 3.8-5 JTAG Header J51 Pin out.................................................................................................23
Table 3.8-6 Sensor Expansion Header J53 Pin out..............................................................................23
Table 3.8-7 NFC Expansion Header J52 pin out .................................................................................26
Table 3.8-8 Education Connector Expansion Header J54 Pin out.......................................................27
Table 3.8-9 Audio Inputs Expansion Header J50 Pin out....................................................................29
Table 3.8-10 Audio Outputs Expansion Header J26 Pin out...............................................................30
Table 3.8.20-1. MIPI CSI Camera Connector Pinouts (J5,J4,J3)........................................................40
Table 3.8.20-2. MIPI CSI Camera Use Cases......................................................................................41
Table 3.8.21-1. Power Header J60 Pin-out..........................................................................................42
Table 3.8.22-1. General System J59 Pin Out.......................................................................................43

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3. OPEN-Q™ 820 DEVELOPMENT KIT
3.1 Introduction
The Open-Q 820 provides a quick reference or evaluation platform for Qualcomm’s latest 820 series
- Snapdragon 820 processor. This kit is suited for Android / Linux application developers, OEMs,
consumer manufacturers, hardware component vendors, video surveillance, robotics, camera
vendors, and flash chip vendors to evaluate, optimize, test and deploy applications that can utilize the
Qualcomm Snapdragon 820 series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering
development, engineering evaluation, or demonstration purposes only and is meant for use in a
controlled environment. This device is not being placed on the market, leased or sold for use in a
residential environment or for use by the general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available
consumer device including those requirements specified in the European Union directives applicable
for Radio devices being placed on the market, FCC equipment authorization rules or other
regulations pertaining to consumer devices being placed on the market for use by the general public.
This development platform may only be used in a controlled user environment where operators have
obtained the necessary regulatory approvals for experimentation using a radio device and have
appropriate technical training. The device may not be used by members of the general population or
other individuals that have not been instructed on methods for conducting controlled experiments
and taking necessary precautions for preventing harmful interference and minimizing RF exposure
risks. Additional RF exposure information can be found on the FCC website at
http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 820 Development Kit has exposed electronics and chipsets. Proper anti-static
precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap
3.4 Kit Contents
The Open-Q 820 Development Kit includes the following:
oOpen-Q™ 820 SOM with the Snapdragon 820 (APQ8096) processor or main CPU
board
oMini-ITX form-factor carrier board
o4.5” FWVGA (480x854) 16.7 M LCD (Additional Accessory)
oAC power adapter and HDMI cable

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Figure 1 Assembled Open-Q 820 Development Kit
The development kit comes with Android 6.0 (Marshmallow) software pre-programmed on the CPU
board (SOM). Please contact Intrinsyc for availability of camera modules, sensor boards, and other
accessories: [e-mail]
3.5 Hardware Identification Label
Labels are present on the CPU board and the mini-ITX form-factor carrier board. The following
information is conveyed on these two boards:
CPU board:
•Serial Number
•WIFI MAC address [optional]

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Refer to http://support.intrinsyc.com/account/serialnumber for more details about locating the
serial number, as this will be needed to register the development kit. To register a development
kit, please visit: http://support.intrinsyc.com/account/register
Mini-ITX form-factor carrier board:
•Serial Number
Note: Please retain the SOM and carrier board serial number for warranty purposes.

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3.6 System Block Diagram
The Open-Q 820 development platform consists of three major components
•Open-Q 820 SOM
•Carrier board for I/O and connecting with external peripherals
•Display Adapter Board (additional accessory)
The following diagram explains the interconnectivity and peripherals on the development kit.
5`
APQ8096
LPDDR4
3GB
(PoP)
PMi8996
PM8996
eMMC 5.1
16 to 64GB
4-bit SDIO
4L DSI
SPI/I2C
USB HS
USB SS HDMI
QCA6174
WiFi/BT
GPS
WGR7640
WCD9335
Codec
SOM
Carrier Board
SLIMBUS
IQ + SSBI
Display & Touch
Connector
4L DSI
CSI 0
CSI 1
CSI 2
Audio
Exp. Connectors
3 x DMICs
3 x AMICs
1 x HPH
Headset
conn.
(ANC)
DC
Jack
GPS
Antenna
SMA
(optional)
USB HS USB2
LEDs
RGB
BPLSs / MPPs / GPIOs
Sensor
Connector
SSCs / GPIOs / IRQs
3 x AMICs
4 x Line-out
DSI 0
DSI 1
/3
Controls
USB1
SLOT
I2S
I2C EXP2 (NFC)
Connector
UIM
PCIe0
GPIO’s
CCI0/1
MIC BIAS
UFS
32 to 64GB
UFS
2 lanes
UFS
EXP1 (EDU)
Connector
BT/WiFi
Antennae
(2.5/5GHz)
Display Adapter
coax
coax
coax
PCM
UART
3.8V BUCK
VBAT
SPMI
SDC2
SDC1 8-bit SDIO
Touchscreen
SPI/I2C
HDMI
RST/Vol -
POWER
VOL +
GENERAL
JTAG
UART
Sound wire
PCIe1
Type uAB
USB
HUB
PCIe2
PCIe 2.1
PCIe 2.1
Type uB
(for Debug)
Mini card
I2S
CSI 4L
CSI 4L
CSI 4L
GPIOs/INTs
TTL to
USB
QSPI QSPI
Automation
Conn
BOOT CONFIG
GPIO127
Figure 2 Open-Q 820 Block Diagram
3.7 Open-Q 820 SOM
The SOM provides the basic common set of features with minimal integration efforts for end users.
It contains the following:
•Snapdragon 820 (APQ8096) main application processor
•LPDDR4 up to 1866MHz 3GB RAM (POP)
•PMi8996 + PM8996 – PMIC for Peripheral LDOs, Boost Regulators

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•QCA6174 Atheros Wi-Fi + BT combo chip over PCIe, UART, PCM
•32 GB UFS 2.0.
•WGR7640 RF Front End
•WCD9335 Audio Codec
Figure 3 Open-Q 820 SOM
3.7.1 SOM Mechanical Properties
Area
34.44 cm2(42 mm x 82 mm)
Interface
314-pins MXM Gen-III edge connector & 100-
pins SOM to carrier board connector (B2B
Connector).
Thermal
A top side heat sink is installed by default.
Shielding
A top side shield can for the GPS front end is
installed by default.
3.7.2 SOM Block Diagram
The Open-Q 820 SOM measuring 42mm x 82mm is where all the processing occurs. It is connected
to the carrier via a 314-pin MXM Gen-III edge connector. The purpose of this edge connector is to
bring out essential signals such that other peripherals can interface with the platform.
The SOM requires a board-to-board connector in addition to the MXM Gen III connector. This
connector is responsible for bringing out the audio signals to the carrier board whereas the MXM
connector exposes all other pin features supported by the SOC.
82mm
42mm

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5
`
APQ8096
LPDDR4
3GB
(PoP)
PMi8996
PM8996
eMMC 5.1
16 to 64GB
4-bit SDIO
4L DSI
SPI/I2C
USB HS
USB SS HDMI
QCA6174
WiFi/BT
GPS
WGR7640
WCD9335
Codec
Open-Q™ 820
System on Module
Carrier Board
SLIMBUS
IQ + SSBI
4L DSI
CSI 0
CSI 1
CSI 2
USB HS USB2
BPLSs / MPPs / GPIOs
SSCs / GPIOs / IRQs
DSI 0
DSI 1
Controls
USB1
I2S
I2C
UIM
PCIe0
GPIO’s
CCI0/1
UFS
32 to 64GB
UFS 2 lanes
UFS
PCM
UART
SPMI
SDC2
SDC1 8-bit SDIO
SPI/I2C
HDMI
JTAG
UART
PCIe1
PCIe2
PCIe 2.1
PCIe 2.1
I2S
CSI 4L
CSI 4L
CSI 4L
GPIOs/INTs
QSPI QSPI
BOOT CONFIG
RF
RF
RF
Power Circuit
LEDs
RGBMPP
3 X DMICs
MIC BIAS
6 X AMICs
2 X LINE-OUT
SOUND WIRE
2 X HPH
Carrier Board
Figure 4 SOM Block Diagram
3.7.3 Hardware Specification
The Open-Q™ 820 SOM platform encompasses the following hardware features:

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Table 3.7-1 Open-Q Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
APQ8096
Qualcomm® Snapdragon™ 820
Processor
Qualcomm® Kyro CPU, quad
core, 64-bit ARM V8 compliant
processor, 2.2GHz
PMIC (PM8996 &
PMi8996)
Qualcomm® PMIC, Companion
PMIC for APQ8096 processor
NA
Memory
3GB LPDDR4
Memory POP
Up to 1866MHz LPDDR4 POP
on CPU BGA chip. Supports
via 4x16bit channels
32 GB UFS
Primary Storage for platform.
Mainly used for storing SW
applications and user data etc.
Toshiba UFS on board. Can
support up to 64GB. Can have
the option of using both UFS
and eMMC.
Connectivity
Wi-Fi 2.4 GHz/ 5GHz
via QCA6174 – SDIO
Wi-Fi Atheros QCA6174 Wi-Fi
+ BT Combo Chip
802.11a/b/g/n/ac 2.4/5.0 GHz
via QCA6174 over PCIe0.
Full 2x2 antenna configuration
BT 2.4 GHz via
QCA6174 – UART /
PCM
Wi-Fi Atheros 6174
Wi-Fi + BT Combo Chip
Support BT 4.1 + HS and
backward compatible with BT
1.x, 2.x + EDR
GPS via WGR7640 –
SSBI Qualcomm
Proprietary Protocol
GPS Frontend
GPS/ GLONASS/ COMPASS
RF Interfaces
2xWLAN / BT
Connect to antenna on carrier
board via coax cable
2.4/ 5 GHz
1x GPS
Connect to antenna on carrier
board via coax cable
GPS/ GLONASS/ COMPASS
Audio Interfaces
1 x Headset Output
Headset/ headphone output
Analog differential output
2 x Loud-speaker
2 x loud-speaker output
Digital output
1 x Earpiece output
Earpiece output
Analog differential output
3 x analog MICs
Analog MIC input
Analog differential input
3 x digital MICs
Digital MIC input
Digital input
Interfaces
3 x MIPI CSI
Camera Connectors
CSI0, CSI1, CSI2
MIPI Alliance Specification
v1.0
2 x USB HS & 1 x
USB SS
1 x dual stack type A USB2.0
via USB HUB for front USB
(from USB1 line), 1 x micro AB
USB 3.0 via switch (from USB1
line), 1 x micro B USB 2.0 (from
USB2 line)
USB3.1 & USB2.0
1 x MIPI DSI (DSI0 &
DSI1) + Touch 100-
pin display Connector
100- pin display connector.
Interfaces with Intrinysc Display
Adapter Board
MIPI Alliance Specification
v1.01. MIPI D-PHY
Specification v0.65, v0.81,
v0.90, v1.01
3 X PCIe
PCIe 0 PCIe signal to Wi-Fi
module. PCIe 1, 2 routed out of
SOM
PCI Express Specification, Rev
2.1
Connectors
1 x MXM SOM
connector
Connector for SOM
314 pin edge connector
1 x SOM to Carrier
B2B connector for SOM and
100 pin board to board

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Subsystem /
Connectors
Feature Set
Description
Specification
board to board
connector
carrier board
connector
3.7.4 SOM RF Specification for WIFI, BT, GPS
The SOM includes the following radio interfaces:
oANT1: Wi-Fi antenna 1 + BT
oANT2: Wi-Fi antenna 2
oWGR7640: For GPS RF Front end
Antenna 1: The antenna 1 connector is for one of the two Wi-Fi antennas as well as the single
Bluetooth antenna. Antenna connector ANT1 is connected to the carrier board antenna via a coaxial
cable.
Antenna 2: The antenna 2 connector is for the second Wi-Fi antenna. This antenna connector is also
connected to a carrier board PCB antenna via a coaxial cable.
Note that two dual-band (2.4GHz + 5GHz) antennas are required to be connected to achieve full
performance of the Wi-Fi interface. If only Bluetooth is being used, then only a single 2.4GHz
antenna connected to ANT1 is necessary.
The SOM WiFi/BT module has received regulatory certifications (see FCC ID: 2AFDI-ITCNFA324
for details). Please note that the on board PCB antennas were not the antennas used for the SOM
WiFi/BT module certification. Refer to the certification documents for the WiFi/ BT module (see R-
4) for information regarding the test configurations used for certification. Deviating from the
documented configuration may trigger the need for re-certification.
For details on connecting the WiFi module to the on board PCB antennas on the carrier board, refer
to section 3.8.14 below.
WGR7640: GPS Front End WGR7640 is the primary GPS radio interface used on the Open-Q 820
development kit. This provides the RF capabilities for GNSS functions.
The following are the operating frequencies for WGR7640
GPS: 1574.42 MHz – 1576.42 MHz
GLONASS: 1598 MHz to 1606 MHz
For more information about connecting a GPS antenna to the development kit see section 3.8.15
below.

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3.8 Open-Q™ Carrier Board
The Open-Q 820 Carrier board is a Mini-ITX form factor board with various connectors used for
connecting different peripherals. The following are the mechanical properties of the carrier board:
Dimensions
289 cm2(170mm x 170mm)
Form Factor
Mini-ITX
Major Interfaces
SOM: 314 pin FOXCONN connector
SOM: 100 pin board to board connector
Display: 100 pin carrier board connector
Thermal
Thermal pad is placed between the SOM and
carrier board
3.8.1 Dip switch S10 Configuration Options
There is a DIP switch S10 on the top side of the Open-Q™ 820 carrier board. The 8-bit switch
allows the user to control the system configuration and boot options. Table 3.8-1 below outlines the
pin outs and connections of these DIP switches.
Table 3.8-1 Dip Switch HW / SW configuration
Function
DIP
Switch
Description
Notes
FORCED_USB_BOOT
S10-1
Toggles between FORCE USB boot and EDL
mode. Enables FOCE USB (GPIO 57) when DIP
switch turned on
Default out of the box configuration is OFF
which is the EDL mode
Note: FORCE USB boot option not supported
by Intrinsyc
JTAG_PS_HOLD
S10-2
Enables the JTAG_PS_HOLD mode when DIP
switch turned on
Default out of the box configuration is OFF
Note: Intrinsyc does not provide software
support for JTAG
BOOT_CONFIG[3]
S10-3
Enables APQ boot configuration 3 when DIP
switch turned on. Controlled by APQ GPIO104
See schematic for boot configuration options.
NOTE: Some boot configurations are not supported
on the development kit.
Default out of the box configuration is ON
BOOT_CONFIG[2]
S10-4
Enables APQ boot configuration 2 when DIP
switch turned on. Controlled by APQ-GPIO103
Default out of the box configuration is OFF
BOOT_CONFIG[1]
S10-5
Enables APQ boot configuration 1 when DIP
switch turned on. Controlled by APQ-GPIO 102
Default out of the box configuration is OFF
WATCHDOG _DISABLE
S10-6
Enables WATCHDOG_DISABLE when DIP
switch turned on. Controlled by APQ-GPIO 101
Default out of the box configuration is OFF
N/C
S10-7
NA
NA
GPS_ANT_SEL
S10-8
Option to select which antenna to use for GPS.
When DIP switch ON GPS external antenna is
being used (SMA connector). When switch OFF,
GPS printed antenna is being used (on-board)
Default out of the box configuration is OFF
Warning! : Before making any changes to the dip switch, make sure to note down the previous
configuration. The default switch settings are below.

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3.8.2 Open-Q™ 820 Carrier Board Expansion Connectors
Table 3.8-2 lists the connectors, expansions and their usages on the carrier board:
Table 3.8-2 Carrier Board Expansion options and their usage
Domain
Description
Specification
Usage
Power
AC / Barrel charger
12 V DC Power Supply
5 A
Power Supply
Power connector
20 pin header
For providing extra current to
camera connectors when needed
(ie: when high performance
cameras used)
Debug Serial via USB
Debug Serial UART console over
USB for development
Vertical USB Micro B connector
Development Serial Connector
for debug output via USB
JTAG
OS / Firmware /QFROM
Programming / Debugging JTAG
Standard 20-pin connector,
ARM and OpenDSP – Lauterbach
QFROM / eMMC / Platform
EEPROM programming
ARM / Open DSP debugging
Note : JTAG is not supported
Buttons
General Purpose SW button
SMD Button
Additional button for general
purpose
Power Button
SMD Button
Power Button for Suspend /
Resume and Power off
Volume Keys
Volume + key
SMD Button
Volume +Key
Volume – key
SMD Button
Volume – Key
Sensor IO Connector (DNP)
24 pin Sensor Expansion Connectors
Supports Gen-9 sensor connector as
stuff option
Support any user sensor card,
Standard 44-pin ST Micro PLCC
support via optional daughter card
Available via Intrinsyc optional
accessories kit
NFC Board Header (EXP1)
20 pin NFC expansion connectors
NA
NA
GPIO / Education connector
Header
16-pin general purpose IO for SPI /
I2C / GPIOs/ UIM/ UART functions
and other unused GPIOs from PMIC
and APQ education header.
Full BLSP1 (SPI/ UART/ I2C/ GPIO)
APQ GPIOs
PMIC GPIOs
MPPs
GPLED sink
Power
Proprietary 16-pin header
Useful when user wants to use
UART GPIOs pins as BLSP
other functions (GPIO/ I2C/
UIM/ SPI).
Micro SD (on bottom)
Micro SD card
4bit Micro SD card support
External Storage
ANC Audio Jack
Audio Jack
Supported using WCD9335
ANC audio jack providing 2lineout
and 1 headset drivers (shared with
ANC)
Audio support
3-Digital Microphone via audio
input expansion header
Audio expansion
Supported using WCD9335
Digital Audio header
For Digital audio input for
Digital MIC, I2S codec, Slim bus
interface.
3-Analog Microphone via audio
input expansion header
Audio expansion
Supported using WCD9335
Analog Audio header
For Analog audio input for
Analog MIC (differential signal)
2-Loud Speaker via audio output
expansion header
Audio expansion
Supported using WCD9335
Analog Audio header
For loud speaker output after
signal has been processed
Earpiece via audio output
expansion header
Audio expansion
Supported using WCD9335
Analog Audio header
For earpiece output after signal
has been processed
HDMI Port
Extended Display ports
HDMI port supports up to 4K without
HDCP 1.4A spec
External Display
USB OTG
USB 2.0 OTG
Micro B connector
USB debugging and client / host
mode
USB 3.0
USB 3.0
Micro AB header
Transfer data to and from CPU
WLAN Antenna
2X PCB Antenna
2.4 – 5.1 GHz
Antenna to SOM WiFi module
GPS Antenna
PCB Antenna
GPS :
1574.42 MHz – 1576.42 MHz
GLONASS :
1587 MHz – 1606 MHz
Antenna to SOM GPS module
Coin Cell Holder(Optional)
Coin Cell battery(Optional via
stuffing)
Coin cell battery for PMIC RTC
RTC

Open-Q™ 820 Development Kit based on the Snapdragon™ 820 (APQ8096) Processor User Guide Version 2.0
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Copyright Intrinsyc Technologies Corporation
Domain
Description
Specification
Usage
LED
3xLED
Red : PMIC Driven
Green: PMIC Driven
Blue: PMIC Driven
Blue : General purpose
Red : General purpose
Green : General purpose
LCD Display and Touch
connector
100 pin for LCD signals from b2b
boards for display
4-lane MIPI DSI0 , DSI1
I2C/SPI/GPIO
Backlight
MIPI Alliance Specification v1.01
MIPI D-PHY Specification
v0.65,v0.81, v0.90, v1.01
Can work as one dual DSI or
both independent display
Sensor header
24 pin sensor header
24 pin sensor header
Header to connect sensor board.
Please contact Intrinsyc for
availabilities of this board
Automation connector
Automation connector for
continuous integration systems
20 pin header
For automating tests on the board
by controlling the board to power
on and off as well as SW
download
Gen10 connector
Connector for Qualcomm’s internal
sensor boards
60 pin connector sensor Gen 10
To interface with Qualcomm’s
internal sensor boards (for
Intrinsyc internal use only –
not supported)
VIP Extension connector
Connector for interfacing with
Qualcomm legacy automotive VIP
boards
60-pin connector
To connect to Qualcomm legacy
automotive VIP boards (for
Intrinsyc internal use only –
not supported)
Ethernet AVB connector
Connector for interfacing with
Ethernet AVB standard
60-pin connector
To connect to automotive
peripherals via Ethernet AVB
standard (for Intrinsyc internal
use only – not supported)
PCI Express Slot
PCI Express for external peripheral
connectivity
PCIe1 v2.1
Supports half card only
Supports 10W card via power supply
Supports 25W card via ATX power
supply
To connect an Ethernet PCIe card
board to support Ethernet.
Mini PCI Express Connector
Mini PCI Express for external
peripheral connectivity
PCIe1 v2.1
Can support half or full size card
For external mini PCIe card
WWAN SIM Card (on bottom)
WWAN SIM card connector
(optional)
4bit Mini SIM card support
For WWAN mini PCI express
cards
CSI Camera connectors
3 x CSI port connector with CLK,
GPIOS, CCI
Supports 3 x Camera interfaces via
three separate connectors
•3 x MIPI-CSI each 4 lane
•External flash driver
control
•Support for 3D camera
configuration
•Separate I2C / CCI control
MIPI Alliance Specification v1.00 for
Camera Serial Interface
For connecting camera
accessories.
Power Probe Header
3 pin power probe header
Sense lines connected across 0.005
Ohm resistor
To measure current consumption
of µSOM
The following sections will provide in depth information on each expansion headers and connectors
on the carrier board. The information listed below is of particular use for those who want to interface
other external hardware devices with the Open-Q™ 820. Before connecting anything to the
development kit, please ensure the device meets the specific hardware requirements of the processor.

Open-Q™ 820 Development Kit based on the Snapdragon™ 820 (APQ8096) Processor User Guide Version 2.0
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Copyright Intrinsyc Technologies Corporation
3.8.3 Open-Q Power Specification
The Open-Q™ development kit power source connects to the 12V DC power supply jack J21.
Starting from the power jack, the 12V power supply branches off into different voltage rails via step
down converters on the carrier board and PMIC on the SOM. The SOM is powered by 3.8V via
Richtek step down converter U2 on the carrier board. To ensure the SOM is getting powered
correctly, user can monitor the current going into the SOM via the power probe header J86 (see
section below).
Figure 5 J21 12V DC Power Jack
The SOM consists of 2 PMIC modules. Functionalities of the 2 modules are outlined below.
PMI8996 PMIC is used for:
•Source various regulated power rails
•Support for battery charging on the PMI8996 is not implemented on the platform. The carrier
board uses a 3.8V constant power input to the SOM.
•Support for battery charging over external charger is not implemented in the design. Please
contact Intrinsyc for such customization.
PM8996 PMIC is used for:
•Source various regulated power rails
•Source system clock