Intrinsyc Open-Q 626 mSOM User manual

Open-Q™ 626 µSOM Development Kit
Quick Start Guide
Your use of this document is subject to and governed by those terms and conditions (https://www.intrinsyc.com/legal-terms/qualcomm-terms.html) in the Intrinsyc Purchase and Software License Agreement for the Open-Q™ 626 µSOM Development Kit based on the Qualcomm® Snapdrag-
on™ 626 Processor (APQ8053), which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q™ 626 µSOM Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered
part of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use of the Open-Q™ 626 µSOM Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Tech-
nologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated,
registered in the United States and other countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.
Package Contents
1. WLAN PCB Antenna
2. Audio output expansion header
3. Volume + buon
4. General Purpose buon
5. Audio input expansion header
6. 12V DC input jack
7. Power source switch
8. Baery connector
9. Baery charge cong switch
10. HDMI video output
11. 3.5 mm headset jack
12. Power header
13. USB Type-C connector
14. Debug UART (USB MicroB)
15. GPS ext. ant. SMA connector
16. GPS PCB Antenna (on boom)
17. MIPI camera 2 connector
18. Micro SD slot (on boom)
19. MIPI camera 1 connector
20. MIPI camera 0 connector
21. Sensor board header
22. Conguraon DIP switches
23. 3 x LEDs
24. SOM power measurement
header
25. GPIO expansion header
26. Volume - buon
27. Power buon
28. MIPI DSI LCD/touchscreen
connector to interface with
Intrinsyc display adapter
29. 16GB eMMC ash memory
30. APQ8053 CPU
31. 2GB LPDDR3 RAM memory
32. GPS antenna connector U.FL
33. WLAN antenna connector U.FL
34. Open-Q 626 µSOM (micro Sys-
tem on Module)
1. Open-Q™ 626 µSOM with APQ8053 processor
2. Open-Q™ 626 Carrier board
3. STEVAL_MKI128V6 sensor accessory board
4. AC Power Adapter
5. HDMI Video Cable
6. 4.5” FWVGA MIPI DSI LCD/touchscreen (oponal accessory)
134
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8
11
13
15
1719
21
25
9
12
25
6
16
14
20
28
29 31
33 32
30
27
22
10
23
34
26
24
18

Open-Q™ 626 µSOM Development Kit
Quick Start Guide
Development Kit Support
For more information or assistance, you can contact us at:
https://www.intrinsyc.com/contact-support
Intrinsyc also provides technical information and videos on Snapdragon
processors at:
http://www.intrinsyc.com/resources
Should you require additional technical support for your Development Kit you can
purchase a block of technical support hours from the Intrinsyc store:
https://www.intrinsyc.com/support
Thank you for purchasing the Open-Q 626 Development Kit
The Intrinsyc Team
Development Kit Setup
1. At a static-safe workstation, remove the development kit board
carefully from the anti static bag
2. If you do not have the optional LCD then connect the HDMI cable from
the development kit (#10) to an HDMI display.
3. Connect the Power Adapter to the 12V DC Jack (#6), then press and
hold the power button (#27) for approximately 3 seconds. If using the
LCD you will see the boot menu appear first, followed by the Intrinsyc
logo as the board boots up. If using HDMI the screen will remain blank
for approximately 45 seconds before the Android screen appears.
4. Documentation and software
To access the documentation (schematics, user guides, programming guides,
tech notes…), platform BSP software and much more, please register at:
http://tech.intrinsyc.com
Specicaons are subject to change - Open-Q 626 DK QSG rev 1.3