Intrinsyc Open-X 8M User manual

Open-X™ 8M Development Kit based on the NXP
i.MX8™ Processor
User Guide
[Document: ITC-01RND1319-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-X™ 8M Development Kit based
on the NXP Semiconductors i.MX 8M™ Processor and Software License Agreement for the Open-X 8M Development Kit, which you or the legal entity
you represent, as the case may be, accepted and agreed to when purchasing an Open-X Development Kit from Intrinsyc Technologies Corporation
(“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the Agreement, solely
in support of your permitted use of the Open-X 8M Development Kit under the Agreement. Distribution of this document is strictly prohibited without
the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole
discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
NXP Semiconductors N.V. and i.MX 8M are trademarks of NXP Semiconductors N.V., registered in the Netherlands and other countries. Other product
and brand names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to
U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-X™ 8M Development Kit based on the NXP i.MX8™ Processor
User Guide
Document Number ITC-01RND1319-UG-001
Version 1.0
Date May 3, 2018
History
REVISION DATE DESCRIPTION PAGES
1.0 May 3, 2018 Initial release All

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Table of Contents
1. INTRODUCTION.................................................................................. 4
1.1 Purpose........................................................................................................ 4
1.2 Scope........................................................................................................... 4
1.3 Intended Audience...................................................................................... 4
2. DOCUMENTS ...................................................................................... 5
2.1 Applicable Documents................................................................................ 5
2.2 Reference Documents................................................................................. 5
2.3 Terms and Acronyms.................................................................................. 5
2.4 List of Figures............................................................................................. 6
2.5 List of Tables.............................................................................................. 6
3. Open-X 8M DEVELOPMENT KIT........................................................ 7
3.1 Introduction................................................................................................. 7
3.2 Development Platform Notice.................................................................... 7
3.3 Anti-Static Handling Procedures ................................................................ 7
3.4 Kit Contents................................................................................................ 8
3.5 Hardware Identification Label.................................................................... 9
3.6 System Block Diagram............................................................................. 10
3.7 Open-X 8M SOM ..................................................................................... 11
SOM Mechanical Properties....................................................................................11
SOM Block Diagram ...............................................................................................12
Hardware Specification............................................................................................13
SOM RF Specification for WIFI, BT.......................................................................14
3.8 Open-X 8M Carrier Board........................................................................ 15
Boot dip switch Configuration Options...................................................................15
Open-X 8M Carrier Board Expansion Connectors..................................................16
Open-X 8M Power Specification.............................................................................18
Power Probe Header J600........................................................................................19
Debug Serial UART over USB J800 .......................................................................20
JTAG Header J801...................................................................................................21
MicroSD Card Socket J900 .....................................................................................22
Buttons and LEDs....................................................................................................23
USB Type-C J1300 and Type-A J1301 ...................................................................24
Audio Stereo Line-out Jack J1200...........................................................................25
Digital Audio Expansion Headers............................................................................26
On Board PCB WLAN Antenna..............................................................................30
Open-X Display Interfaces ......................................................................................31
Ethernet Connector J1400........................................................................................34
M.2 Key E PCI Express Slot J1100.........................................................................35
Camera connectors...................................................................................................36
3-Pin 5V DC Fan Connector....................................................................................38

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-X™ 8M
Development Kit based on the NXP i.MX8™ Processor
For more background information on this development kit, visit: https://www.intrinsyc.com/imx-
embedded-development-kits/open-x-8m-development-kit/
1.2 Scope
This document will cover the following items on the Open-X 8M:
•Block Diagram and Overview
•Hardware Features
•Configuration
•SOM
•Carrier Board
•Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for hardware or software developers who would like to design custom
applications based on the Intrinsyc Open-X 8M Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-X 8M development kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-XDevelopment
Kit
2.2 Reference Documents
REFERENCE
TITLE
R-1
Open-X 8M Schematics (SOM, Carrier)
2.3 Terms and Acronyms
Term and acronyms
Definition
B2B
Board to Board
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only
memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
HDMI
High Definition Media Interface
JTAG
Joint Test Action Group
MIPI
Mobile Industry processor interface
RF
Radio Frequency
SOM
System On Module
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed
PCIe
Peripheral Component Interconnect Express
NGFF
Next Generation Form Factor
I2C
Inter-Integrated Circuit

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2.4 List of Figures
Figure 3-1 Assembled Open-X 8M Development Kit...........................................................................8
Figure 3-2 Open-X 8M Block Diagram...............................................................................................10
Figure 3-3 Open-X 8M SOM...............................................................................................................11
Figure 3-4 SOM Block Diagram..........................................................................................................12
Figure 3-5 Boot Switches S700 and S701 ...........................................................................................15
Figure 3-6 12V DC Power Jack J300...................................................................................................18
Figure 3-7 - USB Type-C J1300..........................................................................................................18
Figure 3-8 Power Probe Header J600 ..................................................................................................19
Figure 3-9 Debug UART over USB J800............................................................................................20
Figure 3-10 UART Configuration........................................................................................................20
Figure 3-11 JTAG Header J801...........................................................................................................21
Figure 3-12 SD Card on Carrier Board J900 .......................................................................................22
Figure 3-13 Buttons and LEDs ............................................................................................................23
Figure 3-14 - USB Type-C J1300........................................................................................................24
Figure 3-15 - USB Type-A J1301........................................................................................................24
Figure 3-16 3.5mm Audio Line-out Jack J1200 ..................................................................................25
Figure 3-17 Audio FPC Header J1800.................................................................................................26
Figure 3-18 Audio Expansion Headers J1801, J1802, J1803 ..............................................................28
Figure 3-19 QCA6174A Module on SOM ..........................................................................................30
Figure 3-20 On Board PCB Antennas..................................................................................................30
Figure 3-21 HDMI connector on Carrier Board J1000........................................................................31
Figure 3-22 MIPI Display Connector on Carrier Board J1700............................................................32
Figure 3-23 Gigabit Ethernet RJ45 Jack J1400 ...................................................................................34
Figure 3-24 PCIe Connector and Mounting Holes J1100....................................................................35
Figure 3-25 USB Select Switch for PCIE............................................................................................35
Figure 3-26 Camera Connectors J600, J1500......................................................................................36
Figure 3-27 3-Pin 5V DC Fan Connector J700....................................................................................38
2.5 List of Tables
Table 3.7.3-1 Open-X 8M SOM Hardware Features...........................................................................13
Table 3.8.2-1 Carrier Board Expansion options and their usage .........................................................16
Table 3.8.4-1 Power Header Pin-out, J600..........................................................................................19
Table 3.8.6-1 JTAG Header Pinout, J801............................................................................................21
Table 3.8.11-1 Audio Inputs Expansion Header Pinout, J1800...........................................................26
Table 3.8.11-2 Audio Outputs Expansion Headers Pinout, J1801, J1802, J1803................................29
Table 3.8.16-1. MIPI CSI Camera Connector Pinouts (J1500, J1600)................................................36
Table 3.8.16-2. MIPI CSI Camera Use Cases......................................................................................38
Table 3.8.17-1 3 Pin 5V DC Fan Header Pin-out J700........................................................................38

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3. OPEN-X 8M DEVELOPMENT KIT
3.1 Introduction
The Open-X 8M provides a quick reference or evaluation platform for NXP Semiconductors latest
processor series, the i.MX 8M. This kit is suited for Android or Linux application developers,
multimedia audio or video vendors, voice processing vendors, consumer product manufacturers,
OEMs, hardware component vendors, video surveillance, and camera vendors to evaluate, optimize,
test and deploy applications that can utilize the NXP Semiconductors i.MX8 series technology.
3.2 Development Platform Notice
This development platform contains RF, analog and digital hardware and software intended for
engineering development, engineering evaluation, or demonstration purposes only and is meant for
use in a controlled environment. This device is not being placed on the market, leased or sold for use
in a residential environment or for use by the general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available
consumer device including those requirements specified in the European Union directives applicable
for radio devices being placed on the market, FCC equipment authorization rules or other regulations
pertaining to consumer devices being placed on the market for use by the general public.
This development platform may only be used in a controlled user environment where operators have
obtained the necessary regulatory approvals for experimentation using a radio device and have
appropriate technical training. The device may not be used by members of the general population or
other individuals that have not been instructed on methods for conducting controlled experiments and
taking necessary precautions for preventing harmful interference and minimizing RF exposure risks.
Additional RF exposure information can be found on the FCC website at
http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-X 8M Development Kit has exposed electronics and chipsets. Proper anti-static precautions
should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap

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3.4 Kit Contents
The Open-X 8M Development Kit includes the following:
oOpen-X 8M SOM with the i.MX 8M processor
oOpen-X 8M Development Board (Mini-ITX form-factor)
oHeatsink covering the SOM (not shown below)
oOpen-Q™ LCD/touchpanel (Optional Accessory)
oAC power adapter and HDMI cable
Figure 3-1 Assembled Open-X 8M Development Kit
The development kit comes with Android software pre-programmed on the CPU board (SOM).
Please contact Intrinsyc for availability of camera modules, sensor boards, and other accessories:
[e-mail]

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3.5 Hardware Identification Label
Labels are present on the SOM and the carrier board. The following information is conveyed on
these two boards:
SOM:
•Serial Number
•Wi-Fi MAC address
•Ethernet MAC address
Refer to http://support.intrinsyc.com/account/serialnumber for more details about locating the
serial number, as this will be needed to register the development kit. To register a development kit,
please visit: http://support.intrinsyc.com/account/register
Carrier board:
•Serial Number
Note: Please retain the SOM and carrier board serial number for warranty purposes.

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3.6 System Block Diagram
The Open-X 8M development platform consists of three major components:
•Open-X 8M SOM
•Carrier board for I/O and connecting with external peripherals
•Display Adapter Board (optional accessory)
The following diagram explains the interconnectivity and peripherals on the development kit.
Figure 3-2 Open-X 8M Block Diagram
NXP
iMX8MQ
PMIC
NXP PF4210
3.3V Buck
USB Mux
USB HS
USB HS
USB SS
USB 3.0 Type-C OTG
USB 3.0 Type-A HOST
M.2 NGFF, Key-E
USB HS
PCIe/UART/SDIO/PCM
USB SS
DC Jack
CP2105
USB HS
UART3
UART4
USB 2.0 uB Debug
USB VBUS
Audio Expansion
CSI 4L
CSI 4L
4-bit SDIO
HDMI
WM8524
CODEC
SAI
i.MX 8M SOM
COAX
COAX
3x SAI/NAND/SPDIF/I2C
UART/PCM/PCIe
LPDDR4 (3GB)
MT53B768M32D4NQ
-062 WT:B
eMMC (16GB)
MTFC16GAKAECN-
2M WT
BT/WiFi
Anetnnas
(2.5/5GHz)
8-bit SDIO
JTAG
Display and Touch
Connector
4L DSI/I2C/Controls
Power
User / RST / PWR
User1 / User2 / Power / PWM
Line Level
Audio
Connector
U69H025.22
WiFi/BT
AR8031
Gigabit
Ethernet PHY
i.MX 8M CARRIER
BOARD

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3.7 Open-X 8M SOM
The SOM provides the basic common set of features with minimal integration efforts for end users.
It contains the following:
•i.MX 8M (MiMX8MQ6DVAJZAB) main application processor
•LPDDR4 1600MHz 3GB RAM
•16 GB eMMC Flash storage
•MC34PF4210A1ES – PMIC for Peripheral LDOs, Boost Regulators
•QCA6174A-1 Wi-Fi + BT pre-certified module over PCIe, UART, PCM
Figure 3-3 Open-X 8M SOM
SOM Mechanical Properties
Area
19.25 cm2(55 mm x 35 mm)
Interface
3x 100-pins SOM to carrier board connector (B2B Connector)
Thermal
An optional top side heat sink can be installed
55mm
35mm

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SOM Block Diagram
The Open-X 8M SOM measuring 55mm x 35mm is where all the processing occurs. It is connected to
the carrier via 3 100-pin B2B connectors.
NXP iMX8MQ
Quad ARM Cortex-A53/ M4
Part # MiMX8MQ7DVAJZAB
LPDDR4 (200b)
Micron 768 Meg x32
Part# MT53B768M32D4NQ-062
WT:B
x32DRAM
eMMC 5.0
16GB
Part# MTFC16GAKAECN-2M WT
x8SDIO
PMIC
NXP PMIC PF4210
Part# MC32PF4210A1ES
POWER
WiFi/BT
FOXCONN MODULE
Part# U69H025.22
PCIe/
UART/
PCM
100 pin B2B header x3
Part# DF40C-100DP-0.4V
JTAG
x2 Debug UART (A53/M4)
SD3.0 SDIO
GPIO/ PWM
HDMI 2.0a HDMI
RGMII
USB USB OTG x2
CSI 4L x2 MIPI CSI x2
DSI 4L x1 MIPI DSI x1
SAI1 TX 8 Ch
SAI1 RX 8 Ch
SAI2 2Ch TX/RX
Gen2 1L PCIe
SAI3 2Ch TX/RX
SAI5 4Ch RX
SPDIF TX/RX
CONTROL IOs
Power Input
NAND/ QSPI
Figure 3-4 SOM Block Diagram

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Hardware Specification
The Open-X 8M SOM platform encompasses the following hardware features:
Table 3.7.3-1 Open-X 8M SOM Hardware Features
Subsystem / Connectors
Feature Set
Description
Specification
Chipset
MiMX8MQ6DVAJZAB
NXP’s i.MX 8M family
processor.
Quad ARM Cortex
®
-
A53 and ARM
Cortex®-M4 cores,
1.5GHz
PMIC (PF4210)
NXP PMIC designed for
i.MX 8M Processors
NA
Memory
3GB LPDDR4
Memory
Up to 1600MHz LPDDR4
Supported via 1x32bit
DRAM channel
16 GB eMMC
Primary Storage for
platform. Mainly used for
storing SW applications
and user data etc.
eMMC 5.0
Connectivity
Wi-Fi 2.4 GHz/ 5GHz via
QCA6174A-1 – PCIe
QCA6174A-1 Wi-Fi +
BT Combo Chip
802.11a/b/g/n/ac – 20/40
MHz at 2.4 GHz,
20/40/80 MHz at
5.0 GHz via QCA6174A-
1 over PCIe1.
Full 2x2 antenna
configuration.
BT V4.1 - 2.4 GHz via
QCA6174A-1
– UART / PCM
QCA6174A-1 Wi-Fi +
BT Combo Chip
Support BT 4.1 + HS,
BLE and backward
compatible with BT 1.x,
2.x + EDR
RF Interfaces
2xWLAN / BT MH4
Connect to antenna on
carrier board via coax
cable
2.4/ 5 GHz
Audio Interfaces
4 x SAI
Synchronous Audio
Interface
SAI1 8ch TX/RX
SAI2 2ch TX/RX
SAI3 2ch TX/RX
SAI5 4ch RX
1 x SPDIF
Digital Audio Interface
SPDIF TX/RX

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Interfaces
2 x MIPI CSI
Camera Connectors
CSI1, CSI2
MIPI Alliance
Specification v1.0
2 x USB 2.0/ 3.0 OTG
USB3.0 Standard
1 x MIPI DSI
100- pin display
connector. Interfaces
with Intrinsyc Display
Adapter Board
MIPI Alliance
Specification v1.01.
MIPI D-PHY
Specification v0.65,
v0.81, v0.90, v1.01
2 x PCIe 1Lane Gen2
PCI Express
Specification, Rev 2.1
1 x Gigabit Ethernet
RGMII interface
1 x HDMI 2.0a
HDMI capable of 4K
60Hz content
HDMI 2.0a
3 x Memory / Storage
1 x 8 bit NAND
1 x 4 bit QSPI
1 x 4 bit SDIO
JEDEC/MMC standard
version 5.0, SD 3.0
2 x I2C
I2C1, I2C3
2 x Debug UART
1x Enhanced UART
for A53
1x Standard UART for
M4
1 x JTAG
SOM RF Specification for WIFI, BT
The SOM includes the following radio interfaces from a single QCA6174A-1 module:
oANT1: Wi-Fi antenna 1 + BT
oANT2: Wi-Fi antenna 2
Antenna 1: The antenna 1 connector is for one of the two Wi-Fi antennas as well as the single
Bluetooth antenna.
Antenna 2: The antenna 2 connector is for the second Wi-Fi antenna.
By default, both antenna ports are connected by coaxial cables to the PCB trace antennas on the carrier
board. Note that two dual-band (2.4GHz + 5GHz) antennas are required to be connected to achieve
full performance of the Wi-Fi interface. If only Bluetooth is being used, then only a single 2.4GHz
antenna connected to antenna 1 is necessary.
The SOM WiFi/BT module is a pre-certified module for FCC and Industry Canada (see FCC ID:
2AFDI-ITCNFA324 for details). Please note that the on-board PCB antennas were not the antennas
used for the SOM WiFi/BT module certification.
For details on connecting the WiFi module to the on-board PCB antennas on the carrier board, refer to
section below.

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3.8 Open-X 8M Carrier Board
The Open-X 8M Carrier board is a Mini-ITX form factor board with various connectors used for
connecting different peripherals. The following are the mechanical properties of the carrier board:
Dimensions
289 cm2(170mm x 170mm)
Form Factor
Mini-ITX
Major Interfaces
SOM: 3x100 pin board to board connector
Display: 100 pin carrier board connector
Boot dip switch Configuration Options
Two dip switches on the Open-X 8M carrier board provides the user options to configure the boot
mode and boot device. The table below show the supported boot modes on the Open-X 8M
Development Kit:
S701
BOOT_MODE 1
BOOT_MODE 0
BOOT SOURCE
0
0
Fuses
0
1
Serial Downloader
1
0
Internal (see BOOT Device)
1
1
Reserved (do not use)
The table below shows the supported boot devices on the Open-X 8M Development Kit:
BOOT Device
S700 [0:3]
Boot from eMMC
0010
Boot from SD2
1100
Figure 3-5 Boot Switches S700 and S701

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Open-X 8M Carrier Board Expansion Connectors
Table 3.8.2-1 lists the connectors, expansions and their usages on the carrier board:
Table 3.8.2-1 Carrier Board Expansion options and their usage
Domain
Description
Specification
Usage
Power
AC / Barrel charger
12 V DC Power Supply
5 A
Power Supply
USB Type-C
USB Type-C connector, 5V-20V,
100W
Power Supply or USB
Type-C peripherals
Debug Serial via USB
Debug Serial UART console
over USB for development
SILICON LABS CP2105 USB to
UART for both A53 and M4
processors
Development Serial
Connector for debug
output via USB
JTAG
OS / Firmware Programming /
Debugging JTAG
10-pin connector
eMMC / Platform
programming
ARM / OpenOCD
debugging
Buttons
General Purpose SW button
SMD Button
Additional button for
general purpose
Power Button
SMD Button
Power Button for
Suspend / Resume and
Power off
Reset Button
SMD Button
Button for Reset
Micro SD (on bottom)
Micro SD card
4bit MicroSD SD3.0 card or MMC
card support
External Storage
3.5mm Audio Jack
Audio Jack supported using
CIRRUS LOGIC WM8524
audio codec
CTIA standard 3.5mm 4-pole audio
jack providing 24bit 192kHz stereo
line level audio
High quality stereo
audio support
Audio Expansion
FPC connector for SAI lines
Supports SAI1, SAI3, SAI5, SPDIF
as well as I2C3 and NAND
FPC connector for audio
expansion boards
3 x 0.05mm pitch headers for
SAI lines
Supports SAI1, SAI3, SAI5, SPDIF
as well as I2C3 and NAND
0.05mm headers for
audio and GPIO
expansion
RJ45 Gigabit Ethernet Connector
RJ45 jack with 2 bi-color
LEDs
RJ45 with internal magnetics,
supported using AR8031 Gigabit
Ethernet PHY
For connecting to a
wired LAN
HDMI Type-A Connector
Extended Display ports
HDMI port supports up to 4K
without HDCP 2.0A spec
External Display
USB Type-C OTG
USB Type-C 3.0 OTG
Type-C connector
USB client / host port
for Type-C peripherals
or main power input
USB 3.0
USB 3.0
Type-A header
Host port for USB 3.0
peripherals
WLAN Antenna
2X PCB Antenna
2.4 – 5.1 GHz
Antenna to SOM WiFi
module
LED
4xLED
Red : 12V provided and SW400 is on
Green : CPU is running in overdrive
mode
Blue : General purpose
Orange : General purpose
LCD Display and Touch connector
100 pin for LCD signals from
b2b boards for display
4-lane MIPI DSI, I2C/GPIO,
Backlight
MIPI Alliance Specification v1.01
MIPI D-PHY Specification
v0.65,v0.81, v0.90, v1.01
M.2 (NGFF) PCI Express –
Key-E Connector (on bottom)
M.2 PCI Express Key-E
connectors for external
peripheral connectivity
PCIe1 v2.1
Can support 2230, 2242, 2260 and
2280 M.2 sized cards
For M.2 PCIe add-in
cards

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Domain
Description
Specification
Usage
CSI Camera connectors
2 x CSI port connector with
CLK, GPIOS, CCI
Supports 2 x Camera interfaces via
three separate connectors
•2 x MIPI-CSI each 4 lane
•External flash driver
control
•Support for 3D camera
configuration
•Separate I2C / CCI
control
MIPI Alliance Specification v1.00
for Camera Serial Interface
For connecting camera
accessories.
Power Probe Header
3 pin power probe header
Sense lines connected across 0.005
Ohm resistor
To measure current
consumption of SOM
The following sections will provide in depth information on each expansion header and connectors on
the carrier board. The information listed below is of particular use for those who want to interface
other external hardware devices with the Open-X 8M. Before connecting anything to the development
kit, please ensure the device meets the specific hardware requirements of the processor.

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Open-X 8M Power Specification
The Open-X 8M development kit power source is provided by either the 12V DC barrel jack, or the
USB Type-C jack. From either the power jack or the USB Type-C jack, the power input branches off
into different voltage rails via step down converters on the carrier board and a Power management IC
(PMIC) on the SOM. The SOM and carrier board is powered by 3.38V via a Richtek step down
converter U400 on the carrier board. The 3.38V is then fed directly to the SOM PMIC. To ensure the
SOM is getting powered correctly, a user can monitor the current going into the SOM via the power
probe header J600 (see section 3.8.4).
Note that even though the hardware design supports powering the development kit solely from the
USB Type-C jack, the software may not support this feature. Please check the release notes for the SW
release you are using to confirm whether it is supported. The release notes are available on the product
support site.
Figure 3-6 12V DC Power Jack J300
Figure 3-7 - USB Type-C J1300
The NXP PF4210 PMIC is used to source various regulated power rails on the SOM.

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Power Probe Header J600
Figure 3-8 Power Probe Header J600
The power probe header is used to sense/ monitor the current on the 3.38V power rail going into the
SOM. The table below summarizes the pinout of header J600.
Table 3.8.4-1 Power Header Pin-out, J600
Description
Signal
Pin
SOM power positive
current sense line
SOM_PWR_SENSE_P
J600[1]
SOM power negative
current sense line
SOM_PWR_SENSE_N
J600[2]
GND
GND
J600[3]
To obtain power consumption measurements, the Power Probe Header J600 can be connected to a data
acquisition unit (such as a Keithley 2701) and the voltages on the SOM_PWR_SENSE_P/N pins should
be captured every few seconds over a test period (typically 30 minutes). The SOM power consumption
can then be calculated using the following formula (where Rsense = 5 milliohms):
=___󰇧______
 󰇨

Open-X™ 8M Development Kit based on the NXP i.MX8™ Processor User Guide Version 1.0
20
Copyright Intrinsyc Technologies Corporation
Debug Serial UART over USB J800
Figure 3-9 Debug UART over USB J800
The UART connection used on the Open-X 8M is a USB micro B connector (J800). The debug
UART is available over USB via the SILICON LABS CP2105 chip on the carrier board.
UART1_TXD and UART1_RXD are used to output serial debugging information for A53-core.
UART2_TXD and UART2_RXD are used to output serial debugging information for M4-core. No
RTS or CTS signals are sent from the Processor to the Debug connector as these signals are typically
ignored by most applications. To get the serial terminal working with a PC, user needs to ensure that
the appropriate SILICON LABS drivers are installed.
The terminal settings are as follows:
Figure 3-10 UART Configuration
Data Rate
115,200 Baud
Bata Bits
8
Parity
None
Stop Bits
1