Intrinsyc Open-Q 670 HDK User manual

Open-Q™ 670 HDK Hardware Development Kit
User Guide
[Document: ITC-01CGS1394-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q™ 670 HDK Hardware
Development Kit and Software License Agreement for the Open-Q 670 Hardware Development Kit, which you or the legal entity you represent,
as the case may be, accepted and agreed to when purchasing an Open-Q Development Kit from Intrinsyc Technologies Corporation
(“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the
Agreement, solely in support of your permitted use of the Open-Q 670 Hardware Development Kit under the Agreement. Distribution of this
document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which
they can withhold, condition or delay in its sole discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm® and Snapdragon™are trademarks of Qualcomm® Incorporated, registered in the United States and other countries. Other
product and brand names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion
contrary to U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-Q™ 670 HDK Hardware Development Kit User Guide
Document Number ITC-01CGS1394-UG-001
Version 1.0
Date December 10, 2018
Revision History
REVISION
DATE
DESCRIPTION
PAGES
1.0
December 10, 2018
Initial Draft, from 80-PJ602-2_B_HDK670(SDA670)
All

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Table of Contents
1. INTRODUCTION...................................................................................4
1.1 Purpose ..................................................................................................... 4
1.2 Scope......................................................................................................... 4
1.3 Intended Audience................................................................................... 4
2. DOCUMENTS.......................................................................................5
2.1 Applicable Documents............................................................................. 5
2.2 Reference Documents............................................................................. 5
2.3 Terms and Acronyms .............................................................................. 5
2.4 List of Figures........................................................................................... 6
2.5 List of Tables............................................................................................. 6
3. OPEN-Q 670 HARDWARE DEVELOPMENT KIT................................7
3.1 Introduction ............................................................................................... 7
3.2 Development Platform Notice................................................................ 7
3.3 Anti-Static Handling Procedures............................................................ 7
3.4 Kit Contents............................................................................................... 8
3.5 Hardware Identification Label................................................................. 9
3.6 System Block Diagram.......................................................................... 10
3.7 Open-Q 670 HDK Processor Board.................................................... 11
3.7.1 Processor Board Mechanical Properties........................................................... 12
3.7.2 Processor Board Block Diagram........................................................................ 12
3.7.3 Hardware Specification........................................................................................... 14
3.8 Open-Q 670 HDK Carrier Board.......................................................... 16
3.8.1 Dip switch Configuration Options....................................................................... 17
3.8.2 Carrier Board Expansion Connectors................................................................ 19
3.8.2.1 Power Options.....................................................................................................................21
3.8.2.2 Debug Serial UART header J2103...................................................................................21
3.8.2.3 Debug Serial UART over USB J2102 ..............................................................................22
3.8.2.4 JTAG header J2101............................................................................................................22
3.8.2.5 Sensor IO Expansion Header J2501................................................................................23
3.8.2.6 NFC Expansion Header J2401 .........................................................................................24
3.8.2.7 Headset Jack J1501...........................................................................................................25
3.8.2.8 Audio Inputs Expansion Header J1601............................................................................26
3.8.2.9 Audio Outputs Expansion Header J1602 ........................................................................27
3.8.2.10 USB3.1 Type-C Connector J1201....................................................................................28
3.8.2.11 On Board PCB WLAN Antenna ........................................................................................28
3.8.2.12 On Board PCB GNSS Antenna.........................................................................................29
3.8.2.13 GNSS SMA Connector J3802...........................................................................................30
3.8.2.14 Camera connectors ............................................................................................................30
3.8.3 Vertigo Sensor connector.................................................................................... 34
3.8.4 HDMI Connector................................................................................................... 34
3.9 Display Card............................................................................................. 36
3.9.1 Display Card Overview........................................................................................ 36
3.9.2 Display Card Connector J0501 .......................................................................... 37
3.9.2.1 Connecting the Display Card to the Development Kit....................................................38
3.9.3 Display panel......................................................................................................... 39

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™ 670
HDK Hardware Development Kit.
For more background information on this development kit, visit: www.intrinsyc.com
1.2 Scope
This document will cover the following items on the Open-Q 670 Hardware Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•Processor board
•Carrier Board
•Display Board for LCD
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the
Intrinsyc Open-Q 670 Hardware Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 670 Hardware Development
Kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q
Development Kit
2.2 Reference Documents
REFERENCE
TITLE
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral (Serial interfaces like UART /
SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SPMI
System Power Management Interface (Qualcomm® PMIC / baseband
proprietary protocol)
SSBI
Single wire serial bus interface (Qualcomm® proprietary mostly PMIC /
Companion chip and baseband processor protocol)
UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

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2.4 List of Figures
Figure 3-1 HDK670 Platform Top............................................................................................................ 8
Figure 3-2 Assembled Open-Q 670 Hardware Development Kit bottom ................................................ 9
Figure 3-3 Open-Q 670 HDK Processor board + Carrier Board Block Diagram................................... 10
Figure 3-4 Open-Q 670 HDK PROCESSOR BOARD .......................................................................... 11
Figure 3-5 Open-Q 670 Processor Board Block Diagram...................................................................... 13
Figure 3-6 Open-Q 670 HDK Carrier Board.......................................................................................... 16
Figure 3-7 J0701 12V DC Power Jack.................................................................................................... 21
Figure 3-8 J2103 3.3V TTL Debug UART............................................................................................. 21
Figure 3-9 J2102 Debug UART over USB............................................................................................. 22
Figure 3-10 J2101 JTAG header............................................................................................................. 22
Figure 3-11 J2501 SENSOR EXPANSION HEADER.......................................................................... 23
Figure 3-12 J2401 NFC EXPANSION HEADER.................................................................................. 24
Figure 3-13 HEADPHONE JACK ......................................................................................................... 25
Figure 3-14 J1601 Audio Inputs Expansion Header............................................................................... 26
Figure 3-15 J1602 Audio Outputs Expansion Header............................................................................ 27
Figure 3-16 J1201 USB3.1 Type-C Connector....................................................................................... 28
Figure 3-17 On Board PCB WLAN Antennas........................................................................................ 29
Figure 3-18 On board PCB GNSS Antennas.......................................................................................... 29
Figure 3-19 GNSS SMA Connector ....................................................................................................... 30
Figure 3-20 Camera Connector (J1701).................................................................................................. 31
Figure 3-21 Vertigo Connector (J1701)............................................................................................... 34
Figure 3-22 HDMI Connector (J1401) ................................................................................................... 34
Figure 3-23 Dip Switch S2301-8............................................................................................................ 35
Figure 3-24 HDK 670 Display Card....................................................................................................... 36
Figure 3-25 Display Card Default Configuration ................................................................................... 38
2.5 List of Tables
Table 3.7-1 Open-Q 670 HDK Processor Board Mechanical Properties ............................................... 12
Table 3.7-2 Open-Q 670 HDK Processor Board Hardware Features..................................................... 14
Table 3.8-1 Open-Q 670 HDK Carrier Board Mechanical Properties.................................................... 16
Table 3.8-2 Dip Switch S2301 HW / SW configuration......................................................................... 17
Table 3.8-3 Dip Switch S2302 HW / SW configuration......................................................................... 18
Table 3.8-4 Carrier Board Expansion Options and Usage...................................................................... 19
Table 3.8-5 Debug UART Header J2103 Pin-out................................................................................... 22
Table 3.8-6 JTAG Header J2101 Pin out................................................................................................ 23
Table 3.8-7 Sensor Expansion Header J2501 Pin out............................................................................. 24
Table 3.8-8 NFC Expansion Header J2401 pin out................................................................................. 25
Table 3.8-9 Audio Inputs Expansion Header J1601 Pin out ................................................................... 27
Table 3.8-10 Audio Inputs Expansion Header J1601 Pin out................................................................. 28
Table 3.8-11 GNSS Antenna Option ...................................................................................................... 30
Table 3.8-12 MIPI CSI Camera Connector Pinouts (J1701).................................................................. 31
Table 3.8-13 MIPI CSI Camera Use Cases............................................................................................. 33
Table 3.9-1 Display Card Mechanical Properties................................................................................... 36
Table 3.9-2 Display Power Domains...................................................................................................... 38

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3. OPEN-Q 670 HARDWARE DEVELOPMENT KIT
3.1 Introduction
The Open-Q 670 Hardware Development Kit provides a quick reference or evaluation platform
for Qualcomm’s Snapdragon™SDA670 processor. This kit is suited for Android / Linux
application developers, OEMs, consumer manufacturers, hardware component vendors, video
surveillance, robotics, camera vendors, and flash chip vendors to evaluate, optimize, test and
deploy applications that can utilize the Qualcomm® Snapdragon™670 series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for engineering
development, engineering evaluation, or demonstration purposes only and is meant for use in
a controlled environment. This device is not being placed on the market, leased or sold for use
in a residential environment or for use by the general public as an end user device.
This development platform is not intended to meet the requirements of a commercially available
consumer device including those requirements specified in the European Union directives
applicable for Radio devices being placed on the market, FCC equipment authorization rules
or other regulations pertaining to consumer devices being placed on the market for use by the
general public.
This development platform may only be used in a controlled user environment where operators
have obtained the necessary regulatory approvals for experimentation using a radio device and
have appropriate technical training. The device may not be used by members of the general
population or other individuals that have not been instructed on methods for conducting
controlled experiments and taking necessary precautions for preventing harmful interference
and minimizing RF exposure risks. Additional RF exposure information can be found on the
FCC website at http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 670 Hardware Development Kit has exposed electronics and chipsets. Proper
anti-static precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap

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3.4 Kit Contents
The Open-Q 670 Hardware Development Kit includes the following:
oA processor board with the Snapdragon™670 (SDA670) processor main CPU
board
oMini-ITX form-factor carrier board for I/O and connecting with external peripherals
o12V power adapter
oUSB type-C cable and charger
o5.65” (1440x2160) Display card
oLithium ion battery 4.4V/3000mAh
Figure 3-1 HDK670 Platform Top

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Figure 3-2 Assembled Open-Q 670 Hardware Development Kit bottom
The development kit comes with Android software pre-programmed on the CPU board or
processor board. Please contact Intrinsyc for availability of camera modules, sensor boards,
and other accessories: [email protected]
3.5 Hardware Identification Label
Labels are present on the CPU board. The following information is conveyed on these two
boards:
Processor board:
•Serial Number
•WIFI MAC address
Refer to http://support.intrinsyc.com/account/serialnumber for more details about locating
the serial number, as this will be needed to register the development kit. To register a
development kit, please visit: http://support.intrinsyc.com/account/register
Note: Please retain the and carrier board serial number for warranty purposes.

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3.6 System Block Diagram
The following diagram explains the interconnectivity and peripherals on the development kit.
The following diagram explains the interconnectivity and peripherals on the development kit.
Audio Test Card
UIM1
UIM
QUP3
Data/Clk
SLIMBUS
CCI0
SSC_SPI1
DSI0
JTAG
WCSS
WLAN-BT COEX
WCN3990
(WLAN/BT)
Via Analog I/Q
2xI/Q
TX/RX
BT/FM Audio
QLINK
SPMI
CSI0
CCI1
CSI2
JTAG
SLIMBUS
QUP6 BT/FM HCI UART
SSC_UART1
BLE UART
I2C
6Gbps per lane
8.6Gbps per port
DPHY
Baseband Daughter Card (2-6-2)
Display Adaptor Card
SPI
Carrier Board (1-6-1)
GNSS
WSA8815
Spkr Amps
NFC expansion
Type C USB0_SS
QUP12
USB to UART
Bridge
Micro B
DMIC X4
B2B
CSI1
SLIMbus
Receiver
Coax.
WWAN
(SDR660)
Boot Config(S2301)
Headset
Connector
RCM
B2B
Channel 0
Coax
QUP0
SPI
JTAG
UIM2_QUP13 UIM
WCSS1 WLAN_CH0 CNTRL
WCI2
WAN-WCN COEX
QLINK(1Tx/3Rx)
SoundWire clk/data
WCD9341
(Audio Codec)
SSC_SPI2
QCT801S
Improve touch
SSC_I2C1
Flash_LED1
Flash_LED2
QUP10
SDC2
UFS1_L0
JTAG expansion
Sensor Test Card
USB1_SS
USB_HS
GPIO
SPI
I2C
DNI
0ohm
I2C
I2C
1x 4lanes
Audio Out
Exp. Audio In
Exp.
Speaker
12ohm
Connector
Connector
Wifi
Sensor
Exp.
RFFE1 clk/data
RCM
RCM
5.65" TFT
FHD+
General Config(S2302)
GPIO
PM670
Data/Clk
CXO
PON_RESET_N
38.4
HVDCP 3200mAh
PM670L
I2C
/RGB
LEDs
SMB1355
B2B
Accel/Gyro
Magneto
ALS/Proximity
Pressure
Humidity
UV
Gas
Hall GPIO_124
1x 4lanes
1x 4lanes
Camera Exp.
Single Camera card
(10-P6679-3)
Rear IMX318
Front IMX258
Dual Camera card
(10-PB804-1)
OV12A10
OV12880
CSI0
CSI2
CSI0
CSI1
Micro SD
LNA
Channel 1
Coax
Wifi
CXO
RESIN_N
WCSS2 WLAN_CH1 CNTRL
HDMI
Connector
DSI
Switch
HDMI
TypeA
1x 4lanes
HDMI LT9611
Port BPort A
4bit eMMC5.1
USB3.1+DP
UART
Sensor Core
share w/
ADSP/LPASS
Adreno 615,
512KB GMEM
HEXAGON
V65 DSP
Kryo CPU
2xGold 2.0GHz
6xSilver 1.7GHz
SDA670
Universal
Flash
Storage
uMCP
eMCP
UFS 2.1
LPDDR4x
eMMC
LPDDR4x
2x16bit
SDC1
EBI0
EBI1
8bit eMMC5.1
Power
Vol+
Vol- (RESIN_N)
GPS Izat Gen9
Adrastea WLAN
Module
2x2, 11ac,
VHT160, DBS
eMCP
QUP8
SPI
QUP9
I2C
SPI
Figure 3-3 Open-Q 670 HDK Processor board + Carrier Board Block Diagram
Sensor Exp.
Audio In
Exp.
Audio Out
Exp.
Sensor Exp.

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3.7 Open-Q 670 HDK Processor Board
The Processor board provides the basic common set of features with minimal integration
efforts for end users. It contains the following:
•Snapdragon 670 (SDA670) main application processor
•Memory (eMCP/uMCP compatible design)
•eMCP: 64GB eMMC 5.1 + LPDDR4x up to 1866MHz 6GB
•PMIC: PM670 + PM670L –PMIC for Peripheral LDOs, Boost Regulators
•SMB1355 Parallel charger
•WCN3990 Atheros Wi-Fi + BT +FM combo chip over SLIMbus, Analog IQ,
UART, PCM
•WCD9341 Audio Code
•SDR660 GNSS support
Figure 3-4 Open-Q 670 HDK PROCESSOR BOARD

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3.7.1 Processor Board Mechanical Properties
Table 3.7-1 Open-Q 670 HDK Processor Board Mechanical Properties
Area
42 cm2(60 mm x 70 mm)
Interface
2 x 240-pin high speed board to board connectors.
Thermal
A top side heat sink and a bottom side heat conductive metal plate are
installed by default.
3.7.2 Processor Board Block Diagram
The Open-Q 670 HDK Processor board measuring 60mm x 70mm is where all the processing
occurs. It is connected to the carrier via two 240-pin high speed board-to-board connector. The
purpose of the connectors is to bring out essential signals such that other peripherals can
interface with the platform.

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UIM1 UIM
QUP3
Data/Clk
SLIMBUS
CCI0
SSC_SPI1
DSI0
JTAG
WCSS
WLAN-BT COEX
WCN3990
(WLAN/BT)
Via Analog I/Q
2xI/Q
TX/RX
BT/FM Audio
QLINK
SPMI
CSI0
CCI1
CSI2
JTAG
SLIMBUS
QUP6 BT/FM HCI UART
SSC_UART1
BLE UART
I2C
6Gbps per lane
8.6Gbps per port
DPHY
Baseband Daughter Card (2-6-2)
SPI
USB0_SS
QUP12
B2B
CSI1
SLIMbus
WWAN
(SDR660)
RCM
B2B
QUP0
SPI
JTAG
UIM2_QUP13 UIM
WCSS1 WLAN_CH0 CNTRL
WCI2
WAN-WCN COEX
QLINK(1Tx/3Rx)
WCD9341
(Audio Codec)
SSC_SPI2
SSC_I2C1
Flash_LED1
Flash_LED2
QUP10
SDC2
UFS1_L0
USB1_SS
USB_HS
GPIO
SPI
I2C
I2C
I2C
1x 4lanes
RFFE1 clk/data
GPIO
PM670
Data/Clk
CXO
PON_RESET_N
38.4
HVDCP
PM670L
I2C
/RGB
SMB1355
GPIO_124
1x 4lanes
1x 4lanes
CXO
RESIN_N
WCSS2 WLAN_CH1 CNTRL
1x 4lanes
4bit eMMC5.1
USB3.1+DP
UART
Sensor Core
share w/
ADSP/LPASS
Adreno 615,
512KB GMEM
HEXAGON
V65 DSP
Kryo CPU
2xGold 2.0GHz
6xSilver 1.7GHz
SDA670
Universal
Flash
Storage
uMCP
eMCP
UFS 2.1
LPDDR4x
eMMC
LPDDR4x
2x16bit
SDC1
EBI0
EBI1
8bit eMMC5.1
GPS Izat Gen9
Adrastea WLAN
Module
2x2, 11ac,
VHT160, DBS
eMCP
QUP8
SPI
QUP9
I2C
GPIO
Figure 3-5 Open-Q 670 Processor Board Block Diagram

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3.7.3 Hardware Specification
Table 3.7-2 Open-Q 670 HDK Processor Board Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
SDA670
Qualcomm® Snapdragon™ 670
Processor
A customized 64-bit ARM
v-8 compliant applications
processor
(Qualcomm® Kryo™ CPU
360)
•Kryo Gold: dual
high-performance
cores 2.016 GHz
•Kryo Silver: hexa
low-power cores
1.708 GHz
Adreno GPU 615 up to
430 MHz
Low-power sensor over
Hexagon DSP v65
(shared with low-power
audio) 16/16/512 KB (with
LPI)
PMIC (PM670, PM670L)
Qualcomm® PMIC, Companion PMIC
for SDA670 processor
PM670 –part of the dual
PMIC solution that
integrates wireless
product’s power
management, general
housekeeping, user
interface, and IC-level
interface support
functions.
PM670L –supplements
the maser core
PMIC(PM670) to integrate
all wireless handset power
management, general
housekeeping, audio
codec, and user interace
support functions into an
integrated two-IC solution,
PM670L supports the LCD
display module.
Memory
LPDDR4x
6GB LPDDR4X
LPDDR4x up to 1866MHz
eMMC
64GB eMMC5.1
eMMC 5.1
UFS
128GB UFS2.1
UFS 2.1
Connectivity
Wi-Fi 2.4 GHz/ 5GHz via
WCN3990 –Analog IQ,
WSI 2.0,
Wi-Fi Atheros WCN3990Wi-Fi + BT
+FM Combo Chip
802.11a/b/g/n/ac 2.4/5.0
GHz via WCN3990 over
analog IQ, WSI 2.0,
BT 2.4 GHz via WCN3990
–UART / SLIMbus
Wi-Fi Atheros WCN3990
Wi-Fi + BT +FM Combo Chip
Support BT 5.0 + HS and
backward compatible with
BT 1.x, 2.x + EDR

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Subsystem /
Connectors
Feature Set
Description
Specification
GNSS via SDR670 –Qlink
Qualcomm Proprietary
Protocol
GNSS Frontend
GPS/ GLONASS/
COMPASS/Galileo
RF
2xWLAN / BT
Connect to antenna on carrier board
via coax cable
2.4/ 5 GHz
1x GNSS
Connect to antenna on carrier board
via coax cable
GPS/ GLONASS/
COMPASS /Galileo
Audio
1 x Headset Output
Headset/ headphone output
Analog differential output
2 x Loud-speaker
2 x loud-speaker output
Digital output
1 x Earpiece output
Earpiece output
Analog differential output
3 x analog MICs
Analog MIC input
Analog differential input
3 x digital MICs
Digital MIC input
Digital input
Camera
3 x MIPI CSI
1x 120pin Camera Connector for
CSI0, CSI1, and CSI2
MIPI Allie Specification
v1.2
Display
1 x MIPI DSI + Touch
100-pin display Connector
100- pin display connector
MIPI Allie Specification
v1.2.
MIPI D-PHY Specification
v0.65, v0.81, v0.90,
v1.01 ,v1.2
USB
1 x Type-C USB 3.1
Type-C USB 3.1
USB3.1
Connectors
2 x 240pin BB Card
connector
Connector for BB Card
2 x 240 pin B2B connector

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3.8 Open-Q 670 HDK Carrier Board
The Open-Q 670 HDK Carrier board is a Mini-ITX form factor board with various connectors
used for connecting different peripherals. The following are the mechanical properties of the
carrier board:
Table 3.8-1 Open-Q 670 HDK Carrier Board Mechanical Properties
Dimensions
289 cm2(170mm x 170mm)
Form Factor
Mini-ITX
Major
Interfaces
Carrier board: 2x240 pin board to board connector
Display: 100 pin board to board connector
Thermal
A thermal pad is placed between the processor board and the carrier board
Figure 3-6 Open-Q 670 HDK Carrier Board

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3.8.1 Dip switch Configuration Options
There is a DIP switch S2301 on the south top side of the Open-Q 670 HDK carrier board. The
8-bit switch allows the user to control the system configuration and boot options. Table 3.8-1
below outlines the pin outs and connections of this DIP switch.
Table 3.8-2 Dip Switch S2301 HW / SW configuration
Function
DIP Switch
Description
Notes
FORCED_USB_BOOT
S2301-1
Toggles between FORCE
USB boot and EDL mode.
Enables FOCE USB
(GPIO 57) when DIP
switch turned on
Default out of the box
configuration is OFF
WATCHDOG _DISABLE
S2301-2
Enables
WATCHDOG_DISABLE
when DIP switch turned
on. Controlled by SDA-
GPIO 101
Default out of the box
configuration is OFF
BOOT_CONFIG[1]
S2301-3
Enables SDA boot
configuration 1 when DIP
switch turned on.
Controlled by SDA-GPIO
99
Default out of the box
configuration is OFF
BOOT_CONFIG[2]
S2301-4
Enables SDA boot
configuration 2 when DIP
switch turned on.
Controlled by SDA-
GPIO100
Default out of the box
configuration is OFF
BOOT_CONFIG[3]
S2301-5
Enables SDA boot
configuration 3 when DIP
switch turned on.
Controlled by SDA
GPIO133
Default out of the box
configuration is OFF
External 5V boost
manual control (Reserve)
S2301-6
Manually enable external
5V boost output.
Default controlled by
software automatically
Default out of the box
configuration is OFF
This DIP is default disabled
and for internal use only.
DSI0_SW_SEL(Reserve)
S2301-7
Select DSI0 data path
between display card and
HDMI
Default route DSI0 to
display card
Default out of the box
configuration is OFF
This DIP is default
disabled.
DSI0 data path is default
simultaneously controlled
by S2301-8 for easy use.
To separately control DSI0
path with this DIP needs
HW change (DNI R3404,
SMT R3403).
DSI1_SW_SEL
S2301-8
Select DSI1 data path
between display and
HDMI
Default route DSI1 to
display card
Default out of the box
configuration is OFF
DSI1 will be routed to
HDMI by turning on DIP.
This DIP controls both
DSI0 and DSI1 by default.

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There is another DIP switch S2302 on the north top side of the carrier board. The 8-bit switch
allows the user to control the system configuration and boot options.
Table 3.8-3 Dip Switch S2302 HW / SW configuration
Function
DIP Switch
Description
Notes
CHARGE_DISABLE
S2302-1
Disable charge when DIP
switch turned on
Default out of the box
configuration is OFF
which enables system
charge from USB
Note: make sure turn on
this switch when DC-
12V input and USB are
both present
N/C
S2302-2
NA
Not used in HDK670
N/C
S2302-3
NA
Not used in HDK670
MSM_PS_HOLD
S2302-4
Enables the
JTAG_PS_HOLD mode
when DIP switch turned
on
Default out of the box
configuration is OFF
N/C
S2302-5
NA
Not used in HDK670
QUP0_SPI_SEL
S2302-6
Select QUP0 path
between NFC(J2401) and
Education(J2801)/ETH
Default out of the box
configuration is OFF
Note: QUP0 is default
routed to NFC
QUP15_SPI_SEL
S2302-7
Select QUP15 path
between display card
(J1301) and onboard
fingerprint(J3102)
Default out of the box
configuration is OFF
Note: QUP15 is default
routed to onboard
fingerprint
QUP_TP_CONFIG
S2302-8
Config the signals
connected to QUP_TP
Default out of the box
configuration is OFF
Note: SSC SPI2 is
routed to QUP_TP by
default
Warning! : Before making any changes to the dip switch, make sure to note down the
previous configuration. The default switch settings are above.

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3.8.2 Carrier Board Expansion Connectors
The following table lists the connectors, expansions and their usages on the carrier board:
Table 3.8-4 Carrier Board Expansion Options and Usage
Domain
Description
Specification
Usage
Power
AC / Barrel charger
12 V DC Power Supply
5 A
Power Supply
Battery connector
8 pin header
For providing power
from 4.4V/2850mAh
battery
Debug Serial via USB
Debug Serial UART
console over USB for
development
USB Micro B connector
Development Serial
Connector for
debug output via
USB
JTAG
OS / Firmware /QFROM
Programming / Debugging
JTAG
Standard 20-pin connector,
ARM and OpenDSP –
Lauterbach
QFROM / eMMC /
Platform EEPROM
programming
ARM / Open DSP
debugging
Buttons
Power
SMD Button
Power Button for
Suspend / Resume
and Power off
Volume +
SMD Button
Volume +Key
Volume –
SMD Button
Volume –Key
Home(Reserve)
SMD Button
Reserved button for
Home or general
purpose
NFC Board Header
20 pin NFC expansion
connectors
Standard 20-pin connector,
support dedicated NFC
debug card
Reserved connector
for internal use
Micro SD Card
Micro SD card
4bit Micro SD card support
External Storage
Audio Jack
Audio Jack
Supported by WCD9341
Nomal Open, support US
Standard CTIA headset by
default
Audio headset
support
3-Digital Microphone via
audio input expansion
header
Audio expansion
Supported by WCD9341
Digital Audio header
For Digital audio
input for Digital MIC,
I2S codec, Slim bus
interface.
3-Analog Microphone via
audio input expansion
header
Audio expansion
Supported by WCD9341
Analog Audio header
For Analog audio
input for Analog
MIC (differential
signal)
2-Loud Speaker via audio
output expansion header
Audio expansion
Supported by WCD9341
Analog Audio header
For loud speaker
output after signal
has been processed
Earpiece via audio output
expansion header
Audio expansion
Supported by WCD9341
Analog Audio header
For earpiece output
after signal has
been processed
USB 3.1
USB 3.1
Type-C header
Transfer data to and
from CPU
WLAN Antenna
2X PCB Antenna
2.4 –5 GHz
Antenna to BB card

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Domain
Description
Specification
Usage
GNSS Antenna
PCB Antenna
GPS :
1574.42 MHz –1576.42
MHz
GLONASS :
1587 MHz –1606 MHz
COMPASS: 1559.05 to
1563.14MHz
Galileo: 4.092MHz
BW(centered on
1575.42MHz)
Antenna to BB card
LED
3xLED
Red : PMIC Driven
Green: PMIC Driven
Blue: PMIC Driven
Red : General
purpose
Green : General
purpose
Blue : General
purpose
LCD Display and Touch
connector
100 pin for LCD signals
from B2B boards for display
4-lane MIPI DSI0 , DSI1
I2C/SPI/GPIO
Backlight
MIPI Allie Specification v1.2
MIPI D-PHY Specification
v0.65,v0.81, v0.90, v1.01,
V1.2
MIPI C-PHY Specification
v1.0
Only 1 lane DSI is
supported on
HDK670
Sensor header
24 pin sensor header
24 pin sensor header
Header to connect
sensor board.
SIM Card
WWAN SIM card connector
(Reserve)
2x 4bit Micro SIM card
support
For WWAN mini
PCI express cards
(for internal use only
–not supported)
CSI Camera connectors
1 x 120pin connector with
MCLK, GPIOS, CCI
1 x 120pin connector with
MCLK, GPIOS, CCI
Supports CSI0, CSI1 and
CSI2 via one 120pin
connector
▪3 x MIPI-CSI each 4 lane
▪External flash driver
control
▪Support for 3D camera
configuration
▪Separate MCLK / CCI
control
MIPI Allie Specification v1.2
for Camera Serial Interface
▪Single Rear,
Front camera
▪Dual Camera
▪Iris Camera
The following sections provide in depth information on each expansion headers and connectors
on the carrier board. The information listed below is of particular use for those who want to
interface other external hardware devices with the Open-Q 670 HDK. Before connecting
anything to the development kit, please ensure the device meets the specific hardware
requirements of the processor.