Intrinsyc Open-Q 835 User manual

Open-Q™ 835 Development Kit based on the
Snapdragon™ 835 (APQ8098) Processor
User Guide
[Document: ITC-01IMP1283-UG-001 Version: 1.0]
Your use of this document is subject to and governed by those terms and conditions in the Intrinsyc Purchase an Open-Q™ 835
Development Kit based on the Snapdragon™ 835 (APQ8098) Processor and Software License Agreement for the Open-Q 835
Development Kit, which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q
Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part
of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use of the Open-Q 835
Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of
Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion.
Intrinsyc is a trademark of Intrinsyc Technologies Corporation., registered in Canada and other countries.
Qualcomm® and Snapdragon™ are trademarks of Qualcomm® Incorporated, registered in the United States and other countries. Other
product and brand names used herein may be trademarks or registered trademarks of their respective owners.
This document contains technical data that may be subject to U.S. and international export, re-export, or transfer (“export”) laws.
Diversion contrary to U.S. and international law is strictly prohibited.

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IDENTIFICATION
Document Title Open-Q™ 835 Development Kit based on the Snapdragon™
835 (APQ8098) Processor User Guide
Document Number ITC-01IMP1283-UG-001
Version 1.0
Date May 10, 2017
Revision History
REVISION DATE DESCRIPTION PAGES
1.0 May 10, 2017 Initial Draft All

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Table of Contents
1. INTRODUCTION.................................................................................. 5
1.1 Purpose...................................................................................................... 5
1.2 Scope......................................................................................................... 5
1.3 Intended Audience................................................................................... 5
2. DOCUMENTS ...................................................................................... 6
2.1 Applicable Documents............................................................................. 6
2.2 Reference Documents............................................................................. 6
2.3 Terms and Acronyms.............................................................................. 6
2.4 List of Figures........................................................................................... 8
2.5 List of Tables............................................................................................. 9
3. Open-Q 835 DEVELOPMENT KIT .................................................... 10
3.1 Introduction ............................................................................................. 10
3.2 Development Platform Notice.............................................................. 10
3.3 Anti-Static Handling Procedures.......................................................... 10
3.4 Kit Contents............................................................................................. 10
3.5 Hardware Identification Label............................................................... 12
3.6 System Block Diagram.......................................................................... 13
3.7 Open-Q 835 Processor Board ............................................................. 14
3.7.1 Processor Board Mechanical Properties...........................................................14
3.7.2 Processor Board Block Diagram.........................................................................15
3.7.3 Hardware Specification ........................................................................................16
3.7.4 Processor Board RF Specification for WIFI, BT...............................................17
3.8 Open-Q 835 Carrier Board................................................................... 18
3.8.1 Dip switch S10 Configuration Options ...............................................................19
3.8.2 Carrier Board Expansion Connectors ................................................................21
3.8.3 DC Power Input J0701.........................................................................................23
3.8.4 Battery Header J1001...........................................................................................24
3.8.5 RCM Header J0901..............................................................................................25
3.8.6 Debug Serial UART Header J2103....................................................................25
3.8.7 Debug Serial UART over USB J2102 ................................................................25
3.8.8 JTAG Header J2101.............................................................................................26
3.8.9 Sensor IO Expansion Header J2501..................................................................27
3.8.10 NFC Expansion Header J2401 ...........................................................................28
3.8.11 ANC Headset Jack J1501....................................................................................29
3.8.12 Audio Inputs Expansion Header J1601 .............................................................30
3.8.13 Audio Outputs Expansion Header J1602 ..........................................................31
3.8.14 On Board PCB WLAN Antenna ..........................................................................32
3.8.15 On Board PCB GPS Antenna..............................................................................33
3.8.16 GPS SMA Connector J3802................................................................................33
3.8.17 Open-Q Display.....................................................................................................34
3.8.18 HDMI Connector J1401........................................................................................34
3.8.19 Display Connector J1301.....................................................................................35
3.8.20 Connecting the Display Board to the Development Kit ...................................37
3.8.21 Camera Connectors..............................................................................................38
3.8.22 USB 3.1 TYPEC connector J1101......................................................................41

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3.8.23 GNSS Card............................................................................................................41

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1. INTRODUCTION
1.1 Purpose
The purpose of this user guide is to provide primary technical information on the Open-Q™
835 Development Kit based on the Snapdragon™ 835 (APQ8098) Processor.
For more background information on this development kit, visit: www.intrinsyc.com
1.2 Scope
This document will cover the following items on the Open-Q 835 Development Kit:
•Block Diagram and Overview
•Hardware Features
•Configuration
•Processor board
•Carrier Board
•Display Board for LCD (Optional)
1.3 Intended Audience
This document is intended for users who would like to develop custom applications on the
Intrinsyc Open-Q 835 Development Kit.

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2. DOCUMENTS
This section lists the supplementary documents for the Open-Q 835 Development Kit.
2.1 Applicable Documents
REFERENCE
TITLE
A-1
Intrinsyc Purchase and Software License Agreement for the Open-Q
Development Kit
2.2 Reference Documents
REFERENCE
TITLE
R-1
Open-Q 835 Schematics (Processor board, Carrier)
2.3 Terms and Acronyms
Term and acronyms
Definition
AMIC
Analog Microphone
ANC
Audio Noise Cancellation
B2B
Board to Board
BLSP
Bus access manager Low Speed Peripheral (Serial interfaces
like UART / SPI / I2C/ UIM)
BT LE
Bluetooth Low Energy
CSI
Camera Serial Interface
DSI
MIPI Display Serial Interface
EEPROM
Electrically Erasable Programmable Read only memory
eMMC
Embedded Multimedia Card
FCC
US Federal Communications Commission
FWVGA
Full Wide Video Graphics Array
GPS
Global Positioning system
HDMI
High Definition Media Interface
HSIC
High Speed Inter Connect Bus
JTAG
Joint Test Action Group
LNA
Low Noise Amplifier
MIPI
Mobile Industry processor interface
MPP
Multi-Purpose Pin
NFC
Near Field Communication
RF
Radio Frequency
SATA
Serial ATA
SLIMBUS
Serial Low-power Inter-chip Media Bus
SPMI
System Power Management Interface (Qualcomm® PMIC /
baseband proprietary protocol)
SSBI
Single wire serial bus interface (Qualcomm® proprietary mostly
PMIC / Companion chip and baseband processor protocol)

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UART
Universal Asynchronous Receiver Transmitter
UFS
Universal Flash Storage
UIM
User Identity module
USB
Universal Serial Bus
USB HS
USB High Speed
USB SS
USB Super Speed

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2.4 List of Figures
Figure 1 Assembled Open-Q 835 Development Kit TOP ...................................................................11
Figure 2 Assembled Open-Q 835 Development Kit BOT...................................................................12
Figure 3 Open-Q 835 Processor board + Carrier Board Block Diagram.............................................13
Figure 4 Open-Q 835 PROCESSOR BOARD ....................................................................................14
Figure 5 Open-Q 835 Processor Board Block Diagram.......................................................................15
Figure 6 Open- Q™ 835 Carrier Board ...............................................................................................18
Figure 7 J0701 12V DC Power Jack....................................................................................................23
Figure 8 J1001 Battery Header ............................................................................................................24
Figure 9 J2103 Debug UART Header..................................................................................................25
Figure 10 J2102 Debug UART over USB ...........................................................................................26
Figure 11 J2101 JTAG Header ............................................................................................................26
Figure 12 J2501 Sensor Expansion Header .........................................................................................27
Figure 13 J2502 Gen-10 Sensor Connector (Samtec QSH-030 series) ...............................................28
Figure 14 J2401 NFC expansion header..............................................................................................28
Figure 15 J1501 ANC Headphone Jack...............................................................................................29
Figure 16 J1601 Audio Inputs Expansion Header ...............................................................................30
Figure 17 J1602 Audio Outputs Expansion Header.............................................................................31
Figure 18 On Board PCB Antennas.....................................................................................................32
Figure 19 On Board PCB Antennas.....................................................................................................33
Figure 20 J3802 GPS SMA Connector................................................................................................33
Figure 21 J1401 HDMI Type A Connector .........................................................................................34
Figure 22 100-Pin Display Connector .................................................................................................35
Figure 23 Display Board......................................................................................................................37
Figure 24 Display Board Default Configuration..................................................................................37
Figure 25 Camera Connectors (J1701, J1801, J1901) .........................................................................38
Figure 26 J1101 USB3.1 TYPE-C.......................................................................................................41
Figure 27 Open-Q 835 GNSS Card .....................................................................................................42

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2.5 List of Tables
Table 3.7-1 Open-Q 835 Processor Board Mechanical Properties ......................................................14
Table 3.7-2 Open-Q 835 Processor Board Hardware Features............................................................16
Table 3.8-1 Open-Q 835 Carrier Board Mechanical Properties ..........................................................18
Table 3.8-2 Dip Switch S2301 HW / SW configuration......................................................................19
Table 3.8-3 Dip Switch S2303 HW / SW configuration......................................................................20
Table 3.8-4 Carrier Board Expansion Options and Usage...................................................................21
Table 3.8-5 J1001 Battery Header Pin out...........................................................................................24
Table 3.8-6 J10901 Pin out ..................................................................................................................25
Table 3.8-7 J2103 Debug UART Header Pin out................................................................................25
Table 3.8-8 J2101 JTAG Header Pin out.............................................................................................26
Table 3.8-9 Sensor Expansion Header J2501 Pin out..........................................................................27
Table 3.8-10 NFC Expansion Header J2401 Pin Out..........................................................................29
Table 3.8-11 Audio Inputs Expansion Header J1601 Pin out..............................................................30
Table 3.8-12 Audio Outputs Expansion Header J1602 Pin out...........................................................31
Table 3.8-13 GPS Antenna Option ......................................................................................................33
Table 3.8-14 Display power Domains .................................................................................................36
Table 3.8-15 Display Card Mechanical Properties..............................................................................36
Table 3.8-16 MIPI CSI Camera Connector Pin out (J1701, J1801, J1901).........................................39
Table 3.8-17 MIPI CSI Camera Use Cases..........................................................................................41
Table 3.8-18 Open-Q 835 GNSS Card Mechanical Properties............................................................41

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3. OPEN-Q 835 DEVELOPMENT KIT
3.1 Introduction
The Open-Q 835 Development Kit provides a quick reference or evaluation platform for
Qualcomm’s latest 835 series - Snapdragon™835 processor. This kit is suited for Android /
Linux application developers, OEMs, consumer manufacturers, hardware component
vendors, video surveillance, robotics, camera vendors, and flash chip vendors to evaluate,
optimize, test and deploy applications that can utilize the Qualcomm® Snapdragon™ 835
series technology.
3.2 Development Platform Notice
This development platform contains RF/digital hardware and software intended for
engineering development, engineering evaluation, or demonstration purposes only and is
meant for use in a controlled environment. This device is not being placed on the market,
leased or sold for use in a residential environment or for use by the general public as an
end user device.
This development platform is not intended to meet the requirements of a commercially
available consumer device including those requirements specified in the European Union
directives applicable for Radio devices being placed on the market, FCC equipment
authorization rules or other regulations pertaining to consumer devices being placed on the
market for use by the general public.
This development platform may only be used in a controlled user environment where
operators have obtained the necessary regulatory approvals for experimentation using a
radio device and have appropriate technical training. The device may not be used by
members of the general population or other individuals that have not been instructed on
methods for conducting controlled experiments and taking necessary precautions for
preventing harmful interference and minimizing RF exposure risks. Additional RF exposure
information can be found on the FCC website at http://www.fcc.gov/oet/rfsafety/
3.3 Anti-Static Handling Procedures
The Open-Q 835 Development Kit has exposed electronics and chipsets. Proper anti-static
precautions should be employed when handling the kit, including but not limited to:
•Using a grounded anti-static mat
•Using a grounded wrist or foot strap
3.4 Kit Contents
The Open-Q 835 Development Kit includes the following:

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oOpen-Q 835 Processor board with the Snapdragon™835 (APQ8098)
processor main CPU board
oMini-ITX form-factor carrier board for I/O and connecting with external
peripherals
oGNSS Card
o5.5” Full HD (1440x2560) AMOLED Display card (Additional Accessory)
oAC power adapter
Figure 1 Assembled Open-Q 835 Development Kit TOP

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Figure 2 Assembled Open-Q 835 Development Kit BOT
The development kit comes with Android software pre-programmed on the CPU board or
processor board. Please contact Intrinsyc for availability of camera modules, sensor
boards, and other accessories: [e-mail]
3.5 Hardware Identification Label
Labels are present on the CPU board. The following information is conveyed on these two
boards:
Processor board:
•Serial Number
•WIFI MAC address
Refer to http://support.intrinsyc.com/account/serialnumber for more details about
locating the serial number, as this will be needed to register the development kit. To
register a development kit, please visit: http://support.intrinsyc.com/account/register
Note: Please retain the and carrier board serial number for warranty purposes.

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3.6 System Block Diagram
The Open-Q 835 development platform consists of three major components
oOpen-Q 835 Processor board
oCarrier board for I/O and connecting with external peripherals
oGNSS Card
oDisplay Adapter Board (additional accessory)
The following diagram explains the interconnectivity and peripherals on the development
kit.
Figure 3 Open-Q 835 Processor board + Carrier Board Block Diagram
2x32 LPDDR4x
PoP
WiGig60
Processor card (3-4-3)
PM8998
DSI
WCN3990
Via Analog I/Q
BLSP/SSC
GPIO BLSP/SSC
I2C
CCI0
CSI0
UIM
CSI2
PCIE
CCI1
Universal Flash
Storage
SDIO
SLIMbus
HDMI
USB0
UART
QLINK
Boot Config
Carrier Board (1-6-1)
Display Adaptor Card
PON_RESET_N
I2C7
PM8005
PMI8998
SMB1381
Touchscreen
2xI/Q
CSI1
APQ8098
PCIe2.1
uSD CARD
WCD9341(Audio
Codec)
HDMI2.0
RF or GNSS-only Daughter Card
UART
WWAN
B2B
Sensor Exp.
CSI2
CSI1
CSI0
UFS2.1,G3,2L
HDMI
JTAG
Headset
con
Audio In
Exp.
Audio Out
Exp.

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3.7 Open-Q 835 Processor Board
The Processor board provides the basic common set of features with minimal integration
efforts for end users.
It contains the following:
•Snapdragon™ 835 (APQ8098) main application processor
•LPDDR4 up to 1866MHz 4GB RAM (POP)
•PMI8998 + PM8998 – PMIC for Peripheral LDOs, Boost Regulators
•WCN3990 Wi-Fi + BT +FM combo chip over SLIMbus, Analog IQ, UART,
PCM
•128 GB UFS 2.1.
•WCD9341 Audio Codec
Figure 4 Open-Q 835 PROCESSOR BOARD
3.7.1 Processor Board Mechanical Properties
Table 3.7-1 Open-Q 835 Processor Board Mechanical Properties
Area
42 cm2(60 mm x 70 mm)
Interface
2 x 240-pin high speed board to board connectors.
Thermal
A top side heat sink and a bottom side heat conductive metal plate are
installed by default.

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3.7.2 Processor Board Block Diagram
The Open-Q 835 Processor board measuring 60mm x 70mm is where all the processing
occurs. It is connected to the carrier board via two 100 pin Hirose 240-pin connectors. The
purpose of these connectors is to bring out essential signals such that other peripherals can
be connected to the platform.
Figure 5 Open-Q 835 Processor Board Block Diagram
WCD9341(Audi
o
(WLAN/B
T)
Processor board (3-4-3)
PON RESET
SPM
I
Data/Cl
k
H
RX/T
2xI/
2xWSI
IN
SPI
1
UI
APQ8098
PCIe2.
4-bit
HDMI2.
USB3.1+DP1.3
a
JTA
QLIN

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3.7.3 Hardware Specification
The Open-Q 835 Processor Board platform encompasses the following hardware features:
Table 3.7-2 Open-Q 835 Processor Board Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
APQ8098
Qualcomm® Snapdragon™ 835
Processor
Qualcomm® Kyro CPU, quad
core, 64
-bit ARM V8
compliant processor, 2.2GHz
PMIC (PM8998 &
PMi8998)
Qualcomm® PMIC, Companion PMIC
for APQ8098 processor
NA
Memory
4GB LPDDR4
Memory POP
Up to 1866MHz LPDDR4
POP on CPU BGA chip.
Supports via 2x32bit
channels
32 GB UFS
Primary Storage for platform. Mainly
used for storing SW applications and
user data etc.
Toshiba UFS on board. Can
support up t
o 128GB
Connectivity
Wi-Fi 2.4 GHz/ 5GHz via
WCN3990
– Analog IQ,
WSI
2.0
WCN3990
Wi
-Fi + BT +FM Combo Chip
802.11a/b/g/n/ac 2.4/5.0
GHz via WCN3990 over
analog IQ, WSI 2.0,
Full 2x2 antenna
configuration
BT 2.4 GHz via
WCN3990
– UART / SLIMbus
WCN3990
Wi
-Fi + BT +FM Combo Chip
Support BT 5.0 + HS and
backward compatible with BT
1.x, 2.x + EDR
GNSS via WTR5975 –
Qlink Qualcomm
Proprietary Protocol
GNSS Frontend
GPS/ GLONASS/
COMPASS/Galilei
RF Interfaces
2xWLAN / BT
Connect to antenna on carrier board
via coax cable
2.4 / 5 GHz
1x GNSS
Connect to antenna on carrier board
via coax cable
GPS/ GLONASS/
COMPASS /Galilei
Audio
1xHeadset Output
Headset/ headphone output
Analog differential output
2
x
Loud-speaker
2
x
loud-speaker
output
Digital output
1
x
Earpiece output
Earpiece output
Analog differential output
3 x analog MICs
Analog MIC input
Analog differential input
3xdigital MICs
Digital MIC input
Digital input
Camera
3 x MIPI CSI
Camera Connectors CSI0, CSI1, CSI2
MIPI
Alliance Specification
v1.2
Display
1
xMIPI DSI (DSI0 &
DSI1)
+ Touch 100
-pin display
Connector
100- pin display connector.
MIPI Alliance Specification
v1.2. MIPI D
-PHY
Specification v0.65, v0.81,
v0.90, v1.01, v1.2
USB
1 x USB HS
1 x USB SS
1 x Type-C USB 3.1
USB3.1
PCIe
1 X PCIe
PCIe 0 PCIe signal to Wigig module.
Reserve option for PCIe SLOT1 and
MiniPCIe(hardware rework is needed)
PCI
Express Specification,
Rev 2.1
Connectors
2 x 240pin BB Card
Connector for BB Card
2x 240 pin B2B connector

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Subsystem /
Connectors
Feature Set
Description
Specification
connector
3.7.4 Processor Board RF Specification for WIFI, BT
The Processor board includes the following radio interfaces:
oWi-Fi + BT: WiFi CH0
oWi-Fi only: WiFi CH1
oWTR5975: For GNSS RF Front end
Antenna 0:Antenna 0 is the primary interface for WCN3990 to provide Wi-Fi
connectivity and Bluetooth connectivity. This antenna connector is connected to carrier
board PCB antenna via a coaxial cable. ANT0 is a standard dual band antenna from
2.4 GHz to 5 GHz and BT.
Antenna 1: Antenna 1 is for WCN3990 to provide Wi-Fi. Antenna connector ANT1 is
connected to the carrier board antenna via a coaxial cable. The function of this
connector is for extending the dual band capabilities of the Wi-Fi chip; therefore,
enabling this antenna to be used simultaneously with Antenna 0. For example, Antenna
0 can be connected to 2.4GHz while Antenna 1 can be connected to 5 GHz.
For details on connecting the WiFi module to the on-board PCB antennas on the carrier
board, refer to section 0 below.
For GNSS details, See section 3.8.23 GNSS Card

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3.8 Open-Q 835 Carrier Board
The Open-Q 835 Carrier board is a Mini-ITX form factor board with various connectors used
for connecting different peripherals. The following are the mechanical properties of the
carrier board:
Table 3.8-1 Open-Q 835 Carrier Board Mechanical Properties
Dimensions
289 cm2(170mm x 170mm)
Form Factor
Mini-ITX
Major Interfaces
BB Card: 2x240 pin board to board connector
Display: 100 pin board to board connector
GNSS: 2x240 pin board to board connector
Thermal
Thermal pad is placed between the BB card and carrier board
Figure 6 Open- Q™ 835 Carrier Board

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3.8.1 Dip switch S10 Configuration Options
There is a DIP switch S2301 on the south top side of the Open-Q 835 carrier board. The 8-
bit switch allows the user to control the system configuration and boot options. Table 3.8-1
below outlines the pin outs and connections of this DIP switches.
Table 3.8-2 Dip Switch S2301 HW / SW configuration
Function
DIP Switch
Description
Notes
FORCED_USB_BOOT
S2301-1
Toggles between FORCE USB boot
and EDL mode. Enables FOCE USB
(GPIO 57) when DIP switch turned
on
Default out of the box configuration is
OFF
WATCHDOG _DISABLE
S2301-2
Enables WATCHDOG_DISABLE
when DIP switch turned on. Controlled
by APQ- GPIO 101
Default out of the box configuration is
OFF
BOOT_CONFIG[1]
S2301-3
Enables APQ boot configuration 1
when DIP switch turned on. Controlled
by APQ-GPIO102
Default out of the box configuration is
OFF
BOOT_CONFIG[2]
S2301-4
Enables APQ boot configuration 2
when DIP switch turned on.
Controlled by APQ-GPIO103
Default out of the box configuration is
OFF
BOOT_CONFIG[3]
S2301-5
Enables APQ boot configuration 3
when DIP switch turned on.
Controlled by APQ-GPIO104
See schematic for boot configuration
options.
Default out of the box configuration is
OFF
N/C
S2301-6
NA
NA
N/C
S2301-7
NA
NA
N/C
S2301-8
NA
NA
There is another DIP switch S2302 on the north top side of Open-Q 835 carrier board.
The 8-bit switch allows the user to control the system configuration and boot options.
Table below outlines

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Table 3.8-3 Dip Switch S2303 HW / SW configuration
Function
DIP Switch
Description
Notes
CHARGE_DISABLE
S2302-1
Disable charge when DIP switch
turned on Default out of the box
configuration is OFF which
enables system charge from
USB
Note: make sure turn on this
switch when DC-12V input and
USB are both present
N/C
S2302-2
NA
NA
HUB_RESET_SW
S2302-3
Enables hardware reset from
general switch(J2204) when DIP
switch turned on
Default out of the box
configuration is OFF
Note: Default HUB reset
control is from s/w, hardware
rework is needed to enable
this function
MSM_PS_HOLD
S2302-4
Enables the JTAG_PS_HOLD
mode when DIP switch turned
on
Default out of the box
configuration is OFF
N/C
S2302-5
NA
NA
DISP_IFC_CONFIG
S2302-6
Config the signals connected to
DISP_IFC[0:3] Default out of the box
configuration is OFF
Note: LCD IF is routed to
DISP[0:3] by default
AU/NFC_SPI_CONFIG
S2302-7
Switch the SPI between AU and
NFC Default out of the box
configuration is OFF
Note: SPI is routed to NFC
by default
BLSP_TP_CONFIG
S2302-8
Config the signals connected to
BLSP_TP Default out of the box
configuration is OFF
Note: BLSP5 is routed to
BLSP_TP by default
Warning! : Before making any changes to the dip switch, make sure to note down the
previous configuration. The default switch settings are above.