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Process Guide I-SOI-10
SOIC Installation
Hot Air Jet (Paste)
Equipment Required
PACE SensaTemp®or Intelliheat® Power Supply
TJ-70 ThermoJet®
Flat End Tip (See Chart on Back)
Pik & Paste Liquid Dispensing System
Tip Tool
Optional Equipment
HP-65 HandiPik®
Tweezer
Manual Solder Paste Dispenser
Materials
Solder Paste
Paste Dispense Needles
Cleaner
Procedure
1. Start with a heater temperature of 482°C (900°F) and
adjust as necessary.
2. Install tip into ThermoJet®Handpiece using Tip Tool.
3. Apply a small bead of solder paste along the land
pattern using a dispenser.
4. Position component onto lands using a HandiPik®or
tweezers.
5. Starting at MINIMUM,adjust pressure output (on power
supply) so hot air scorches a tissue from approximately
0.5cm (0.2”) away.
6. Direct hot air over component with tip at a distance of
2.5cm (1.0”) to predry solder paste.
7. When pre-drying is observed (paste has dull, flat
appearance), bring tip closer (0.5cm [0.2”]) and slowly
move tip along each row of leads to form proper solder
fillets.
8. Return ThermoJet®to its Tip & Tool Stand.
9. Clean, if required, and inspect.
A
A
B
C
Apply Solder
C
Adjust Pressure
B
Position Component
D
Pre-dry Paste
© 1997, 2001, 2012 PACE, Incorporated. Hand Soldering Manual for Rework/Repair & Assembly
(001) 910-693-8620 (USA) 877-882-7223
TJ-70
D
EE
Melt Joints