Cree XLamp MH Series User manual

SOLDERING & HANDLING
Cree LED / 4400 Silicon Drive / Durham, NC 27703 USA / +1.919.313.5330 / www.cree-led.com
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 1
XLamp®MH Family LED
INTRODUCTION
This application note applies to XLamp®MH Family LEDs, which
have order codes in the following format:
MHxxxx-xxxx-xxxxxxxxxxx
This application note explains how XLamp MH Family LEDs and
assemblies containing these LEDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp MH Family LEDs.
TABLE OF CONTENTS
Handling XLamp®MH Family LEDs .................................................2
Circuit Board Preparation & Layouts................................................5
Case Temperature (Ts) Measurement Point....................................6
Notes on Soldering XLamp®MH Family LEDs ................................7
Moisture Sensitivity ..........................................................................8
Low Temperature Operation.............................................................8
XLamp® MH Family LED Reow Soldering Characteristics............9
Chemicals & Conformal Coatings................................................. 10
Assembly Storage & Handling....................................................... 11
Tape and Reel................................................................................. 12
Packaging & Labels ....................................................................... 14

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 2
22
HANDLING XLAMP®MH FAMILY LEDS
Manual Handling
Use plastic, not metal, tweezers to grab XLamp MH Family LEDs at the sides of the substrate, i.e., at the base. Do not touch the optical
surface with tweezers. Do not touch the optical surface with ngers. Do not push on the optical surface.
Cree LED recommends the following at all times when handling XLamp MH Family LEDs or assemblies containing these LEDs:
• Avoid putting mechanical stress on the LED optical surface.
• Never touch the optical surface with ngers or sharp objects. The LED optical surface could become soiled or damaged, which would
affect the optical performance of the LED.
• Cree LED recommends always handling MH Family LEDs with appropriate ESD grounding.
• Cree LED recommends handling MH Family LEDs wearing clean, lint-free gloves.
Whenever possible, Cree LED recommends the use of a pick & place tool to remove XLamp MH Family LEDs from the factory tape and
reel packaging.
X
WRONG
P
CORRECT

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 3
Pick & Place Nozzle
The following diagrams show examples of pick & place tools to remove MH Family LEDs from the factory tape and reel packaging. Cree
LED recommends using a spring‑relieved pick and place nozzle with a spring constant of 0.519lb‑ft (0.704N‑m). For pick and place
nozzles coming into contact with silicone-covered LED components, Cree LED recommends nozzles be constructed of non-metallic
materials. Cree LED and several of Cree LED’s customers have had good success using nozzles fabricated from 95a urethane.
All dimensions in mm.
Measurement tolerance unless indicated otherwise:= ±0.2 mm
MHB-x
3.300
.300 .400
5.000
+.05
-0.1
5.000
+.05
-0.1
7.000
7.000
n1.000
.357
2.857
1.071
2.857
1.071
50.0
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X` .5
.XXX ` .25
.XX ` .75
.X ` 1.5
FOR SHEET METAL PARTS ONLY
.XX ` .25
.XXX ` .125
X` .5
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
w
1/116.000
A
12003239
COLLET
NBR
2/2/15 D. CRONIN
REVISONS
REV
DESCRIPTION
BY DATE APP'D
1.071
7.000
.357
1.071 Ø1.000
2.857
2.857
7.000
5.000
+.05
-0.1
5.000
+.05
-0.1
.300 .400
3.300
50.0

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 4
44
HANDLING XLAMP®MH FAMILY LEDS - CONTINUED
MHD-E & MHD-G
7.000
7.000 4.000
1.500
.500
n
1.000
.400
3.300
.300
.500
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO .
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X` .5
.XXX ` .25
.XX ` .75
.X ` 1.5
FOR SHEET METAL PARTS ONLY
.XX ` .25
.XXX ` .125
X` .5
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
w
1/116.000
A
12003242
COLLET
NBR
2/2/15 D. CRONIN
REVISONS
REV
DESCRIPTION
BY DATE APP'D
7.000
4.000
7.000
1.500
.500
.500
.300
.400
3.300
Ø1.000

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 5
55
CIRCUIT BOARD PREPARATION & LAYOUTS
Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before placing or
soldering XLamp MH Family LEDs onto the PCB. The diagrams below show the recommended PCB solder pad layouts for XLamp MH
Family LEDs. The diagrams are not to scale.
All dimensions in mm
Tolerance: +0.13 mm
MHB-A 9-V, 18-V & 36-V Class
MHB-B 9-V, 18-V & 36-V Class
MHD-E 9-V/18-V Class - 9-V Conguration
MHD-E 36-V Class
MHD-G 18-V/36-V Class - 18-V Conguration
Recommended Stencil Pattern
(Shaded Area is Open)
Recommended PCB Solder Pad
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
5.00
5.00
R2.26
3.02
0.73
.50
3.78
2.78
4.78
4.78
.50
4.78
.80
.50
.25
.80
.25
.97
4.78
.50
.50
2.78
4.78
4.78
1/116.000
B
2610-00032
OUTLINE DRAWING, 5050 XMLB
--
--
----
----
11/14/12D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
5.00
5.00
R2.26
3.02
0.73
.50
3.78
2.78
4.78
4.78
.50
4.78
.80
.50
.25
.80
.25
.97
4.78
.50
.50
2.78
4.78
4.78
1/116.000
B
2610-00032
OUTLINE DRAWING, 5050 XMLB
--
--
----
----
11/14/12D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED
Recommended Stencil Pattern
(Shaded Area Is Open)
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
7.00
7.00
0.75
±0.2 mm
.71
6.70
REF.
.35
±0.2 mm
6.70
REF.
6.70
.70
.50
6.70
4.30
2.95
.80
6.76
.70
.70
3.90
.70
6.70
6.76
6.70
1.24
1.29
.25
.70
.70
.25
1.29
1/115.000
B
2610-00051-OUTLINE
7x7 MHD-E 9V/36V
7x7 MHD-G 18V
11/12/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPEN)
PRIMARY ALTERNATIVE
ALL DIMENSIONS ARE ± .13mm UNLESS OTHERWISE NOTED
Recommended PCB Solder Pad
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
7.00
7.00
0.75
±0.2 mm
.71
6.70
REF.
.35
±0.2 mm
6.70
REF.
6.70
.70
.50
6.70
4.30
2.95
.80
6.76
.70
.70
3.90
.70
6.70
6.76
6.70
1.24
1.29
.25
.70
.70
.25
1.29
1/115.000
B
2610-00051-OUTLINE
7x7 MHD-E 9V/36V
7x7 MHD-G 18V
11/12/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPEN)
PRIMARY ALTERNATIVE
ALL DIMENSIONS ARE ± .13mm UNLESS OTHERWISE NOTED

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 6
CIRCUIT BOARD PREPARATION & LAYOUTS - CONTINUED
MHD-E 9-V/18-V Class - 18-V Conguration
MHD-G 18-V/36-V Class - 36-V Conguration
This conguration should not be used for 36‑V class MHD‑E LEDs.
CASE TEMPERATURE (TS) MEASUREMENT POINT
XLamp MH Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible.
This measurement point is shown in the picture below.
It is not required to use a solder footprint for the thermal pad that is larger than the XLamp MH Family LED itself. In testing, Cree LED has
found such a solder pad to have insignicant impact on the resulting Ts measurement.
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
7.00
7.00
0.75
±0.2mm
.71
6.70
REF.
6.70
REF.
.35
±0.2mm
3.13
.50
6.76
6.70
.70
1.29
1.24
.25
.70
.25
1.29
6.76 .50
3.13
.70
.70
.70
.70
6.70
.80
2.95
6.70
6.70
4.30
.50 .70
1/115.000
A
2610-00052-OUTLINE
7x7 MHD-E 18V
7x7 MHD-G 36V
11/17/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
ALL DIMENSIONS ARE .13mm UNLESS OTHERWISE NOTED
PRIMARY ALTERNATIVE
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTAINED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
X° ± .5 °
.XXX ± .25
.XX ± .75
.X ± 1.5
FOR SHEET METAL PARTS ONLY
.XX ± .25
.XXX ± .125
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN
MILLIMETERS AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SURFACE FINISH:
1.6
7.00
7.00
0.75
±0.2mm
.71
6.70
REF.
6.70
REF.
.35
±0.2mm
3.13
.50
6.76
6.70
.70
1.29
1.24
.25
.70
.25
1.29
6.76 .50
3.13
.70
.70
.70
.70
6.70
.80
2.95
6.70
6.70
4.30
.50 .70
1/115.000
A
2610-00052-OUTLINE
7x7 MHD-E 18V
7x7 MHD-G 36V
11/17/14D. CRONIN
REVISONS
REV DESCRIPTION BY DATE APP'D
RECOMMENDED PCB SOLDER PAD
RECOMMENDED STENCIL PATTERN
(HATCHED AREA IS OPENING)
ALL DIMENSIONS ARE .13mm UNLESS OTHERWISE NOTED
PRIMARY ALTERNATIVE
Recommended Stencil Pattern
(Shaded Area Is Open)
Recommended PCB Solder Pad

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 7
NOTES ON SOLDERING XLAMP®MH FAMILY LEDS
XLamp MH Family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or by placing the
PCB on a hotplate and following the reow soldering prole listed on page 9.
Do not wave solder XLamp MH Family LEDs. Do not hand solder XLamp MH Family LEDs.
Solder Paste Type
Cree LED strongly recommends using “no clean” solder paste with XLamp MH Family LEDs so that cleaning the PCB after reow soldering
is not required. Cree LED uses Kester®R276 solder paste internally.
Cree LED recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).
Solder Paste Thickness
The choice of solder and the application method will dictate the specic amount of solder. For the most consistent results, an automated
dispensing system or a solder stencil printer is recommended. Cree LED has seen positive results using solder thickness that results in a
4‑mil (102‑μm) bond line, i.e., the solder joint thickness after reow soldering.
P
CORRECT
P
CORRECT
X
WRONG
P
CORRECT
X
WRONG

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 8
After Soldering
After soldering, allow XLamp MH Family LEDs to return to room temperature before subsequent handling. Premature handling of the
device, especially around the optical surface, could result in damage to the LED.
Cree LED recommends verifying that soldered LEDs are not tilted, a situation called tombstoning. As a general guideline, an LED is tilted
when the part has a low edge touching the PCB surface and a high edge above the PCB surface.
Cree LED recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reow. After
shearing selected devices from the circuit board the solder should appear completely re‑owed (no solder grains evident). The solder
areas should show minimum evidence of voids on the backside of the package and the PCB.
Cleaning PCBs After Soldering
Cree LED recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB cleaning is
necessary, Cree LED recommends the use of isopropyl alcohol (IPA).
Do not use ultrasonic cleaning.
MOISTURE SENSITIVITY
Cree LED recommends keeping XLamp LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp MH Family LEDs may be stored as MSL 1 per JEDEC J‑STD‑033, meaning they have unlimited oor life
in conditions of ≤ 30ºC/85% relative humidity (RH). Regardless of the storage condition, Cree LED recommends sealing any unsoldered
LEDs in the original MBP.
LOW TEMPERATURE OPERATION
The minimum operating temperature of these XLamp LED components is ‑40°C. To maximize lifetime, Cree LED recommends avoiding
applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0°C.
NOTES ON SOLDERING XLAMP®MH FAMILY LEDS - CONTINUED

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 9
XLAMP®MH FAMILY LED REFLOW SOLDERING CHARACTERISTICS
IIn testing, Cree LED has found XLamp MH Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below.
As a general guideline, Cree LED recommends that users follow the recommended soldering prole provided by the manufacturer of the
solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Prole Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp)1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax)170 °C
Preheat: Time (tsmin to tsmax) 65-150 seconds
Time Maintained Above: Temperature (TL)217 °C
Time Maintained Above: Time (tL) 45-90 seconds
Peak/Classication Temperature (Tp) 235 ‑ 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 ‑ 6 °C/second
Time 25 °C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Note: While the high reow temperatures (above) have been approved, Cree LED’s best practice guideline for reow is to use as low a
temperature as possible during the reow soldering process for these LEDs.
IPC/JEDEC J-STD-020C
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tS
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 10
CHEMICALS & CONFORMAL COATINGS
Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current
list of recommended chemicals, conformal coatings and harmful chemicals consult Cree LED’s Chemical Compatibility Application Note.
The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree LED has developed for testing the compatibility of
chemicals and materials with LEDs. You should also consult your regional Cree LED Field Applications Engineer.
Recommended Chemicals
In testing, Cree LED has found the following chemicals to be safe to use with XLamp MH Family LEDs.
• Water
• Isopropyl alcohol (IPA)
Chemicals Tested as Harmful
In general, subject to the specics in Cree LED’s Chemical Compatibility Application Note, Cree LED has found certain chemicals to be
harmful to XLamp MH Family LEDs. Cree LED recommends not using these chemicals anywhere in an LED system containing XLamp MH
Family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs.
• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)
• Methyl acetate or ethyl acetate (i.e., nail polish remover)
• Cyanoacrylates (i.e., “Superglue”)
• Glycol ethers (including Radio Shack®Precision Electronics Cleaner - dipropylene glycol monomethyl ether)
• Formaldehyde or butadiene (including Ashland®PLIOBOND®adhesive)
Hermetically Sealing Luminaires
For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate in an environment
that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary measures are required. Hermetically
sealing LEDs in an enclosed space is not recommended.

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 11
ASSEMBLY STORAGE & HANDLING
Do not stack PCBs or assemblies containing XLamp MH Family LEDs so that anything rests on the LED optical surface. PCBs or assemblies
containing XLamp MH Family LEDs should be stacked in a way to allow at least 1-cm clearance above the LED optical surface.
Do not use bubble wrap directly on top of XLamp MH Family LEDs. Force from the bubble wrap can potentially damage the LED.
P
CORRECT
X
WRONG
P
CORRECT

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 12
TAPE AND REEL
All Cree LED carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm [in].
MHB-x
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
X° ± .5 °
.XXX ± .010
.XX ± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX ± .01
.XXX ± .005
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTANED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
SURFACE FINISH:
63
330
+.25
-.75
12.4
+1.0
-.5
MEASURED AT EDGE
16.4
+0.2
.0
MEASURED AT HUB
12.4
+.2
.0
MEASURED AT HUB
±.213.1
1.9±.4
±.421
60° 60°
1/10.500
A
2400-00009
REEL, 13" X 12MM, 3 PIECE SNAP
-
ANTI-STATIC HIPS
----
----
09/29/09D. CRONIN
2400-00009
INDEX QTY ITEM COMMENTS
1 1 2400-00009-CORE
2 2 2400-00009-REEL
REVISONS
REV DESCRIPTION BY DATE APP'D
CATHODE SIDE
ANODE SIDE
CATHODE SIDE
ANODE SIDE

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 13
TAPE AND REEL - CONTINUED
MHD-E & MHD-G
SIZE
TITLE
OF
REV.
SHEET
C
DRAWING NO.
DATE
DATE
DATE
CHECK
FINAL PROTECTIVE FINISH
MATERIAL
APPROVED
DRAWN BY
THIRD ANGLE PROJECTION
X° ± .5 °
.XXX ± .010
.XX ± .03
.X ± .06
FOR SHEET METAL PARTS ONLY
.XX ± .01
.XXX ± .005
X° ± .5 °
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
AND AFTER FINISH.
TOLERANCE UNLESS SPECIFIED:
SCALE
A
B
C
D
123456
6 5 4 3 2 1
A
B
C
D
Phone [phone]
Fax [phone]
4600 Silicon Drive
Durham, N.C 27703
UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT
MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY
CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT
CONTANED WITHIN ARE THE PROPRIETARY AND
CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION
OF CREE INC.
NOTICE
SURFACE FINISH:
63
330
+.25
-.75
12.4
+1.0
-.5
MEASURED AT EDGE
16.4
+0.2
.0
MEASURED AT HUB
12.4
+.2
.0
MEASURED AT HUB
±.213.1
1.9±.4
±.421
60° 60°
1/10.500
A
2400-00009
REEL, 13" X 12MM, 3 PIECE SNAP
-
ANTI-STATIC HIPS
----
----
09/29/09D. CRONIN
2400-00009
INDEX QTY ITEM COMMENTS
1 1 2400-00009-CORE
2 2 2400-00009-REEL
REVISONS
REV DESCRIPTION BY DATE APP'D
.30
[.012]
T
7.60 [.299]
1.70 [.067]
Ko
3.0°
7.60
[.299]
Bo
2.00 [.079]
P2
4.00 [.157]
Po
14.25
[.561]
E2
Do
1.50+.10
-.00 .0591+.0039 -.0000[ ]
3.0°
16.00 [.630]
NOMINAL
16.30 [.642]
MAX
W
1.75 [.069]
E1
7.50 [.295]F
1.50 [.059]
D1
MIN
12.00 [.472]
P
CATHODE SIDE
ANODE SIDE
1000 LEDs per reel

XLAMP®MH FAMILY LED SOLDERING & HANDLING
© 2014-2021 Cree LED. The information in this document is subject to change without notice. Cree®and the Cree logo are registered trademarks, and
the Cree LED logo is a trademark, of Cree, Inc. XLamp®is a registered trademark of Cree LED. Other trademarks, product and company names are
the property of their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association. This document is
provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets available at
www.cree-led.com.
CLD-AP193
REV 4 14
PACKAGING & LABELS
The diagrams below show the packaging and labels Cree LED uses to ship XLamp MH Family LEDs. XLamp MH Family LEDs are shipped
in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag.
Label with Cree Bin
Code, Qty, Lot # Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Dessicant
(inside bag)
Humidity Indicator
Card (inside bag)
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
Patent Label
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel