Cree Xlamp xr series User manual

Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

CLD-AP16 REV 9B

SOLDERING & HANDLING

Cree®XLamp®XR Family LEDs

WWW.CREE.COM/XLAMP

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

TABLE OF CONTENTS

Handling XLamp®XR Family LEDs .........................2

Circuit Board Preparation & Layouts ......................3

Case Temperature (Ts) Measurement Point.............3

XLamp® XR Family LED Reow Soldering

Characteristics ...................................................6

Moisture Sensitivity ............................................7

Low Temperature Operation .................................8

Chemicals & Conformal Coatings ..........................9

Assembly Storage & Handling............................. 10

Tape and Reel .................................................. 11

Packaging and Labels........................................ 12

INTRODUCTION

This application note applies to XLamp®XR family

LEDs, which have order codes in the following fomat.

XRxxxx-xx-xxxx-xxxxxx

This application note explains how XLamp XR family

LEDs and assemblies containing these LEDs should be

handled during manufacturing. Please read the entire

document to understand how to properly handle

XLamp XR family LEDs.

the Cree logo and XLamp®are registered trademarks of Cree, Inc. This document is provided for informational purposes only and

is not a warranty or a specication. For product specications, please see the data sheets available at www.cree.com. For warranty

information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of

their respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

HANDLING XLAMP®XR FAMILY LEDS

Cree recommends the following at all times when handling XLamp XR family LEDs or assemblies containing these LEDs:

• Avoid putting mechanical stress on the LED lens.

• Never touch the optical surface with ngers or sharp objects. The LED lens surface could be soiled or damaged,

which would affect the optical performance of the LED.

• Cree recommends always handling XR family LEDs with appropriate ESD grounding.

• Cree recommends handling XR family LEDs wearing clean, lint-free gloves.

Whenever possible, Cree recommends the use of a pick & place tool to remove XLamp XR family LEDs from the factory

tape & reel packaging.

Pick & Place Nozzle

For pick and place nozzles coming into contact with silicone-covered LED components, Cree recommends nozzles be

constructed of non-metallic materials. Cree and several of Cree’s customers have had good success using nozzles

fabricated from Teon or from 90d urethane.

Cree recommends the pickup tool shown below for XLamp XR family LEDs.

Manual Handling

Use tweezers to grab XLamp XR family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens

with ngers. Do not push on the lens.

Scale = none

All dimensions in mm

General tolerances = ± 0.1

WRONG

CORRECT

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

CIRCUIT BOARD PREPARATION & LAYOUTS

Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specications before

placing or soldering XLamp XR family LEDs onto the PCB.

The diagram below shows the recommended PCB solder pad layout for XLamp XR family LEDs.

CASE TEMPERATURE (TS) MEASUREMENT POINT

XLamp XR family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad

as possible. This measurement point is shown in the pictures below.

It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XR family LED itself. In

testing, Cree has found such a solder pad to have insignicant impact on the resulting Ts measurement.

7.0 mm

5.6 mm 0.70 mm

8.4 mm

6.46 mm

Recommended PC Board Solder Pad

Recommended solder pad

for XLamp XR family LEDs

6.36

8.30

0.60 0.80

0.80

0.60

5.50

7.10

RECOMMENDED STENCIL PATTERN 7090

(HATCHED AREA IS OPENING)

Recommended stencil pattern

for XLamp XR family LEDs

(hatched area is opening)

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

NOTES ON SOLDERING XLAMP®XR FAMILY LEDS

XLamp XR family LEDs are designed to be reow soldered to a PCB. Reow soldering may be done by a reow oven or

by placing the PCB on a hotplate and following the reow soldering prole listed on the previous page.

Do not wave solder XLamp XR family LEDs. Do not hand solder XLamp XR family LEDs.

Solder Paste Type

Cree strongly recommends using “no clean” solder paste with XLamp XR family LEDs so that cleaning the PCB after

soldering is not required. Cree uses Kester®R276 solder paste internally.

Cree recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver).

WRONG

CORRECT

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

Solder Paste Thickness

The choice of solder and the application method will dictate the specic amount of solder. For the most consistent

results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results

using solder thickness that results in a 3-mil (75-μm) bond line, i.e., the solder joint thickness after reow soldering.

After Soldering

After soldering, allow XLamp XR family LEDs to return to room temperature before subsequent handling. Premature

handling of the device, especially around the lens, could result in damage to the LED.

Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after

reow. After shearing selected devices from the circuit board the solder should appear completely re-owed (no solder

grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB.

Cleaning PCBs After Soldering

Cree recommends using “no clean” solder paste so that ux cleaning is not necessary after reow soldering. If PCB

cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA).

CORRECT

WRONG

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

XLAMP®XR FAMILY LED REFLOW SOLDERING CHARACTERISTICS

In testing, Cree has found XLamp XR family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed

below. As a general guideline, Cree recommends that users follow the recommended soldering prole provided by the

manufacturer of solder paste used.

Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.

Prole Feature Lead-Based Solder Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max.

Preheat: Temperature Min (Tsmin) 100 °C 150 °C

Preheat: Temperature Max (Tsmax) 150 °C 200 °C

Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds

Time Maintained Above: Temperature (TL) 183 °C 217 °C

Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds

Peak/Classication Temperature (Tp) 215 °C 260 °C

Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds

Ramp-Down Rate 6 °C/second max. 6 °C/second max.

Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

MOISTURE SENSITIVITY

XLamp XR family LEDs are shipped in sealed, moisture-barrier bags (MBB) designed for long shelf life. Each MBB is

backlled with inert nitrogen gas after being evacuated. As a result, the visual appearance of pressure in the MBB will

vary from one bag to another. Visual appearance of the MBB is not an indicator of humidity in the MBB.

Humidity inside the MBB can be checked immediately after opening the MBB by inspecting the humidity indicator card.

The pictures below provide a guide on how to read the humidity indicator card immediately after opening the MBB.

If XLamp XR family LEDs are exposed to moist environments after opening the MBB packaging but before soldering,

damage to the LED may occur during the soldering operation.

The following derating table denes the maximum exposure time (in days) for XLamp XR family LEDs in the listed

humidity and temperature conditions. LEDs with exposure time longer than the time specied below must be baked

according to the baking conditions listed below.

Temperature Maximum Percent Relative Humidity

30% 40% 50% 60% 70% 80% 90%

30 ºC 9 5 4 3 1 1 1

25 ºC 12 7 5 4 2 1 1

20 ºC 17 9 7 6 2 2 1

XLamp LEDs stored at < 30 ºC and < 30% RH will not require baking before reow soldering. One method to verify

these conditions is to keep the humidity indicator card with the LEDs. If the 30% RH circle on the humidity indicator card

is blue, the LEDs do not need to be baked. If the 30% RH circle is pink, XLamp LEDs should be baked using the baking

procedure listed on the next page.

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

MOISTURE SENSITIVITY (CONTINUED)

Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree

also recommends returning any unused LEDS to the resealable moisture-barrier bag and closing the bag immediately

after use.

Baking Conditions

It is not necessary to bake all XLamp XR family LEDs. Only the LEDs that meet all of the following criteria must be baked:

1. LEDs that have been removed from the original MBB packaging.

2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.

3. LED that have not been soldered.

Baking Procedure

Baking the LEDs will remove moisture from the package and reset the exposure time, as dened in the Moisture

Sensitivity section above. Cree recommends baking any LEDs that may have been exposed to excessive moisture.

1. Remove LEDs or reel of LEDs from MBB packaging.

2. LEDs may be baked on the original reels.

3. Bake LEDs or reel of LEDs at 80 ºC for 24 hours.

4. Reow solder the parts within one hour of baking or immediately store the parts in a container with < 20% RH

(relative humidity).

IMPORTANT: Do not bake reels of LEDs at temperatures higher than 80 ºC.

Storage Conditions

XLamp XR family LEDs that have been unsealed from the original packaging but not soldered should be stored in one

of the following ways:

• Store the parts in a rigid metal container with tight tting lid. Place fresh dessicant and a RH indicator in the

container to verify < 20% RH.

• Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains < 20% RH.

• For short-term storage only: LEDs can be resealed in the original MBB bag soon after opening. Fresh dessicant may

be needed. Use the included humidity indicator card to verify < 20% RH.

If an environment of < 20% RH is not available for storage, XLamp XR family LEDs should be baked (described above)

one hour before reow soldering.

LOW TEMPERATURE OPERATION

The minimum operating temperature of these XLamp LED components is -40 °C. To maximize lifetime, Cree recommends

avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C.

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

CHEMICALS & CONFORMAL COATINGS

Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a

complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical

Compatibility Application Note. The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has

developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree

Field Applications Engineer.

Recommended Chemicals

In testing, Cree has found the following chemicals to be safe to use with XLamp XR family LEDS.

• Water

• Isopropyl alcohol (IPA)

Chemicals Tested as Harmful

In general, subject to the specics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals

to be harmful to XLamp XR family LEDs. Cree recommends not using these chemicals anywhere in an LED system

containing XLamp XR family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs.

• Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene)

• Methyl acetate or ethyl acetate (i.e., nail polish remover)

• Cyanoacrylates (i.e., “Superglue”)

• Glycol ethers (including Radio Shack®Precision Electronics Cleaner - dipropylene glycol monomethyl ether)

• Formaldehyde or butadiene (including Ashland®PLIOBOND®adhesive)

Hermetically Sealing Luminaires

For proper LED operation and to avoid potential lumen depreciation and/or color shift, LEDs of all types must operate

in an environment that contains oxygen. Simply allowing the LEDs to ventilate to air is sufcient; no extraordinary

measures are required. Hermetically sealing LEDs in an enclosed space is not recommended.

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

1010

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

ASSEMBLY STORAGE & HANDLING

Do not stack PCBs or assemblies containing XLamp XR family LEDs so that anything rests on the XLamp LED lens. Force

applied to the XLamp LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XR family

LEDs should be stacked in a way to allow at least 2 cm clearance above the LED lens.

Do not use bubble wrap directly on top of XLamp XR family LEDs. Force from the bubble wrap can potentially damage

the LED.

WRONG

CORRECT

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

1111

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

TAPE AND REEL

All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.

330.2 mm

12.0±.1

5.5±.1

13.5

(MIN)

16.0+.3

-.0

1.75±.10

4.0±.1

EMPTY POCKETS

WITH TAPE

60 (MIN)

EMPTY POCKETS

WITH TAPE

5-10

EMPTY

POCKTES WITH

UNSEALED

COVER TAPE

1.5 ± .1

ANODE SIDE

CATHODE SIDE

LOADED POCKETS

USER FEED DIRECTION

START

12.0±.1

5.5±.1

13.5

(MIN)

16.0+.3

-.0

1.75±.10

4.0±.1

EMPTY POCKETS

WITH TAPE

60 (MIN)

EMPTY POCKETS

WITH TAPE

5-10

EMPTY

POCKTES WITH

UNSEALED

COVER TAPE

1.5 ± .1

ANODE SIDE

CATHODE SIDE

LOADED POCKETS

USER FEED DIRECTION

START

XLamp®XR FamiLy soLdeRing & handLing

of Cree, Inc.

1212

trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specication. For product specications, please see the data sheets

available at www.cree.com. For warranty information, please contact Cree Sales at [email protected]. Other trademarks, product and company names are the property of their

respective owners and do not imply specic product and/or vendor endorsement, sponsorship or association.

PACKAGING AND LABELS