Alinx AX7021 User manual

ZYNQ7000 FPGA
Development Board
AX7021
User Manual

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Version Record
Version
Date
Release By
Description
Rev 1.0
2019-03-27
Rachel Zhou
First Release
Rev 1.1
2020-09-21
Rachel Zhou
Correct the corresponding pins of B34_L15_N/P.

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Table of Contents
Version Record............................................................................................................... 2
Part 1: FPGA Development Board Introduction..................................................... 6
Part 2: AC7021 Core Board....................................................................................... 8
2.1 Introduction........................................................................................................ 8
2.2 ZYQN Chip...................................................................................................... 10
2.3 DDR3 DRAM...................................................................................................13
2.4 QSPI Flash...................................................................................................... 16
2.5 eMMC Flash.................................................................................................... 17
2.6 Clock configuration.........................................................................................19
2.7 USB to serial port........................................................................................... 20
2.8 LED................................................................................................................... 22
2.9 Reset button.................................................................................................... 23
2.10 JTAGE Interface...........................................................................................24
2.11 DIP switch configuration............................................................................. 25
2.12 Power............................................................................................................. 25
2.13 Structure diagram.........................................................................................28
2.14 Connector pin definition.............................................................................. 28
Part 3: Carrier Board................................................................................................. 35
3.1 Introduction......................................................................................................35
3.2 Gigabit Ethernet interface............................................................................. 36
3.3 USB2.0 Host interface...................................................................................40
3.4 HDMI Output Interface...................................................................................42
3.5 USB to serial port........................................................................................... 44
3.6 SD card slot..................................................................................................... 45
3.7 JTAG Interface................................................................................................46
3.8 LED................................................................................................................... 47
3.9 User Button......................................................................................................48
3.10 Extension Port.............................................................................................. 49

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3.11 Power Supply................................................................................................52
3.12 Carrier Board Structure diagram............................................................... 54

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This ZYNQ7000 FPGA development platform adopts the core board +
carrier board mode, which is convenient for users to use the core board for
secondary development. The core board uses XILINX's Zynq7000 SOC chip
solution, which combines dual-core ARM Cortex-A9 and FPGA programmable
logic on a single chip using ARM+FPGA SOC technology. In addition, the core
board contains 2 pieces of 1GB high-speed DDR3 SDRAM chip, 1 piece 32GB
eMMC memory chip and 1 piece 256Mb QSPI FLASH chip.
In the design of the carrier board, the user has extended a wealth of
peripheral interfaces, such as 5-port Gigabit Ethernet interfaces, 4-port USB2.0
HOST interfaces, 1-port HDMI output interface, Uart serial port communication
interface, SD card holder, 40-pin carrier header, etc. It meets the requirements
of users for various Ethernet high-speed data exchange, data storage, video
transmission processing and industrial control. It is a "professional" ZYNQ
development platform. For high-speed Ethernet data transmission and
exchange, the pre-validation and post-application of data processing is possible.
This product is very suitable for students, engineers and other groups engaged
in ZYNQ development.

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Part 1: FPGA Development Board Introduction
Here, a brief introduction to the AX7021 ZYNQ FPGA development
platform.
The entire structure of the development board, the core board + carrier
board mode design. A high-speed inter-board connector is used between the
core board and the carrier board.
The core board is mainly composed of the minimum system of ZYNQ7020
+ 2 DDR3 + eMMC + QSPI FLASH. It undertakes the high-speed data
processing and storage function of the ZYNQ system. The data width between
the ZYNQ7020 and the two DDR3s is 32 bits, and the two DDR3 capacities up
to 1GB. The 32GB eMMC FLASH memory chip and 256Mb QSPI FLASH are
used to statically store the ZYNQ operating system, file system and user data.
Users can select different startup modes through the DIP switch on the core
board. The ZYNQ7020 uses Xilinx's Zynq7000 series of chips, model number
XC7Z020-2CLG484I. The ZYNQ7020 chip can be divided into processor
system part Processor System (PS) and programmable logic part
Programmable Logic (PL).
The carrier board expands the rich peripheral interface for the core board,
including 5 Gigabit Ethernet interfaces, 4-port USB2.0 HOST interfaces, 1-port
HDMI output interface, 1-port SD Card interface, 1-port UART USB serial port
interface, 1-port SD Card interface, 2-port 40-pin carrier headers and some
button LEDs.
Figure 1-1-1 is the block diagram of the FPGA development board AX7021:

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Figure 1-1-1: The block diagram of AX7021
The interfaces and features included in the development board.
ZYNQ7000 Core Board
It consists of XC7Z020+1GB DDR3+32GB eMMC FLASH + 256Mb QSPI
FLASH. In addition, two crystal oscillators provide clocks, one is 33.3333MHz
for PS system and the other is 50MHz for PL logic.
Gigabit Ethernet Interface
5 channels 10/100M/1000M Ethernet RJ45 interface for Ethernet data
exchange with computers or other network devices. The network interface chip
uses Micrel's KSZ9031 industrial grade GPHY chip, one Ethernet connection to
the PS end of the ZYNQ chip, and four Ethernet connections to the PL end of the
ZYNQ chip.
HDMI Output Display
One HDMI output interface uses SIL9134 HDMI encoding chip of Silion
Image Corporation, which supports up to 1080P@60Hz output and supports 3D
output.

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USB Interface
1 JTAG debug interface, using MINI USB interface, users can debug and
download ZYNQ system through USB cable and onboard JTAG circuit.
LED Light
9 LEDs, include 6 on the core board and 3 on the extension board. There
are 1 power indicator, 1 DONE configuration indicator, 2 user indicators and 2
serial port transceiver indicators on the core board. There are 1 power indicator
and 2 user indicators on the extension board.
Button
3 buttons, 1 reset button on the core board, and 2 user buttons on the
extension board.
Part 2: AC7021 Core Board
2.1 Introduction
The AC7021 (core board model, the same below) core board is an FPGA
development board based on the Zynq chip XC7Z020-2CLG484I of the XILINX
ZYNQ7000 series. The ZYNQ chip's PS system integrates two ARM CortexTM-
A9 processors, AMBA® interconnects, internal memory, external memory
interfaces and peripherals. The ZYNQ FPGA chip contains a wide range of
programmable logic cells, DSP and internal RAM.
The core board uses two SK Hynix DDR3 chips (H5TQ4G63AFR-PBI),
each with a 4Gbit DDR capacity; two DDR chips form a 32-bit data bus width,
and the read and write data clock frequency between ZYNQ FPGA and DDR3
is up to 533Mhz; such a configuration can meet the system's high bandwidth
data processing needs
In order to connect to the carrier board, the four board-to-board connectors
of the core board extend the USB interface of the PS side, the Gigabit Ethernet
interface, the SD card interface and other remaining MIO ports. As well as
almost all IO ports (198) of BANK13, BANK33, BAN34 and BANK35 on the PL
side, the level of IO of BANK33 and BANK34 can be modified by replacing the

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LDO chip on the core board to meet the requirements of users with different
level interfaces. For users who need a lot of IOs, this core board will be a good
choice. Moreover, the IOs connection part, the routing between the ZYNQ
FPGA chip and the interface is equal length and differential processing. The
core board size is only 2.36 inch* 2.36 inch, which is very suitable for
secondary development.
Figure 2-2-1: AC7021Core board Front View

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Figure 2-2-2:AC7021 core board rear view
2.2 ZYQN Chip
The development board uses Xilinx's Zynq7000 series chip, model
XC7Z020-2CLG484I. The chip's PS system integrates two ARM CortexTM-A9
processors, AMBA® interconnects, internal memory, external memory
interfaces and peripherals. These peripherals mainly include USB bus interface,
Ethernet interface, SD/SDIO interface, I2C bus interface, CAN bus interface,
UART interface, GPIO, etc. The PS can operate independently and start up at
power up or reset. Figure 2-2-3 detailed the
Overall Block Diagram of the
ZYNQ7000 Chip.

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Figure 2-2-3: Overall Block Diagram of the ZYNQ7000 Chip
The main parameters of the PS system part are as follows:
ARM dual-core CortexA9-based application processor, ARM-v7
architecture, up to 1GHz
32KB level 1 instruction and data cache per CPU, 512KB level 2 cache 2
CPU shares
On-chip boot ROM and 256KB on-chip RAM
External storage interface, support 16/32 bit DDR2, DDR3 interface
Two Gigabit NIC support: divergent-aggregate DMA, GMII, RGMII,
SGMII interface
Two USB2.0 OTG interfaces, each supporting up to 12 nodes
Two CAN2.0B bus interfaces
Two SD card, SDIO, MMC compatible controllers
2 SPIs, 2 UARTs, 2 I2C interfaces
4 groups of 32bit GPIO, 54 (32+22) as PS system IO, 64 connected to
PL
High bandwidth connection within PS and PS to PL

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The main parameters of the PL logic part are as follows:
LogicCells: 85K
Look-up-tables (LUTs):53,200
Flip-flops:106,400
18x25MACCs:220;
BlockRAM:4.9Mb
Two AD converters for on-chip voltage, temperature sensing and up
to 17 external differential input channels, 1MBPS
XC7Z020-2CLG484I chip speed grade is -2, industrial grade, package is
BGA484, pin pitch is 0.024 inch, the specific chip model definition of ZYNQ7000
series is shown in Figure 2-2-4
Figure 2-2-4: The Specific Chip Model Definition of ZYNQ7000 Series

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Figure 2-2-5: TheXC7Z020 chip used on the Core Board
2.3 DDR3 DRAM
The AC7021 core board is equipped with two SK Hynix DDR3 SDRAM
chips (1GB total), model H5TQ4G63AFR-PBI. The bus width of DDR3 SDRAM
is 32 bits in total. DDR3 SDRAM has a maximum operating speed of 533MHz
(data rate 1066Mbps). The DDR3 memory system is directly connected to the
memory interface of the BANK 502 of the ZYNQ Processing System (PS). The
specific configuration of DDR3 SDRAM is shown in Table 2-3-1
Table 2-3-1: DDR3 SDRAM Configuration
The hardware design of DDR3 requires strict consideration of signal
integrity. We have fully considered the matching resistor/terminal resistance,
trace impedance control, and trace length control in circuit design and PCB
design to ensure high-speed and stable operation of DDR3.
Bit Number
Chip Model
Capacity
Factory
U5,U6
H5TQ4G63AFR-PBI
256M x 16bit
SK Hynix

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The hardware connection of DDR3 DRAM is shown in Figure 2-3-1:
Figure 2-3-1: The Schematic part of DDR3 DRAM
Figure 2-3-2: DDR3 DRAM on the Core Board

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DDR3 DRAM Pin Assignment
Signal Name
ZYNQ Pin Name
Pin Number
DDR3_DQS0_P
PS_DDR_DQS_P0_502
C2
DDR3_DQS0_N
PS_DDR_DQS_N0_502
D2
DDR3_DQS1_P
PS_DDR_DQS_P1_502
H2
DDR3_DQS1_N
PS_DDR_DQS_N1_502
J2
DDR3_DQS2_P
PS_DDR_DQS_P2_502
N2
DDR3_DQS2_N
PS_DDR_DQS_N2_502
P2
DDR3_DQS3_P
PS_DDR_DQS_P3_502
V2
DDR3_DQS4_N
PS_DDR_DQS_N3_502
W2
DDR3_D0
PS_DDR_DQ0_502
D1
DDR3_D1
PS_DDR_DQ1_502
C3
DDR3_D2
PS_DDR_DQ2_502
B2
DDR3_D3
PS_DDR_DQ3_502
D3
DDR3_D4
PS_DDR_DQ4_502
E3
DDR3_D5
PS_DDR_DQ5_502
E1
DDR3_D6
PS_DDR_DQ6_502
F2
DDR3_D7
PS_DDR_DQ7_502
F1
DDR3_D8
PS_DDR_DQ8_502
G2
DDR3_D9
PS_DDR_DQ9_502
G1
DDR3_D10
PS_DDR_DQ10_502
L1
DDR3_D11
PS_DDR_DQ11_502
L2
DDR3_D12
PS_DDR_DQ12_502
L3
DDR3_D13
PS_DDR_DQ13_502
K1
DDR3_D14
PS_DDR_DQ14_502
J1
DDR3_D15
PS_DDR_DQ15_502
K3
DDR3_D16
PS_DDR_DQ16_502
M1
DDR3_D17
PS_DDR_DQ17_502
T3
DDR3_D18
PS_DDR_DQ18_502
N3
DDR3_D19
PS_DDR_DQ19_502
T1
DDR3_D20
PS_DDR_DQ20_502
R3
DDR3_D21
PS_DDR_DQ21_502
T2
DDR3_D22
PS_DDR_DQ22_502
M2
DDR3_D23
PS_DDR_DQ23_502
R1
DDR3_D24
PS_DDR_DQ24_502
AA3
DDR3_D25
PS_DDR_DQ25_502
U1
DDR3_D26
PS_DDR_DQ26_502
AA1
DDR3_D27
PS_DDR_DQ27_502
U2
DDR3_D28
PS_DDR_DQ28_502
W1
DDR3_D29
PS_DDR_DQ29_502
Y3
DDR3_D30
PS_DDR_DQ30_502
W3
DDR3_D31
PS_DDR_DQ31_502
Y1
DDR3_DM0
PS_DDR_DM0_502
B1
DDR3_DM1
PS_DDR_DM1_502
H3
DDR3_DM2
PS_DDR_DM2_502
P1
DDR3_DM3
PS_DDR_DM3_502
AA2
DDR3_A0
PS_DDR_A0_502
M4
DDR3_A1
PS_DDR_A1_502
M5
DDR3_A2
PS_DDR_A2_502
K4
DDR3_A3
PS_DDR_A3_502
L4
DDR3_A4
PS_DDR_A4_502
K6
DDR3_A5
PS_DDR_A5_502
K5
DDR3_A6
PS_DDR_A6_502
J7
DDR3_A7
PS_DDR_A7_502
J6
DDR3_A8
PS_DDR_A8_502
J5

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DDR3_A9
PS_DDR_A9_502
H5
DDR3_A10
PS_DDR_A10_502
J3
DDR3_A11
PS_DDR_A11_502
G5
DDR3_A12
PS_DDR_A12_502
H4
DDR3_A13
PS_DDR_A13_502
F4
DDR3_A14
PS_DDR_A14_502
G4
DDR3_BA0
PS_DDR_BA0_502
L7
DDR3_BA1
PS_DDR_BA1_502
L6
DDR3_BA2
PS_DDR_BA2_502
M6
DDR3_S0
PS_DDR_CS_B_502
P6
DDR3_RAS
PS_DDR_RAS_B_502
R5
DDR3_CAS
PS_DDR_CAS_B_502
P3
DDR3_WE
PS_DDR_WE_B_502
R4
DDR3_ODT
PS_DDR_ODT_502
P5
DDR3_RESET
PS_DDR_DRST_B_502
F3
DDR3_CLK0_P
PS_DDR_CKP_502
N4
DDR3_CLK0_N
PS_DDR_CKN_502
N5
DDR3_CKE
PS_DDR_CKE_502
V3
Table 2-3-2: DDR3 DRAM Pin Assignment
2.4 QSPI Flash
The core board is equipped with a 256MBit Quad-SPI FLASH chip, model
W25Q256FVEI, which uses the 3.3V CMOS voltage standard. Due to the non-
volatile nature of QSPI FLASH, it can be used as a boot device for the system
to store the boot image of the system. These images mainly include FPGA bit
files, ARM application code, and other user data files. The specific models and
related parameters of QSPI FLASH are shown in Table 2-4-1.
Position
Model
Capacity
Factory
U7
W25Q256FVEI
32M Byte
Winbond
Table 2-4-1: QSPI FLASH Specification
QSPI FLASH is connected to the GPIO port of the BANK500 in the PS
section of the ZYNQ chip. In the system design, the GPIO port functions of
these PS ports need to be configured as the QSPI FLASH interface. Figure 2-4-
1 shows the QSPI Flash in the schematic.

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Figure 2-4-1: QSPI Flash in the schematic
Figure 2-4-2: QSPI Flash on the Core Board
Pin Assignment of QSPI Flash
Signal Name
ZYNQ Pin Name
Pin Number
QSPI_SCK
PS_MIO6_500
A4
QSPI_CS
PS_MIO1_500
A1
QSPI_D0
PS_MIO2_500
A2
QSPI_D1
PS_MIO3_500
F6
QSPI_D2
PS_MIO4_500
E4
QSPI_D3
PS_MIO5_500
A3
Table 2-4-2: Pin Assignment of QSPI FLASH
2.5 eMMC Flash
The core board is equipped with a large capacity 32GB eMMC FLASH chip,
model THGBMFG8C2LBAIL, which supports the JEDEC e-MMC V5.0 standard
HS-MMC interface with level support of 1.8V or 3.3V. The data width of the
eMMC FLASH and ZYNQ connections is 4 bits. Due to the large capacity and

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non-volatile nature of eMMC FLASH, it can be used as a large-capacity storage
device for the ZYNQ system, such as ARM-based applications, system files,
and other user data files. The specific models and related parameters of eMMC
FLASH are shown in Table 2-5-1:
Position
Model
Capacity
Factory
U33
THGBMFG8C2LBAIL
32G Byte
TOSHIBA
Table 2-5-1: eMMC FLASH Specification
eMMC FLASH is connected to the GPIO port of the BANK501 in the PS
section of the ZYNQ chip. In the system design, the GPIO port functions of
these PS ports need to be configured as the SD interface. Figure 2-5-1 shows
the eMMC Flash in the schematic.
Figure 2-5-1: eMMC Flash in the Schematic
Figure 2-5-2: eMMC Flash on the Core Board

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Pin Assignment of eMMC Flash
Signal Name
ZYNQ Pin Name
Pin Number
MMC_CCLK
PS_MIO48_501
D11
MMC_CMD
PS_MIO47_501
B10
MMC_D0
PS_MIO46_501
D12
MMC_D1
PS_MIO49_501
C14
MMC_D2
PS_MIO50_501
D13
MMC_D3
PS_MIO51_501
C10
Table 2-5-2: Pin Assignment of eMMC FLASH
2.6 Clock configuration
The AC7021 core board provides active clocks for the PS system and the
PL logic sections, respectively, so that the PS system and the PL logic can
work independently.
PS system clock source
The ZYNQ chip provides a 33.333 MHz clock input to the PS section
through the X1 crystal on the development board. The input of the clock is
connected to the pins of PS_CLK_500 of the BANK500 of the ZYNQ chip. The
schematic diagram is shown in Figure 2-6-1:
Figure 2-6-1: Active crystal oscillator to the PS section
Figure 2-6-2: 33.333Mhz active Crystal Oscillator on the Core Board

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PS Clock pin assignment:
Signal Name
Pin
PS_CLK_500
F7
Table 2-6-1: PS Clock pin assignment
PL system clock source
The AC7021 core board provides a single-ended 50MHz PL system clock
source with 3.3V power supply. The crystal output is connected to the global
clock (MRCC) of the FPGA BANK13, which can be used to drive user logic
within the FPGA. The schematic diagram of the clock source is shown in Figure
2-6-3:
Figure 2-6-3: PL system clock source
Figure 2-6-4: 50Mhz active crystal oscillator on the Core Board
PL Clock pin assignment:
Signal Name
Pin
PL_GCLK
Y9
Table 2-6-2: PL Clock pin assignment
2.7 USB to serial port
For the AC7021 core board to work and debug separately, we have a Uart
to USB interface for the core board. Used for separate power supply and
debugging of the core board. The conversion chip uses the USB-UART chip of
Silicon Labs CP2102GM. The USB interface uses the MINI USB interface. It
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