Cree LQ6 Series User manual

SOLDERING & HANDLING
Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered
trademark and the Cree logo is a trademark of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: [phone]
WWW.CREE.COM/XLAMP
CLD-CTAP001 REV 28
Cree®High‑Brightness LED
Soldering & Handling
Features
The purpose of this document is to provide customers and users with a clear understanding about the ways to use our LEDs
appropriately.
Description
Generally, LEDs can be used the same way as other general-purpose semiconductors. When using Cree LEDs, the following precautions
must be taken to protect the LED.
P2 AND P4 LEDS
1. Cleaning
• Don’tuseunspeciedchemicalliquidstocleantheLED;thechemicalcouldharmtheLED.Whenwashingisnecessary,please
wipetheLEDwithalcoholatnormalroomtemperatureanddryatnormalroomtemperaturefor15minutesbeforeuse.
• TheinuenceofultrasoniccleaningontheLEDsdependsonfactorssuchasultrasonicpowerandthewaytheLEDsaremounted.
Ultrasoniccleaningshouldbepre‑qualiedtoensurethiswillnotcausedamagetotheLEDs.
2. Forming
• Whenformingleads,theleadsshouldbebentatapointatleast3mmfromthebaseofthepackage.
• Don’tformtheleadsduringoraftersoldering.Ifformingisrequired,thismustbedonebeforesoldering.
• Avoid any bending stress to the LED package during leads forming.
• When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LEDs.
3. Storage
• TheshelflifeoftheLEDsisoneyearat20~30°Cand<60%RH.IftheLEDsareunpacked,theLEDsneedtobestoredinasealed
container with desiccant (silica gel).
• The lead may be affected by environments which contain corrosive substances. Please avoid conditions which may cause
theLEDstocorrode,tarnishordiscolor.Thecorrosionordiscolorationmaycausedifcultyduringsolderingoperations.Itis
recommended that the LEDs be used as soon as possible.
4. Soldering
• Aminimalcathodepadareaof0.18×0.18inchessquaredisrecommendedforP2LEDsand0.18×0.18inchessquared×2for
P4 LEDs.
• SolderingLEDsatnotlessthan3mmfromthebaseofthepackageandbelowthetie‑barisrecommended.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
2
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• TheLEDsolderingspecicationisshownbelow(suitableforbothleadedsolder&lead‑freesolder).
Manual Soldering Solder Dipping
Soldering iron 35Wmax Preheat 110ºCmax
Temperature 300ºCmax
Preheat time 60secondsmax
Solder-bath temperature 260ºCMax
Soldering time 3secondsmax Dipping time 5secondsmax
Position Notlessthan3mmfromthebaseofthepackage. Position Notlessthan3mmfromthebaseofthepackage.
• Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.
• The recommended wave soldering is as below:
Differentlead‑freesolderrequiresdifferentsolderconditions.Pleasecontactusfordetails.
• Do not apply any stress to the LED package, particularly when heated.
• It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by the LEDs.
• TheLEDsmustnotbereusedoncetheyhavebeenextractedfromPCB.
• AftersolderingtheLEDs,thepackageshouldbeprotectedfrommechanicalshockorvibrationuntiltheLEDshavereached40ºCor
below.
• Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching and cutting of
the LED leads.
• When it is necessary to clam the LEDs during soldering, it is important to ensure no mechanical stress is exerted on the LEDs.
• Cut the LED lead at normal room temperature. Lead cutting at high temperature may cause failure of the LEDs.
10 20 30 40 50 60 70 80 90 100 110 120
0
30
150
100
300
250
200
50
Temperature ºC
Times (sec)
laminar wave
Fluxing
Preheat

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
3
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
5. Electrostatic Discharge and Surge Current
• Electrostatic discharge (ESD) or electrical overstress (EOS) may damage LEDs.
• Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling the LEDs.
• Alldevices,equipmentandmachinerymustbeproperlygrounded.
• ItisrecommendedtoperformelectricalteststoscreenoutESDfailuresatnalinspection.
• It is important to eliminate the possibility of electrical overstress during circuitry design.
6. Heat Management
• HeatmanagementofLEDsmustbetakenintoconsiderationduringthedesignstageofanLEDapplication.
• HightemperaturemaycausefailureoftheLEDs.Thedrivingcurrentshouldbede‑ratedappropriatelybyreferringtothede‑rating
curveincludedineachproductspecication.
7. Other Notes
• Make sure the reverse voltage will not exceed the absolute maximum rating.
• The power of high-brightness LEDs is very strong and may injure human eyes. Precautions must be taken such as avoiding looking
directly into lit LEDs.
SMD LEDS
1. Cleaning
• Don’tuseunspeciedchemicalliquidstocleananSMDLED;thechemicalcouldharmtheSMDLED.Whenwashingisnecessary,
please wipe the LED with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
• TheinuenceofultrasoniccleaningontheSMDLEDdependsonfactorssuchasultrasonicpowerandthewaytheSMDLEDsare
mounted.Ultrasoniccleaningshouldbepre‑qualiedtoensurethiswillnotdamagetheSMDLEDs.
• Donotusealcoholand/orultrasoniccleaningtocleanUHD1110seriesproducts.
2. Moisture‑Proof Packing
• To prevent moisture absorption into SMD LEDs during transportation and storage, the LEDs are packed in a moisture-barrier bag.
Desiccants and a humidity indicator are packed together with the LEDs as a secondary protection.
• A humidity-indicator card indicates the humidity level.
3. Storage
• Do not open the sealed bag before the products are ready to use.
• TheshelflifeofLEDsstoredintheoriginalsealedbagat≤40ºCand≤90%RHis12months.Bakingisrequirediftheshelflifehas
expired.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
4
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• Afteropeningthesealed bag, the SMD LEDs mustbestoredunder the condition≤30ºCand≤60%RH.Under these conditions,
theSMDLEDsmustbesubjectedtoreowwithintheMSLleveloortimeafterbagopening.Bakingisrequiredwhenthistimeis
exceeded.
• Forbaking,placetheSMDLEDsintheovenat75ºC,+/‑5ºCwithamaximumtemperatureof80ºCandrelativehumidity≤10%RHfor
24 hours.
• Takethematerialoutofthepackagingbagbeforebaking.Donotopentheovendoorfrequentlyduringthebakingprocess.
• Pleaserefertotheproductspecicationsformoredetails.
•
4. Soldering
• Reowsolderingshouldnotbedonemorethantwotimes(accordingtomodel’sMSLrequirements).
a. Manual soldering by soldering iron
• Since the temperature of manual soldering is not stable, manual soldering by soldering iron is not recommended.
• Ifmanualsolderingisnecessary,theuseofasolderingironoflessthan25Wisrecommended,andthetemperatureoftheironmust
bekeptbelow315ºC,withsolderingtimewithin2seconds.
• The resin of the SMD LED should not contact the tip of the soldering iron.
• No mechanical stress should be exerted on the resin portion of the SMD LED during soldering.
• HandlingoftheSMDLEDshouldbedonewhenthepackagehasbeencooleddownbelow40ºC.ThisistopreventLEDfailuresdue
to thermal-mechanical stress during handling.
b. Reow Soldering
• The temperature prole (1) is as below (for SMD LED CLMXB‑FKA/CLV1A‑FKB/CLV1L‑FKB/CLV6B‑FKB/CLV6D‑FKB/CLX6B‑FKC/
CLX6C‑FKB/CLX6D‑FKB/CLX6E‑FKC/CLX6F‑FKC/CLQ6A‑TKW):
   
 
   
 
6/11
Use all SMD besides LP6-NPP1-01-N1
Solder = Sn63-Pb37
Solder = Lead-free
           
          
         
         
         
          
         
         
          
         
                  
                  
          
          
Only use LP6-NPP1-01-N1
Solder = Low Lead-free
           
          
         
         
           
                   
          
                       



 
 
 
Melting point
Pre-heat Reow Cooling
Time
Temperature

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
5
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
Solder
Average ramp-up rate 4ºC/secondmax.
Preheat temperature 150ºC~200ºC
Preheat time 120 seconds max.
Ramp-down rate 6ºC/secondmax.
Peak temperature 250ºCmax.
Timewithin5ºCofpeaktemperature 10 seconds max.
Durationabove217ºC 60 seconds max.
• Thetemperatureprole(2)isasbelow(forSMDLEDCLMVB‑DKA/CLMVB‑FKA/CLMVC‑FKA/CLMVC‑FKC/CLMUC‑FKA/CLMUD‑FKA/
CLP6C‑FKB/CLV1S‑FKB/CLV6A‑FKB/CLX6A‑FKB/CLVBA‑FKA/CLY6C‑FKC/CLY6D‑FKC/CLYBA‑FKA/CLYBB‑FKA and other products
not listed herein):
Solder
Average ramp-up rate 4ºC/secondmax.
Preheat temperature 150ºC~200ºC
Preheat time 120 seconds max.
Ramp-down rate 6ºC/secondmax.
Peak temperature 235ºCmax.
Timewithin5ºCofpeaktemperature 10 seconds max.
Durationabove217ºC 45 seconds max.
Melting point
Temperature
Time
Pre-heat Cooling
Reow
Soak

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
6
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• Thetemperatureprole(3)isasbelow(forUHD1110‑FKAproducts):
Solder
Average ramp-up rate 4ºC/secondmax.
Preheat time 120 seconds max.
Soak temperature 155ºC‑175ºC
Soak time 60-100 seconds max.
Peak temperature 235ºC‑245ºCmax.
Durationabove217ºC 60 seconds max.
Ramp-down rate 6ºC/secondmax.
The units in the graphs below are in millimeters (mm).
LM1 series recommended solder-pad design for heat dissipation:
Melting point
Temperature
Time
Pre-heat Cooling
Reow
Soak
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.51.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.4
4.5
1.5 1.5
2.6
1.1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.51.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.4
4.5
1.5 1.5
2.6
1.1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
7
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LM4 & LM2 series recommended solder-pad design for heat dissipation:
LV1 & LA1 & LVB series recommended solder-pad design for heat dissipation:
LP6 series recommended solder-pad design for heat dissipation:
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.51.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.4
4.5
1.5 1.5
2.6
1.1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.51.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.4
4.5
1.5 1.5
2.6
1.1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.51.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.4
4.5
1.5 1.5
2.6
1.1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:
5/13
The unit is millimeter (mm) in the graphs below.
LM1 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
2.6
4.5
1.51.5
LM4 & LM2 series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.4
4.5
1.5 1.5
2.6
1.1
LV1 & LA1 & LVB series recommended solder pad design for heat dissipation:
9.5
1.5
2.5
2.5
0.5
7.0
0.4
0.5
3.3
1.65
2.6
1.1
4.5
1.5 1.5
LP6 series recommended solder pad design for heat dissipation:
Note
Metal area at 1, 2, 3 should not
be less than 40 mm2each for
sufcientheatdissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
8
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LU6 series recommended solder-pad design for heat dissipation:
Small‑top SMD LM3 series recommended solder-pad design for heat dissipation:
Mini side 0.8‑mm SMD LS8 series recommended solder-pad design for heat dissipation:
Note
Metal area at 1, 2, 3 should not
be less than 16 mm2each for
sufcientheatdissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.
6/13
1.6
0.5
2.0
4
5
3
2
8.4
6
A
1
6.6
2.0
2.4
3.0
LU6 series recommended solder pad design for heat dissipation:
4.7
1.65 1.4
0.8
0.35
9.4
9.5
4.0
1.8
4
5
3
2
61
Small Top SMD LM3 series recommended solder pad design for heat dissipation:
Mini side 0.8mm SMD LS8 series recommended solder pad design for heat dissipation:
LA6 series recommended solder pad design for heat dissipation:
Note:
Metal area at 1, 2, 3 should not
be less than 40mm2 each for
sufficient heat dissipation.
1.3
4.0
9.3
1.3
2.2
1.55
4.4
1.0
0.9
1.4
3.8
1.0
Note:
Metal area at 1, 2, 3 should not
be less than 16mm2 each for
sufficient heat dissipation.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
9
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LA6 series recommended solder-pad design for heat dissipation:
LB6 series recommended solder-pad design for heat dissipation:
7/13
0.8
0.7
0.8
2.9
0.3
4.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation:
1.5 1.4 1.5
5.2
0.4
7.4
1.8 3.8
LT6 series recommended solder pad design for heat dissipation:
2.7
0.65
2.6
0.7
0.85
1.0
0.3
LMV series recommended solder pad design for heat dissipation:
7/13
0.8
0.7
0.8
2.9
0.3
4.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation:
1.5 1.4 1.5
5.2
0.4
7.4
1.8 3.8
LT6 series recommended solder pad design for heat dissipation:
2.7
0.65
2.6
0.7
0.85
1.0
0.3
LMV series recommended solder pad design for heat dissipation:

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
10
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LT6 series recommended solder-pad design for heat dissipation:
LMV series recommended solder-pad design for heat dissipation:
7/13
0.8
0.7
0.8
2.9
0.3
4.5
1.5 1.5
LB6 series recommended solder pad design for heat dissipation :
1.5 1.4 1.5
5.2
0.4
7.4
1.8 3.8
LT6 series recommended solder pad design for heat dissipation :
LMV series recommended solder pad design for heat dissipation :
2.7
0.65
2.6
0.7
0.851.0
0.3
8/13
0.8
0.8
1.9
2.5
1 1
LMU series recommended solder pad design for heat dissipation:
0.8
0.8
1.9
2.5
1 1
LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7
0.475
8.2
2.7 2.8
LX6 series recommended solder pad design for heat dissipation:

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
11
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LMU series recommended solder-pad design for heat dissipation:
LMX series recommended solder pad design for heat dissipation:
8/13
0.8
0.8
1.9
2.5
1 1
LMU series recommended solder pad design for heat dissipation:
0.8
0.8
1.9
2.5
1 1
LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7
0.475
8.2
2.7 2.8
LX6 series recommended solder pad design for heat dissipation:
9/15
LMX series recommended solder pad design for heat dissipation:
7.5
0.5
7.0
0.3
3.3
0.9 1.5
1.9
0.8
LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7
0.475
8.2
2.7 2.8
LX6 series recommended solder pad design for heat dissipation:

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
12
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LV6 series recommended solder-pad design for heat dissipation:
LX6 series recommended solder-pad design for heat dissipation:
8/13
0.8
0.8
1.9
2.5
1 1
LMU series recommended solder pad design for heat dissipation:
0.8
0.8
1.9
2.5
1 1
LV6 series recommended solder pad design for heat dissipation:
1.7
5.65
1.3
1.7
0.475
8.2
2.7 2.8
LX6 series recommended solder pad design for heat dissipation:
9/13
LY6 series recommended solder pad design for heat dissipation:
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.
Reflow soldering should not be done more than one time.
No stress should be exerted on the package during soldering.
The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.
1.6
1.8
5.0
2.8
0.35
0.7 0.7
0.7

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
13
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
LY6 series recommended solder-pad design for heat dissipation:
LS6 series recommended solder pad design for heat dissipation:
10/15
LY6 series recommended solder pad design for heat dissipation:
LS6 series recommended solder pad design for heat dissipation:
1010 series recommended solder pad design for heat dissipation:
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
14
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
UHD1110‑FKA recommended solder pad design for heat dissipation:
LQ6 series recommended solder pad design for heat dissipation:
Assembly notes:
• Modicationofan SMD LED is notrecommendedaftersoldering. If modication cannotbeavoided,the modications mustbe
pre‑qualiedtoavoiddamagingtheSMDLED.
• Reowsolderingshouldnotbedonemorethantwotimes(accordingtomodel’sMSLrequirements).
• No stress should be exerted on the package during soldering.
• Thepackagemaybeaffectedbyenvironments&assemblieswhichcontaincorrosivesubstance.Pleaseavoidconditionswhichmay
cause the LEDs to corrode tarnish or discolor.
• ThePCBshouldnotbewrappedaftersolderingtoallownaturalcoolingdownto40°.
10/15
LY6 series recommended solder pad design for heat dissipation:
LS6 series recommended solder pad design for heat dissipation:
1010 series recommended solder pad design for heat dissipation:
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications
must be pre-qualified to avoid damaging SMD LED.
11/15
Modification of an SMD LED is not recommended after soldering. If modification cannot be avoided, the modifications must
be pre-qualified to avoid damaging SMD LED.
Reflow soldering should not be done more than one time.
No stress should be exerted on the package during soldering.
The PCB should not be wrapped after soldering to allow natural cooling down to 40ºC.
5. Important Notes (Small Top & Mini side 0.8mmSMD product)
The packaging sizes of these SMD products are very small and the resin is still soft after solidification. Users are required
to handle with care, never touch the resin surface of SMD products.
To avoid damaging the product’s surface and interior device, it is recommended to choose special nozzle to pick up SMD
products during the process of SMT production. If handling is necessary, take special care when picking up these
products. The following two methods are necessary:
Fig. 1a: For Small Top SMD. Fig. 1b: For Mini side 0.8mm SMD.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
15
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
5. Important Notes (Small‑top, Mini‑side 0.8‑mm SMD Products and UHD1110‑FKA)
• ThepackagingsizesoftheseSMDproductsareverysmallandtheresinisstillsoftaftersolidication.Usersarerequiredtohandle
with care. Never touch the resin surface of SMD products.
• To avoid damaging the product’s surface and interior device, it is recommended to choose a special nozzle to pick up the SMD
products during the process of SMT production. If handling is necessary, take special care when picking up these products. The
following two methods are necessary:
   Fig.1a:ForSmallTopSMD   Fig.1b:ForMini‑slde0.8mmSMD
ForUHD1110‑FKA,touchthepackagebyhandisnotsuggestedandavoidscratchondevicesurface:
Fig.1c:ForUHD1110‑FKA
• SMT nozzle
For example: CLA1B
For silicone-covered SMD LEDs, it is recommended to use non-metallic nozzles. Cree and several of Cree’s customers have had
successusingnozzlesfabricatedfromTeonorfrom90durethane.
   
 
   
 
9/9
                                    
                         
                        
                                   
        
          Ø         Ø      
                                 
6. Electrostatic Discharge and Surge current
                        
                                        
                       
                           
                            
7. Heat Management
                                         
                             
              

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
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HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• Items to notice before opening the bag:
1. Checktheshelflife(countingfromtheFQCstampingdateontheproductlabel).Iftheshelflifeisover12months,re‑bakingis
required.
2. Record the lot number of the SMD product to aid investigation.
3. Avoid external damage to the packaging bag after product is taken out of the box. For example, many SMD products are stacked
withoutbox;re‑packingwithbubbleplasticbagforprotectionisrecommended.
4. Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to re-pack
convenientlyforproductnottobeusedwithintheMSLleveloortime.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
17
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• Items to notice after opening the bag:
1. Checkthecolorofthehumidity‑indicationcard(30%RH)atthetimeofopeningthevacuum‑sealedbag.Ifthecolorisslight
greenorblue,bakingisrequiredbeforeuse.
2. Record the date and time on the reel.
3. TheproductshouldbeusedwithintheMSLleveloortime.
4. IfSMDproductscan’tbeusedwithintheMSLleveloortime,theyshouldbere‑packedinavacuum‑sealedbag.Beforeattempting
touseagain,bakingisrequired.
• Bakingisrequiredwhenthefollowingconditionsoccur:
1. Shelf life has expired (over 12 months).
2. The vacuum-sealed bag has an air leak.
3. Thehumidity‑indicationcardhascolorchangeat30%RHatthetimeofopeningthevacuum‑sealedbag.
4. The vacuum-sealed bag has been opened, but the steps listed under “Notice items after opening the bag” (above) have not been
followed.
Color change
Normal
14/15
3. The product should be used within MSL level floor time.
4. If SMD products can’t be used up within MSL level floor time, they should be re-packed by vacuum-sealed bag. Before
attempting to use again, baking is required.
Baking is required when the following conditions occur
1. Shelf life is expired (Over 12 months).
2. The vacuum-sealed bag has an air leak.
3. The humidity-indication card has color change at 30%RH, at the time of opening the vacuum-sealed bag.
4. The vacuum-sealed bag is opened, but the steps listed under “Notice items after opening the bag”(above) have not
been followed.
Baking method
1. The SMD LED should not be baked within the packaging bag. The baking condition is 80ºC±5ºC (Max) for 24 hours.
The oven door should not be opened frequently during baking process.
2. Refer to the photo below for a baking model that can help avoid reel deformation.
3. Re-baked products should cool down to 40 ºC in the oven before being removed for use.
6. Electrostatic Discharge and Electrical Overstress
Electrostatic discharge (ESD) or electrical overstress (EOS) may damage SMD LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of SMD LED.
For small reel
For large reel

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
18
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
• Baking method:
1. TheSMDLEDshouldnotbebakedwithinthepackagingbag.Thebakingconditionis75ºC,+/‑5ºCwithamaximumtemperature
of80ºCfor24hours.Theovendoorshouldnotbeopenedfrequentlyduringthebakingprocess.
2. Refer to the photo below for a baking model that can help avoid reel deformation.
For small reels For large reels
3. Bakedproductsshouldcooldownto40ºCintheovenbeforebeingremovedforuse.
6. Electrostatic Discharge and Electrical Overstress
• Electrostatic discharge (ESD) or electrical overstress (EOS) may damage an SMD LED.
• Precautions such as ESD wrist straps, ESD shoe straps or antistatic gloves must be worn whenever handling SMD LEDs.
• Alldevices,equipmentandmachinerymustbeproperlygrounded.
• ItisrecommendedtoperformelectricaltesttoscreenoutESDfailuresatnalinspection.
• It is important to eliminate the possibility of electrical overstress during circuit design.
7. Heat Management
HeatmanagementofSMDLEDsmustbetakenintoconsiderationduringthedesignstageofSMDLEDapplications.Thecurrentshould
bede‑ratedappropriatelybyreferringtothede‑ratingcurveincludedineachproductspecication.

Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®is a registered trademark and the Cree logo is a trademark of Cree, Inc.
19
HIGH‑BRIGHTNESS LED SOLDERING & HANDLING
8. SMD Screen Product Moisture Sensitivity Level
Product Family P/N Moisture Sensitivity Level
SMD LEDs
CLA1 series
5a
CLA2 series
CLM1 series
CLM2 series
CLM3 series
CLM4 series
CLMU series
CLMV series
CLMX series
CLP6 series
CLS8 series
CLU6 series
CLV1 series
CLV6 series
CLVB series
CLX6 series
CLY6series
CLYBseries
CLQ6series
UHD1110series
The information in this document is subject to change without notice.